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EECatalog Tech Videos
At the recent DESIGN West 2013 conference in San Jose, Microchip unleashed a "broad expansion" of new wireless products targeting the M2M, connected cloud, and intelligent devices spaces. There's also a new PIC32 digital audio development kit for Bluetooth audio streaming, plus 802.15.4 modules for ZigBee.
Editor Chris A. Ciufo got a chance to chat briefly with Tyler Smith, Product Marketing Manager, Wireless Products Division of Microchip. Click on the video to hear this on-target 3-minute interview.
EnerChip smart solid state batteries are made using semiconductor process on silicon wafers. EnerChips can be used in bare die form and co-packaged with other integrated circuits in a single package. This Embedded Energy configuration means energy storage can be integrated into devices where legacy batteries and super capacitors cannot be used.
This video demonstrates Microchip's new XLP 8-bit Development Board.
http://mchp.us/FOc11F PIC16F1512/13 MCUs combine eXtreme low-power technology and high digital & analog peripheral integration for use in a wide variety of applications.
Save More Power, Space, Money, and Time with Microchip! Explore Microchip's wide range of innovative 8-bit products with eXtreme Low Power consumption and unique peripherals, which enable you to reduce your board space, component count, and time-to-market.
Editor Chris Ciufo spent time with Microchip software manager Joe Drzewiecki at the Spring DESIGN West show (formerly known as ESC). Microchip launched their new MPLAB X compiler strategy that now goes across all Microchip MCUs. It also adds a new license strategy, optimizations that compile 35 percent faster on 32-bit devices (or save 35 percent on code size). There's also a "totally free" version of the MPLAB X compiler. Check out the 3 minute video.
Featured White Papers
Unique Solid State Rechargeable Batteries are being used by Medical, Industrial Control, Consumer Electronics, Appliance and Smart Energy companies to power their new innovative electronic product designs. These batteries have capabilities that are superior to legacy energy storage devices such as coin cell batteries and supercapacitors. This white paper identifies the product requirements and technical specifications that are addressed by Cymbet EnerChip smart rechargeable solid state batteries.
The quality and flexibility of digital signage is a function of the graphics processing capability of the media players that drive the displays. To deliver a high level of graphics performance, media players tend to incorporate discrete graphics processing units, although some players use the graphics engine on the CPU platform. Discover how 3rd Generation Intel® Core™ processors provide retailers improved graphics performance and anonymous video analytics to deliver audience messaging at lower cost and watt.
This white paper describes several aspects of power related to the Xilinx® 28 nm 7 series FPGAs, including the TSMC 28 nm high-k metal gate (HKMG), high performance, low power (28 nm HPL or 28 HPL) process choice. The power benefits afforded by the 28 HPL process and its usefulness across Xilinx's full product offerings is described as well as the architectural innovations and features for power reduction across the dimensions of static power, dynamic power, and I/O power.
Conceived and designed for high-volume markets, Artix-7 FPGAs deliver the lowest power consumption and lowest cost in the 7 series. The family shares the same building blocks as the Kintex-7 and Virtex-7 FPGA architecture on the same 28 nm High Performance, Low Power (HPL) process, but transistor-level design choices enable the Artix-7 family to offer much lower power consumption while still meeting the performance needs of the target applications.
Five Trends that Affect IC Designers, ODMs, and OEMs—and What They Can Do About Them.
Human interfaces that use capacitive sensors for proximity or touch control are changing the way we interact with electronics.
Power consumption is becoming an increasingly important variable when it comes to calculating OPEX and carbon footprint for telecom infrastructure projects.