Mercury Systems Introduces First Low-Profile High-Density Secure Memory Device for Defense and Commercial Avionics Markets



ANDOVER, Mass. Aug. 28, 2017 Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced volume production of the most recent addition to its portfolio of high density secure memory devices. Optimized for significantly space-constrained defense and commercial avionics applications, Mercury’s new product embeds 2GB of double data rate third-generation synchronous dynamic random-access memory (DDR3 SDRAM) in a highly compact, ruggedized ball grid array (BGA) package. Incorporating the most recent advances in Mercury’s miniaturization technology, the less than 2.4mm height of this new product sets the defense industry standard for low-profile, high density secure memory.

2017-08-28 Mercury Systems Introduces First Low-Profile High-Density Secure Memory Device - 512M32_204_balls

Modern defense and commercial avionics programs are tasked with simultaneously reducing size, weight, and power (SWaP) while rapidly analyzing multiple streams of data from a variety of sensor processing subsystems. By reducing the height of its high density secure memory devices to less than 2.4mm, Mercury’s latest innovation allows system architects to mount high-speed, ruggedized memory on the backside of the printed circuit board instead of the front side. By replacing four discrete memory devices on the front side of a board with a single Mercury low-profile 2GB memory device mounted on the backside of the board, 441mm2 of highly valuable front-side board real estate can be made available. As a result, system architects can now add additional active and passive components needed for enhanced system functionality required for a successful mission.

“Today’s announcement of the low-profile 2GB DDR3 high density secure memory device further reinforces Mercury’s leadership position delivering commercial innovations that address the most challenging problems in the defense and commercial avionics industries today,” says Iain Mackie, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Our Advanced Microelectronics Center is uniquely positioned to support our warfighters with state-of-the-art, highly ruggedized microelectronics solutions needed for today’s most advanced avionics applications.”

In addition to uncompromising performance in SWaP-optimized form factors, Mercury integrates trust and supply chain security throughout the complete lifecycle of its high density secure memory product portfolio. All high density secure memory products are manufactured exclusively in the Company’s Defense Microelectronics Activity (DMEA)-trusted facility, which has received accreditation for design, broker, packaging, assembly, and test services. Several of Mercury’s facilities have also received a Superior rating from the Defense Security Service (DSS). Furthermore, Mercury protects its electronic records with an active cybersecurity program modeled after the Center for Internet Security (CIS) critical security controls.
Mercury’s application engineering team routinely assists customers integrating high density secure memory into new or existing designs. For application assistance, additional product information, or purchase inquiries, customers can visit www.mrcy.com/DDR3 or contact Mercury at (866) 627-6951 or secure.memory@mrcy.com.

Mercury Systems – Innovation That Matters™
Mercury Systems (NASDAQ:MRCY) is a leading commercial provider of secure sensor and mission processing subsystems. Optimized for customer and mission success, Mercury’s solutions power a wide variety of critical defense and intelligence programs. Headquartered in Andover, Mass., Mercury is pioneering a next-generation defense electronics business model specifically designed to meet the industry’s current and emerging technology needs. To learn more, visit www.mrcy.com.

Contact Information

Mercury Computer Systems, Inc.

199 Riverneck Road
Chelmsford, MA, 01824
USA

tele: 978.967.1401
webinfo@mc.com
http://www.mrcy.com/

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