Atrenne, a Celestica Company

Small Form Factor Solution 760-92

The Small Form Factor (SFF) 760 Series rugged electronic packaging design enables off-the-shelf Mini-ITX and PCIe commercial electronics CCAs to be deployed in SWAP and cost-constrained, harsh environments. These types of applications present many challenges to electronic components including extreme temperature ranges, vibration, shock, dust, salt, fog and more. Commercially available components, particularly Mini-ITX processor boards and PCIe expansion cards, are simply not designed to be utilized in these types of rugged, deployed applications. Often, this has prevented system integrators from choosing state-of-the art commercial electronics in favor of much more expensive rugged solutions designed specifically for the military market.

The small form factor 760-92 both house a processor board and three PCIe cards in a small chassis 11.22” L x 9.06” W x 3.43” H. The chassis and internal electronics weigh 13 lbs and consume < 100W. Despite using components that are commercially rated, the chassis meets an operating temperature of -32C to +55C, using an internal heater prior to power-on. The enclosure utilizes baseplate cooling allowing it to provide MIL-STD-810 shock and vibration. Every unit passes environmental stress screening ensuring that it meets the specific ruggedization requirements of the application.

The 760-92 is an enhancement of the 760 family that allows the enclosure to be deployed at stratospheric heights, well above 50,000 feet. The SFF Solution 760-92 is a hermetically sealed rugged enclosure which maintains an internal atmospheric pressure of one atmosphere at all times, essentially simulating a lab operating environment. In order to maintain a seal, Atrenne employs a gasket able to buffer mechanical occlusions between the two precisely machined aluminum surfaces of the enclosure. Atrenne has also developed a creative solution to maintain a seal around I/O cables (including an optional fiber optic) and connectors.

FEATURES & BENEFITS
◆ Enables Use of Commercial Mini-ITX Processor in Rugged, Deployed Applications
◆ Rated for altitudes in excess of 50,000 feet
◆ Highly optimized for size, weight, and power (SWAP) constrained applications
◆ ESS screening validates ruggedness of production units

TECHNICAL SPECS
◆ Dimensions: 11.22” L x 9.06” W x 3.43” H
◆ Operating Temperature : -32°C – 55°C
◆ Storage Temperature: -40°C – 71°C
◆ Weight: 13 lbs
◆ Altitude: Well above 50,000 feet
◆ Shock and Vibration: MIL-STD-810
◆ Cooling: Baseplate conduction
◆ Internal : Mini-ITX with 3 PCIe slots or similar
◆ EMI: MIL-STD-461E
◆ Power: <100W, MIL-STD-704E

APPLICATION AREAS
Military and Aerospace

AVAILABILITY
Contact Atrenne

Contact Information

Atrenne, a Celestica Company

10 Mupac Drive
Brockton, MA, 02301
USA

tele: 508.588.6110
sales@atrenne.com
http://www.atrenne.com/

Share and Enjoy:
  • Digg
  • Sphinn
  • del.icio.us
  • Facebook
  • Mixx
  • Google
  • TwitThis
Extension Media websites place cookies on your device to give you the best user experience. By using our websites, you agree to placement of these cookies and to our Privacy Policy. Please click here to accept.