New White Papers
B Labs hypervisor for ARM processors, now adds Cortex-A15 support, featuring full virtualization of Linux kernel binaries. This is exciting for automotive and embedded systems,
The future success of DVFS and near-threshold computing look dubious—at least for SoCs.
When designing a system on a chip (SoC) that employs one or more embedded processor cores, the choice...
In Part II, IP Extreme’s Savage reveals why IP standards take so long while discussing brand values,...
Today chip giant Intel announced outgoing CEO Paul Otellini’s replacement: he’s Brian Krzanich,...
While the original Yoga 11 ran Windows RT and was powered by an ARM chip, the new version offers Intel's Ivy Bridge processors and runs either Windows 8 or Windows 8 Pro....
Blog Post: Dave's Powertrip: Big Numbers, Big Confusion / (TI E2E Community)
It seems that big numbers carry with them big confusion. Big numbers from the age of the universe to the national debt can lead to interesting conversations at the lunch table. The magnitude of such numbers draws our attention, and the engineer in us leads us to make some use of these numbers. For example, the recently...
The Internet of Things – the Next Growth Driver, Enabled by High-Level Synthesis? / (Jack Erickson's Blog)
The electronics industry has enjoyed constant growth while undergoing constant transformation. One of the most significant transformations has been the source of that growth -- from the PC revolution, to the rise of the internet, to mobile computing. The consensus is that the next growth driver is going to be "the...
State of USB – Spring 2013 – Part 4 – Tablet, Phablets, Phones and Mobile Apps Processors / (To USB or not to USB)
As I sit here at my son’s baseball game typing up this blog entry, I wonder if I should be typing up a blog entry at my son’s baseball game. The State of USB – Spring 2013 – Tablets, Ultra books, and Phones Sadly, USB 3.0 has not yet appeared it phones. It should have. [...]...
Are four cores really better than two for smartphones? Smartphones and tablets are migrating towards new and faster application processors, basebands, graphics chips and memories.
High-performance engines from Intel’s embedded roadmap, along with powerful graphics cards to capture a variety of medical modality and camera images, offer an ideal platform
Changing automotive networking protocols results in increased bandwidth on LIN and CAN networks.
The ARM architecture can be leveraged from mobile handheld devices into airborne low-profile, space-constrained IFE systems equipped with Wi-Fi, multimedia, and more.
Trends from smartphones, WiMAX, and even VME are making PC/104 stronger and ready for the next decade.
New PCIe Gen 2 and Gen 3 support announced.
With so many constraints in creating and certifying ITS systems, the secret to success is targeting an optimal solution based upon one of the many small form factor standards.
Cloud computing will play an increasingly significant role in FPGA designs because the benefits to designers are tremendous. Chip design engineers face a myriad of challenges in
Flash memories wear out, but there are ways to minimize their demise, from application changes to file system software.
Lattice and Xilinx muse on parallelism, partial reconfigurability, and the state-of-the-art in IP and EDA tools.
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Featured Product Briefs
Supported Architectures: Intel x86 Compatible Operating Systems: Windows, Linux The Scan Engineering Telecom’s SAMC-514 is a second generation of SET Quad Core Processor
EECatalog Tech Videos
Debugging Heterogeneous Multicore System based on TI OMAP-L138 with Enea Optima Development Tools. Hosted by Mattias Bertilsson, Director of Product Management at Enea.
Sean Koehl from Intel Labs shows how future computers powered by multi-core processors will be able to bring amazing 3-D visuals and the ability to intelligently manage digital media, allowing you to record and view just the highlights you want to see.
Interview by John Blyler with Max Domeika from Intel
Featured White Papers
Distributed systems range from simple multi-threaded applications to multi-slot chassis-based systems to networked clusters of servers. Topologies get more complex when these systems move into cloud-based environments, and more diverse when they involve machine-to-machine (or M2M) solutions. Providers of distributed system software solutions face a number of challenges in building, debugging and maintaining a set of connected applications. Managing these systems requires powerful modeling and a variety of management interfaces to meet a diverse set of needs. The services provided by a distributed system often require a high level of availability. The middleware frameworks that make up Enea Element address many of these challenges.
Traditional high-performance computing platforms are limited by the connection bandwidth and latency between the multiple computing elements needed to achieve the performance targets. For the embedded market, the difficulty is compounded by the demanding environmental requirements. The VPX standard resolves this limitation with a large number of high-throughput point-to-point connections between the processing elements in a rugged mechanical structure.
OpenVPX System Bandwidth: A comparison of 10Gb Ethernet Performance, Serial Rapid IO, and InfiniBand
This paper compares the bandwidth available to two common types of dataflow for systems based on the VITA 65 CEN16 central switched topology, using three different fabrics – Serial RapidIO (SRIO), 10 Gigabit Ethernet (10GbE), and Double Data Rate InfiniBand (DDR IB).
A CGL compliant, high performance, high availability carrier grade Linux designed for next generation multi-core network architectures.…
This white paper takes a fresh look at the performance of low-power x86 CPUs, now that VIA has introduced dual-core and quad-core CPUs.
Market demand continues to grow for high-performance imaging, communications and security systems. Solutions need to contain scalable power-efficient processors with better integrated graphics capabilities than ever before. From imaging to communications to security to raw scalar throughput, the second generation Intel® Core™ processors (formerly codenamed Sandy Bridge) combining with C206, Q67 and QM67 chipsets offer either a simple, power-efficient upgrade or a massive architectural simplification.
At the Consumer Electronics Show (CES) on January 7, 2010, Intel® announced 27 new processors in its Core® i3, Core® i5 and Core® i7 families. Significantly for the embedded industry, twelve of these were targeted specifically at embedded applications. Early indications are that the Core i7 will offer either more processing performance per watt compared with earlier products (estimated at around 20%), or lower power consumption per unit of processing performance than its predecessors.