EECatalog Tech Videos
“Pervasive adoption, ever more powerful new networks, spectacular handheld devices and close to two million mobile applications have helped to create an explosion in the mobile
After two years of double-digit growth, the world market for electro-mechanical and solid-state relays contracted by $125 million, or 3.6 percent, to approximately $3.35 billion
Global Semiconductor Sales Grow at Fastest Rate in Almost Two Years on Sequential Monthly Basis, Top $24 Billion for First Time in 2012
Industry projects slight increase in global sales in 2012, followed by more robust growth in 2013 and 2014 The Semiconductor Industry Association (SIA), representing U.S. leadership
Las Vegas, NV January 7 -10, 2014
Santa Clara, CA January 28-31, 2014
Nuremburg, Germany February 25-27, 2014
Barcelona, Spain February 24-27, 2014
San Jose, CA USA March 31 – April 3, 2014
Santa Clara, CA May 7-8, 2014
Birmingham, NEC April 8th - 10th, 2014
EECatalog Tech Videos
Bluetooth Low Energy (LE, or BLE, or Smart) is all about sending and receiving data just like any other Bluetooth device, but doing so using much less power. It's ideally suited for M2M applications where a device wakes up, transmits or receives data, then goes back to sleep. The Bluetooth SIG specifies myriad application profiles from healthcare ("Blood Pressure Profile") to Sports and Fitness. At the recent DESIGN West 2013 conference, editor-in-chief Chris A. Ciufo got the lowdown on Laird's new BL600 Bluetooth LE Smart modules.
At the recent DESIGN West 2013 conference in San Jose, Microchip unleashed a "broad expansion" of new wireless products targeting the M2M, connected cloud, and intelligent devices spaces. There's also a new PIC32 digital audio development kit for Bluetooth audio streaming, plus 802.15.4 modules for ZigBee.
Editor Chris A. Ciufo got a chance to chat briefly with Tyler Smith, Product Marketing Manager, Wireless Products Division of Microchip. Click on the video to hear this on-target 3-minute interview.
EnerChip smart solid state batteries are made using semiconductor process on silicon wafers. EnerChips can be used in bare die form and co-packaged with other integrated circuits in a single package. This Embedded Energy configuration means energy storage can be integrated into devices where legacy batteries and super capacitors cannot be used.
Save More Power, Space, Money, and Time with Microchip! Explore Microchip's wide range of innovative 8-bit products with eXtreme Low Power consumption and unique peripherals, which enable you to reduce your board space, component count, and time-to-market.
http://mchp.us/FOc11F PIC16F1512/13 MCUs combine eXtreme low-power technology and high digital & analog peripheral integration for use in a wide variety of applications.
This video demonstrates Microchip's new XLP 8-bit Development Board.
Featured White Papers
An FPGA Approach to Implementing Time-Critical Functions in Multi-Sensor Mobile Designs.
The quality and flexibility of digital signage is a function of the graphics processing capability of the media players that drive the displays. To deliver a high level of graphics performance, media players tend to incorporate discrete graphics processing units, although some players use the graphics engine on the CPU platform. Discover how 3rd Generation Intel® Core™ processors provide retailers improved graphics performance and anonymous video analytics to deliver audience messaging at lower cost and watt.
This white paper describes several aspects of power related to the Xilinx® 28 nm 7 series FPGAs, including the TSMC 28 nm high-k metal gate (HKMG), high performance, low power (28 nm HPL or 28 HPL) process choice. The power benefits afforded by the 28 HPL process and its usefulness across Xilinx's full product offerings is described as well as the architectural innovations and features for power reduction across the dimensions of static power, dynamic power, and I/O power.
Conceived and designed for high-volume markets, Artix-7 FPGAs deliver the lowest power consumption and lowest cost in the 7 series. The family shares the same building blocks as the Kintex-7 and Virtex-7 FPGA architecture on the same 28 nm High Performance, Low Power (HPL) process, but transistor-level design choices enable the Artix-7 family to offer much lower power consumption while still meeting the performance needs of the target applications.
Five Trends that Affect IC Designers, ODMs, and OEMs—and What They Can Do About Them.
Human interfaces that use capacitive sensors for proximity or touch control are changing the way we interact with electronics.
Power consumption is becoming an increasingly important variable when it comes to calculating OPEX and carbon footprint for telecom infrastructure projects.