ADLINK Revolutionizes Rugged Small Form Factor (SFF) Computing with the CoreModule® 730 SBC

First to market from a leading multi-national supplier with the ground-breaking SUMIT™ interface in 90×96 mm ISM™ form factor, CoreModule® 730 ushers in a new ‘Atomic’ Era of Rugged Computing

ADLINK Technology Inc., a leading global provider of trusted embedded products, today announced the biggest architectural innovation in small form factor (SFF) rugged single board computers (SBCs) since the PC/104 bus was invented by Ampro in 1992. The new CoreModule® 730 embedded processor, based on the ultra low power Intel® Atom™ Z510 and Z530 processors at 1.1 and 1.6 GHz, respectively, sets a new efficiency standard for tiny rugged computers by using the new SUMIT™ expansion interface. It reinvents stackable and mezzanine architectures by packing an enormous amount of data bandwidth and easy connectivity – including multiple PCI Express™ lanes, USB 2.0 interfaces, LPC bus, I2C bus, and SPI bus – into a fraction of the space previously occupied by only the 33 MHz parallel PCI-104 bus.

With PCI Express, Gigabit Ethernet, USB 2.0 ports, and a Compact Flash socket, the CoreModule 730 features the lowest-power Intel chipset available, the US15W “Poulsbo” chipset, to round out the “Menlow” platform at only 5 W for 1.1 GHz. Conductive cooled solutions are also easy to implement for small sealed boxes with no internal air flow. This announcement means that system OEMs in military, avionics, transportation, data logging, portable computing and other rugged markets can add a state-of-the-art Intel® Architecture controller to their systems without a custom carrier board design.

“While many board manufacturers require their system OEM customers to design custom carriers or use two-board solutions in order to take advantage of their Atom-based computer-on-module (COM) products, ADLINK offers CoreModule 730 as a true single-board solution, ready to run with simple cables,” said Colin McCracken, product director for ADLINK’s embedded computer division. “By departing from space-inefficient pin-in-socket expansion with parallel buses, CoreModule 730 will bring stackable SBCs into new application areas. Even after the merger, ADLINK continues to build upon Ampro’s reputation and tradition of pioneering modular small form factor technologies for high-reliability and long lifecycle embedded markets.”

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Price and Availability
The CoreModule® 730 SBC starts at around $400 in OEM quantities and is sampling within 30 days.

ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express®-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.

ADLINK is ISO-9001, ISO-14001, and TL9000 certified, is an Associate Member of the Intel® Embedded and Communications Alliance, an Executive Member of PICMG, and a Sponsor Member of the PXI Systems Alliance. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange.

Media Contact
Kelly Gillilan
Ampro ADLINK Technology, Inc.
Phone: (970) 377-0385

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Contact Information

ADLINK Technology Inc.

5215 Hellyer Ave. #110
San Jose, CA, 95138

tele: 1.408.360.0200
toll-free: 1.866.4.ADLINK

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