Atrenne, a Celestica Company

Small Form Factor Solution 760-92

The Small Form Factor (SFF) 760 Series rugged electronic packaging design enables off-the-shelf Mini-ITX and PCIe commercial electronics CCAs to be deployed in SWAP and cost-constrained, harsh environments. These types of applications present many challenges to electronic components including extreme temperature ranges, vibration, shock, dust, salt, fog and more. Commercially available components, particularly Mini-ITX processor boards and PCIe expansion cards, are simply not designed to be utilized in these types of rugged, deployed applications. Often, this has prevented system integrators from choosing state-of-the art commercial electronics in favor of much more expensive rugged solutions designed specifically for the military market.

The small form factor 760-92 both house a processor board and three PCIe cards in a small chassis 11.22” L x 9.06” W x 3.43” H. The chassis and internal electronics weigh 13 lbs and consume < 100W. Despite using components that are commercially rated, the chassis meets an operating temperature of -32C to +55C, using an internal heater prior to power-on. The enclosure utilizes baseplate cooling allowing it to provide MIL-STD-810 shock and vibration. Every unit passes environmental stress screening ensuring that it meets the specific ruggedization requirements of the application.

The 760-92 is an enhancement of the 760 family that allows the enclosure to be deployed at stratospheric heights, well above 50,000 feet. The SFF Solution 760-92 is a hermetically sealed rugged enclosure which maintains an internal atmospheric pressure of one atmosphere at all times, essentially simulating a lab operating environment. In order to maintain a seal, Atrenne employs a gasket able to buffer mechanical occlusions between the two precisely machined aluminum surfaces of the enclosure. Atrenne has also developed a creative solution to maintain a seal around I/O cables (including an optional fiber optic) and connectors.

◆ Enables Use of Commercial Mini-ITX Processor in Rugged, Deployed Applications
◆ Rated for altitudes in excess of 50,000 feet
◆ Highly optimized for size, weight, and power (SWAP) constrained applications
◆ ESS screening validates ruggedness of production units

◆ Dimensions: 11.22” L x 9.06” W x 3.43” H
◆ Operating Temperature : -32°C – 55°C
◆ Storage Temperature: -40°C – 71°C
◆ Weight: 13 lbs
◆ Altitude: Well above 50,000 feet
◆ Shock and Vibration: MIL-STD-810
◆ Cooling: Baseplate conduction
◆ Internal : Mini-ITX with 3 PCIe slots or similar
◆ Power: <100W, MIL-STD-704E

Military and Aerospace

Contact Atrenne

Contact Information

Atrenne, a Celestica Company

10 Mupac Drive
Brockton, MA, 02301

tele: 508.588.6110

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