Archive for November, 2016

Ethernet Cable Market to Reach $1 Billion, by 2022, Globally – Allied Market Research

Monday, November 28th, 2016

The Global Ethernet Cable Market is estimated to reach $1 billion by 2022, anticipated to grow at a CAGR of 14.3% amid during forecast period 2014 – 2022, according to new research published by Allied Market Research. Asia-Pacific dominated the market, contributing more than 35% share of the overall market revenue, followed by Europe. The demand for high speed internet and rise in data center installation activities, primarily in the industrial sector, have fueled the market growth.
Swift rise in demand for high-speed internet facility, increased application of automation across industries, and reliable performance of Ethernet cables drive the market growth. However, high installation cost and limited availability may restrict the market growth. Moreover, it is anticipated that the rise in Power over Ethernet (PoE) coupled with increase in data center installations is anticipated to fuel the global market growth.
The copper cable segment accounted for more than 50% of the overall Ethernet cable market in 2015. High speed and low cost of these cables in industrial applications led this segment to dominate the market. However, fiber-optic cable segment would grow significantly and is expected to grow at a CAGR of 20.5% during the forecast period. This is due to increase in installation of fiber-optic cables for long distance applications as many renowned companies are launching advanced technology fiber-optic Ethernet cables. Moreover, China did significant contribution in the Asia-Pacific market in terms of revenue for fiber-optic technology.
Among various geographical regions, Asia-Pacific has contributed the maximum revenue share in 2015 and is expected to maintain its lead further as well. This could be attributed to rise in the internet demand due to rising population and increasing industrial activities. Moreover, high number of oil & gas industries in the Middle East use Ethernet cables for various applications and this is also expected to support the market growth.
Asia-Pacific is also projected to be the fastest growing region throughout the analysis period as China has the highest demand for fiber-optic cables due to high-speed internet demand and various security reasons. Moreover, enhancement in industrial development and increase in expenditures in emerging markets (such as Latin-America and Middle East) to satisfy the exponentially growing economies in these countries have strengthened the market growth. Technological advancements for cost-effective and long distance applications in these nations offer a lucrative opportunity for the Ethernet cable market growth.
Key findings of the Ethernet Cable Market:
• In 2015, copper cables segment led the overall Ethernet cable market revenue, and it is projected to grow at a CAGR of 14.3% during the forecast period.
• Broadcast application segment is expected to exhibit rapid growth, owing to the rise in media and telecast activities.
• Currently, Asia-Pacific leads the world Ethernet cable market and it is expected to continue this trend further owing to the swift rise in internet demand from several countries including China, Japan, and India.
• China leads the overall Asia-Pacific Ethernet cable market with more than one-third of the market share.

The key players in the Ethernet cable market focus on expansion of their business operations in emerging countries with acquisition and expansion as a preferred strategy. The major players profiled in this report include Belden Inc., General Cable Technologies Corporation, Nexans, SAB Brckskes GmbH & Co. KG, Siemon, Schneider Electric, Anixter Inc., Siemens AG, Hitachi, Ltd., and Prysmian Group.

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Allied Market Research

5933 NE Win Sivers Drive
#205
Portland, OR, 97220
United States

tele: +1(503)505-6949
toll-free: +1(855)711-1555
fax: +1(503)505-6949
sales@alliedmarketresearch.com
https://www.alliedmarketresearch.com/

ADLINK Technology Showcasing NFV & MEC Solutions at Upcoming Carrier Network Virtualization Event

Monday, November 21st, 2016

The company’s featured platforms highlight the growing demand for flexible edge/cloud computing options in data-intensive industries

ADLINK Technology, Inc., a leading provider of embedded building blocks and application-ready intelligent platforms for the Industrial Internet of Things (IIoT), invites attendees to learn about its Network Functions Virtualization (NFV) and Mobile Edge Computing (MEC) offerings at this year’s Carrier Network Virtualization (CNV) event, December 5-8, at Crowne Plaza hotel in Palo Alto, CA. The company will also be a featured presenter during MEC Focus Day, the final day of the event.

ADLINK will be highlighting its Modular Industrial Cloud Architecture, providing demonstrations for edge and NFV computing based on the modular platform and vCPE using Wind River Titanium Server, as well as hardware and/or software from partners Brocade, RiverBed, CheckPoint and netElastic.

ADLINK’s Modular Industrial Cloud Architecture open framework employs a special, modular design to achieve Software Defined Networking (SDN) and NFV along with the latest integrated hardware acceleration technology in order to speed up the processing of network data packages and video streaming. All functions have been integrated into the open computing structure, satisfying the key requirement of the cloud computing era for resource distribution on-demand.

Unique to the industry, Wind River Titanium Server is a complete, commercial NFV infrastructure (NFVI) software platform that delivers carrier grade reliability and performance for NFV applications. By integrating Titanium Server with ADLINK’s rugged hardware platforms, NFV can be achieved at the network edge or in the data center, providing users with greater opportunities to maximize the performance and capacity of their NFV implementation and reduce operating expenses.

“With Wind River Titanium Server as a software foundation delivering carrier grade virtualization for NFV infrastructure, service providers can gain new flexibility and scalability while achieving significant improvements in operational costs and energy usage,” said Jeff Sharpe, senior strategic product manager for ADLINK. “As one of the first to be integrated with Titanium Server, we’re looking forward to providing a hands-on demonstration to CNV attendees.”

Also part of the ADLINK demonstration, netElastic Systems provides virtualized CPE solutions for managed service providers. Its FlexCPE product is a multi-service NFV-based CPE platform that moves network services off dedicated appliances into Virtualized Network Functions running on open compute platforms such as ADLINK’s Modular Industrial Cloud Architecture. FlexCPE is comprised of a centralized FlexENG that hosts VNFs and a thin, low-cost, device (FlexGW) at the customer premise.

“NetElastic is excited to be partnering with ADLINK for our FlexCPE solution,” said David Williams, SVP Sales and Marketing at netElastic. “Our partnership creates a robust vCPE platform for service providers, enabling service agility and lower total cost of ownership.”

The Carrier Network Virtualization event is being held in conjunction with the Intel® Network Builders End User Summit, which takes place at the same location on Monday, December 5. ADLINK’s Sharpe will be presenting the session The Edge is the Future: Delivering the Future Today at 11:10 am on Thursday, December 8 during the MEC Focus Day.

To schedule a briefing with ADLINK at the show, please contact Monica Lanctot at monica.lanctot@adlinktech.com.

For more information about CNV, please visit the event website.

For more information on ADLINK, please visit www.adlinktech.com.


About ADLINK Technology
ADLINK Technology is enabling the Internet of Things (IoT) with innovative embedded computing solutions for edge devices, intelligent gateways and cloud services. ADLINK’s products are application-ready for industrial automation, communications, medical, defense, transportation, and infotainment industries. Our product range includes motherboards, blades, chassis, modules, and systems based on industry standard form factors, as well as an extensive line of test & measurement products and smart touch computers, displays and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged, supporting extended temperature ranges, shock and vibration.

ADLINK Technology is a Premier member of the Intel® Internet of Things Solutions Alliance. The company is also active in several standards organizations, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), and Standardization Group for Embedded Technologies (SGeT).

ADLINK is a global company with headquarters in Taiwan and manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).

Contact Information

ADLINK Technology Inc.

5215 Hellyer Ave. #110
San Jose, CA, 95138
USA

tele: 1.408.360.0200
toll-free: 1.866.4.ADLINK
info@adlinktech.com
www.adlinktech.com

802.11ad Chipset Market to Reach a Critical Juncture in 2017 with WiGig Certification Now Underway

Wednesday, November 9th, 2016

The 802.11ad (WiGig) chipset market is set to reach a critical juncture in 2017 when the technology increasingly penetrates the computing space and forges new ground in smartphones, tablets, and other connected home devices. With WiGig certification now underway, ABI Research forecasts more than one billion WiGig chipsets will ship in 2021 as it enables wireless docking, and enhances multimedia streaming, data transfer between devices, and networking applications.
“A major challenge for WiGig in moving to the 60GHz band is to build up an ecosystem and solid set of use cases to drive growth,” says Andrew Zignani, Industry Analyst at ABI Research. “WiGig-enabled docks can be costly, and OEMs may choose not to implement the technology if there are only a limited number of devices that will work with the accessories.”
ABI Research expects to see growing confidence in the standard as more WiGig chipsets come to market from key industry players like Broadcom, Intel, Lattice Semiconductor, MediaTek, Nitero, Peraso, and Qualcomm. This will build momentum and help cut costs with the first WiGig-enabled smartphones, anticipated to come to market in 2017, will lead to greater adoption of tri-band products that incorporate 2.4GHz, 5GHz, and 60GHz technologies. ABI Research forecasts 28% of smartphones will support WiGig by 2021.
WiGig can also help to expand the total network speed and capacity by offloading data traffic from the crowded 2.4GHz and 5GHz bands onto the 60GHz band, selecting the most appropriate band depending on the environment. The expansion into this unlicensed millimeter wave spectrum lays the groundwork for the continued evolution of Wi-Fi for years to come. However, due to range limitations of the technology, questions remain over how prolific WiGig will be for Internet access, particularly as new and faster Wi-Fi standards such as 802.11ax arrive to the market.
And while WiGig will ultimately play a key role in the transition to completely cable-free computing, it will also drive new opportunities in AR/VR applications in which cutting the cord is even more vital and desirable. WiGig can remove a literal obstacle in the devices’ path to adoption.
“With continual improvements in physical connectivity through Thunderbolt 3 and USB-C, in addition to the next-generation 60GHz Wi-Fi protocol (802.11ay) on the horizon, the time is now for WiGig to forge its place in the market,” concludes Zignani. “2017 will be a critical year for growth and adoption of WiGig across the PC, mobile, consumer electronics industry, and beyond.”

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Connect Tech Announces Rudi, NVIDIA Jetson TX1 Embedded System

Friday, November 4th, 2016

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Connect Tech has released its newest embedded system using the NVIDIA® Jetson™ TX1 platform with Rudi. Rudi, which measures just 135mm x 105mm x 50mm, holds a lot of power in a small package. Pre-integrated with the Jetson TX1 supercomputer-onmodule, it provides 256 CUDA® cores on NVIDIA Maxwell™ architecture. The system has 4GB LPDDR4 memory, 4K video decode/encode, WiFi, Bluetooth, USB 3.0, CAN 2.0b, USB 2.0, with mSATA and miniPCIe expansion.

“Rudi builds on our extensive line of small form factor, deployable NVIDIA Jetson TX1 solutions,” states Michele Kasza, vice president sales and marketing. “As the audience for the NVIDIA Jetson TX1 is incredibly broad, our goal is to bring to market a product line that supports the incredibly wide range of use cases presented. Rudi is a great addition, bringing a small packaged solution to market and rounding out our existing board level and ultra-rugged enclosure solutions.”

NVIDIAJetson TX1 is a supercomputer on a module. It represents over 20 years of investment in visual computing distilled into an embedded system that’s the size of a credit card. Jetson TX1 features the NVIDIA Maxwell architecture, 256 NVIDIA CUDA® cores, 64-bit CPUs, and unmatched power efficiency. Plus, it includes the latest technology for deep learning, computer vision, GPU computing, and graphics. This is the most comprehensive development platform you can get—including a developer kit, tools, developer portal, community, support, training, and product design packages—so it’s ready for research, prototyping, development, and production.

Connect Tech’s new Rudi Embedded System is ideal for deployable computer vision and deep learning applications. It comes with multiple mounting options: Surface Edge Bracket Mounting, DIN Rail Mounting, or VESA Mounting.

See Rudi on display at Electronica from November 8-11 at Booth A6-313 in Munich, Germany.

For more information:
View Rudi’s Product Page: http://www.connecttech.com/sub/Products/ESG503.asp
View Rudi’s Spec Sheet: http://www.connecttech.com/pdf/ESG503_Rudi.pdf
connecttech.com


About Connect Tech:
For over 30 years, Connect Tech has built a solid reputation for expertise in providing professional design services, delivering unsurpassed technical support and developing innovative products for embedded applications. Our products include commercial off-the-shelf and modified solutions for COM Express®, Qseven, SMARC Carriers, Single Board Computers, GPU solutions, Rugged Tablets, Cellular/Satellite M2M, FPGA, Digital & Analog I/O, Power Supplies, Enclosures, CAN Controllers, Solid State Drives, Ethernet-to-Serial, Multi-port Serial Cards, Adapters & Development Tools.

Contact Information

Connect Tech Inc.

42 Arrow Road
Guelph, Ontario, N1K 1S6
Canada

tele: 519.836.1291
fax: 519.836.4878
sales@connecttech.com
http://www.connecttech.com

IDC Reveals Worldwide CIO Agenda 2017 Predictions

Wednesday, November 2nd, 2016

Today’s IT organizations are divided into two camps: those that thrive by effectively leveraging digital technologies, new business models, and entrepreneurial cultures; and those that are saddled by technical debt, plodding business processes, and lack of a digitally-fueled vision for the future. To help CIOs and IT executives successfully lead their organizations through accelerating digital transformation, International Data Corporation (IDC) today unveiled IDC FutureScape: Worldwide CIO Agenda 2017 Predictions. These predictions lay out the ten most important shifts that will happen in IT organizations over the next 36 months and will guide senior IT executives in the formation of their three-year strategic IT plan.
Joe Pucciarelli, Serge Findling, and Mike Jennett offered guidance for managing the impact of these ten predictions on IT investment priorities and implementation strategies.
IDC’s Worldwide CIO Agenda predictions for 2017 are:
• Prediction 1: By 2019, 40% of IT projects will create new digital services and revenue streams that monetize data.
• Prediction 2: By 2018, 65% of IT organizations will create new customer-facing and ecosystem-facing services to meet the business digital experience (DX) needs.
• Prediction 3: Lack of vision, credibility, or ability to influence will keep 40% of CIOs from attaining leadership roles in enterprise DX by 2017.
• Prediction 4: By 2019, 75% of CIOs will recognize the limitations of traditional IT and embrace a leadership approach that embodies a virtuous cycle of innovation (Leading in 3D).
• Prediction 5: 40% of CIOs will advance DX initiatives by building organizational linkages with line of business (LOB) technology teams and across IT organizational silos, empowering changes in thinking, culture, and practices by 2018.
• Prediction 6: By 2019, 80% of bimodal IT organizations will accumulate a crippling technical debt resulting in spiraling complexity, costs, and lost credibility.
• Prediction 7: 45% of CIOs will shift primary focus from physical to digital and move away from BPM and optimization by 2018 to deliver scale, predictability, and speed.
• Prediction 8: By 2018, 45% of CIOs will focus on platformization, using DevOps for rapid development, cost reduction, and enterprise agility.
• Prediction 9: By 2019, 70% of IT organizations will shift their culture to a startup-like work environment by embracing Agile practices and open source communities.
• Prediction 10: By 2017, 80% of CIOs will help drive global risk portfolios that enable adaptive responses to security, compliance, business, or catastrophic threats.

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