EECatalog Tech Videos
Sensor hubs that offload tasks from power-hungry application processors and let mobile devices like smartphones and tablets run longer on a single battery charge are reaping gargantuan
Sales Increase By 18 Percent Year-To-Year In Americas Region The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design,
Intel Retained the No. 1 Position for the 22nd Year in a Row Total worldwide semiconductor revenue reached $315 billion in 2013, up 5 percent from 2012, according to Gartner, Inc.
EECatalog Tech Videos
Bluetooth Low Energy (LE, or BLE, or Smart) is all about sending and receiving data just like any other Bluetooth device, but doing so using much less power. It's ideally suited for M2M applications where a device wakes up, transmits or receives data, then goes back to sleep. The Bluetooth SIG specifies myriad application profiles from healthcare ("Blood Pressure Profile") to Sports and Fitness. At the recent DESIGN West 2013 conference, editor-in-chief Chris A. Ciufo got the lowdown on Laird's new BL600 Bluetooth LE Smart modules.
At the recent DESIGN West 2013 conference in San Jose, Microchip unleashed a "broad expansion" of new wireless products targeting the M2M, connected cloud, and intelligent devices spaces. There's also a new PIC32 digital audio development kit for Bluetooth audio streaming, plus 802.15.4 modules for ZigBee.
Editor Chris A. Ciufo got a chance to chat briefly with Tyler Smith, Product Marketing Manager, Wireless Products Division of Microchip. Click on the video to hear this on-target 3-minute interview.
EnerChip smart solid state batteries are made using semiconductor process on silicon wafers. EnerChips can be used in bare die form and co-packaged with other integrated circuits in a single package. This Embedded Energy configuration means energy storage can be integrated into devices where legacy batteries and super capacitors cannot be used.
Save More Power, Space, Money, and Time with Microchip! Explore Microchip's wide range of innovative 8-bit products with eXtreme Low Power consumption and unique peripherals, which enable you to reduce your board space, component count, and time-to-market.
http://mchp.us/FOc11F PIC16F1512/13 MCUs combine eXtreme low-power technology and high digital & analog peripheral integration for use in a wide variety of applications.
This video demonstrates Microchip's new XLP 8-bit Development Board.
Featured White Papers
Windows CE (a.k.a. Windows Embedded Compact), originally released in 1996, can be an attractive alternative to the full Windows operating system offering system designers the ability to control power, size, and cost in a new product. For example, the runtime license cost of the CE operating system alone can save as much as $150 over the license cost for standard Windows. Additionally, the componentized nature of CE is recognized as more stable and reliable than the Windows for desktop machines.
The Intel Atom processor C2000 product family (codenamed Rangeley) offers a range of highly energy efficient 64-bit system-on-a-chips (SoCs) in two-to-eight core designs, offering significant I/O and acceleration integration for the communications market. Using Intel’s industry-leading 22-nanometer (nm) 3-D Tri-Gate transistor technology, the new processors deliver significantly greater performance and power efficiency than the previous generations of Intel Atom processors. Lanner's R&D department recently conducted benchmark testing on several of our products based on the Intel Atom processor C2000 product family in order to provide a precise comparison on the security performance between the current and previous generations of Intel® Atom™ processors.
An FPGA Approach to Implementing Time-Critical Functions in Multi-Sensor Mobile Designs.
The quality and flexibility of digital signage is a function of the graphics processing capability of the media players that drive the displays. To deliver a high level of graphics performance, media players tend to incorporate discrete graphics processing units, although some players use the graphics engine on the CPU platform. Discover how 3rd Generation Intel® Core™ processors provide retailers improved graphics performance and anonymous video analytics to deliver audience messaging at lower cost and watt.
This white paper describes several aspects of power related to the Xilinx® 28 nm 7 series FPGAs, including the TSMC 28 nm high-k metal gate (HKMG), high performance, low power (28 nm HPL or 28 HPL) process choice. The power benefits afforded by the 28 HPL process and its usefulness across Xilinx's full product offerings is described as well as the architectural innovations and features for power reduction across the dimensions of static power, dynamic power, and I/O power.
Conceived and designed for high-volume markets, Artix-7 FPGAs deliver the lowest power consumption and lowest cost in the 7 series. The family shares the same building blocks as the Kintex-7 and Virtex-7 FPGA architecture on the same 28 nm High Performance, Low Power (HPL) process, but transistor-level design choices enable the Artix-7 family to offer much lower power consumption while still meeting the performance needs of the target applications.
Five Trends that Affect IC Designers, ODMs, and OEMs—and What They Can Do About Them.