Elmos Semiconductor AG: Silicon Microstructures Extends its Low-Pressure Product Line with the SM9D and SM9G Families
SMI (Silicon Microstructures, Inc.’s flagship low-pressure SM95 sensor die is now available as an uncompensated, unamplified device in an SO16 package. This SMT package allows high-volume assembly of SMI’s proven SM95 sensors for those customers who do not require the fully compensated, digital solutions SMI currently offers. The new devices have an operating temperature range from -40 C to +85 C.
A variety of packages are available, including dual vertical ports for the smallest footprint, dual horizontal ports for the lowest profile and a single vertical port for gauge applications. The dual-port versions allow pressure to be applied from the backside of the die to protect electrical components from harsh environments. Three pressure ranges are available, ranging from 10 cm H2O (0.15 psi) to 100 cm H2O (1,5 psi). All devices have unamplified, uncompensated millivolt outputs. Devices are typically powered at 3.3 or 5 volts.
FEA-assisted electro-mechanical design along with advanced MEMS processing in SMI’s captive fabrication facility contribute to simplifying integration of these devices into myriad medical and industrial applications.