News
May - 2013
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WebsiteTitle
- The NEW N.A.T. AC-Power Module
The market’s most efficient single-width, full-size MicroTCA™ power module for MicroTCA™ applications – NAT-PM-AC600 Overview: The NAT-PM-AC600 is a high-density and
- Docea Power to present unique solutions for modelling and simulation of dynamic thermal management strategies at DAC
Docea Power, the design for low power company that delivers software solutions for power and thermal analysis at the architectural level , will exhibit at the 50 th Design Automation
- Axiomtek 18.5-inch PCAP Panel Computer Modulized Design Delivers Hassle-free Deployment -- GOT3187W-832-PCT
Axiomtek presents a new 18.5” WXGA TFT widescreen fanless multi-touch panel computer, the GOT3187W-832-PCT. It comes with the extraordinary easy-to-deploy modulized design
- Axiomtek’s 3rd Gen Intel® Core™ Digital Signage Player Supports Triple Displays -- DSB500-870HM
Axiomtek’s DSB500-870HM is a high-performance, compact-size digital signage player adopting the 3rd Generation Intel® Core™ i7/i5/i3 processors with the Intel® HM76 Express
- AMD Amplifies Mobile Experience with Responsive Performance, Rich Graphics, Elite Software and Long Battery Life
AMD (NYSE: AMD) recently launched three new additions to its 2013 A-Series and E-Series Mobile Accelerated Processing Unit (APU) lineup – delivering solutions ideally positioned
- Toradex is announcing a comprehensive High Speed Hardware Design Guide for Computer Carrier Boards
Today's electronic engineers designing digital circuits have to cope with interfaces operating in the GHz range. Deploying PCI Express, Gigabit Ethernet, HDMI or USB 2.0/3.0 requires
- ProximusDA Teams with STMicroelectronics to Develop Next-Generation Distributed SOC TLM Virtual Prototypes
Design Automation Conference 2013 ProximusDA GmbH, a company based in Munich, Germany, today announced its joint efforts with STMicroelectronics, a global semiconductor leader
- Avery Design Systems Enhances RTL and Gate-Level X-Verification with SimXACT 2.0 and XOPT 2.0
Avery Design Systems Inc., an innovator in functional verification productivity solutions, today announced availability of release 2.0 of its patented SimXACT and XOPT
- Si2 Announces DAC Booth Presentations
The Silicon Integration Initiative (Si2) will be highlighting its many standards activities through presentations at Booth #1427 at the Design Automation Conference
- Microchip’s New 36V Digital Potentiometers Support Wide Signal Swings and High Power-Supply Voltages
DigiPots Also Feature High Terminal/Wiper Current Support and An Extended Temperature Range; Ideal for Industrial, Automotive and Audio Applications Microchip Technology Inc.,
- Silicon Labs Introduces Industry’s Smallest, Most Power-Efficient PCI Express Clocks
New PCIe Clock Generators Ease Power Consumption and Design Complexity for Consumer, Embedded, Storage, Server and Communications Applications Silicon Labs
- GainSpan's Application Development Kit Jump-Starts Innovation for Wireless Video Applications
Complete video streaming reference design ideal for security/surveillance cameras and baby monitors GainSpan® Corporation, a leader in ultra-low power Wi-Fi connectivity for the
- Soitec announces industry's first four-junction solar cell for concentrator photovoltaic systems, entering industry's roadmap at world-class level with 43.6 % efficiency
Technology innovation opens the path to competitiveness breakthrough in PV industry Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor
- Jedat Releases Innovative OA-based Circuit and Layout Tools for Analog Mixed-Signal Designs at DAC 2013
Jedat Inc. (JASDAQ:3841), a leading developer of high-performance analog and mixed-signal design automation software for integrated circuit (IC) manufacturers, announced
- Pentair Introduces Schroff® 450/40 ATCA Chassis to Support Next Generation ATCA Board Requirements
Pentair Equipment Protection announces the Schroff® 450/40 family of ATCA chassis' with the introduction of 14U, 14-slot models. Designed to accommodate the requirements of next
- TSMC Certifies Cadence Tempus Timing Signoff Solution for 20nm Designs
Key Technologies Required for Fast, Efficient Signoff of Advanced Node Designs Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced
- Mentor Graphics Teams with OpSIS Foundries and Lumerical Solutions on PDK Development for IME Silicon Photonics Process
Mentor Graphics Corp. (NASDAQ: MENT), a leader in electronic design automation, today announced it has teamed with OpSIS and Lumerical Solutions to develop a complete EDA-style,
- Kontron announces next-generation digital signage kit to help streamline development and deployment of intelligent signage systems
Co-developed with Intel and with technology from Microsoft, the pre-validated, pre-loaded kit eases both evaluation and design implementation to reduce costs Kontron has announced
- Axiomtek tBOX321-870-FL – 3rd Gen Intel® Core™ Fanless Embedded System with EN45545 Fire Protection Compliance Ideal for Railway Application
Axiomtek announces the debut of the new high-performance fanless embedded computing box suited for railway-centric PC, the tBOX321-870-FL. Built-in 3rd Generation Intel® Core™
- Atrenta Presents RTL Signoff at 50th DAC
Customers and partners to discuss their experiences Atrenta Inc., a leading provider of SoC Realization solutions for the semiconductor and electronic systems industries, announced
- Si2 Announces Board of Directors for 2013-2014
Annual Open Reception slated for Monday at DAC The Silicon Integration Initiative (Si2) announced the election of their Board of Directors for the 2013-2014 term, who will
- ON Semiconductor Awarded Title III Government Funding for Development of Advanced Next-Generation Star Tracker Image Sensor
Working in cooperation with SRI International and Ball Aerospace, the companies will develop a monolithic CMOS image sensor meeting the STELLAR specification ON Semiconductor
- Renesas Electronics Announces USB 2.0 Hub Controller Chip with Battery Charging Function
Supports USB BC 1.2, Allowing Data Communication and Rapid Charging Via a Single USB Connector Renesas Electronics Corporation (TSE: 6723), a premier supplier of
- Imperas™ Delivers Next Generation Embedded Software Development Suite Based On ToolMorphing™ Technology
Model and Tool Functions Integrated in Simulation Code Stream Provides High-Performance, Extended Capability and Ease-of-Use Benefits Imperas Software Ltd (www.Imperas.com),
- STMicroelectronics Reveals Latest Power Technology for Greener Industry and Infrastructure
Advanced internal structure of new power-transistor family delivers industry’s best on-state resistance for low-energy, space-efficient designs STMicroelectronics (NYSE:
- Worldwide Semiconductor Market Contracted 2.2% in 2012 to $295 Billion – IDC Expects 3-4% Revenue Growth in 2013
Worldwide semiconductor revenues decreased by 2.2% year over year to $295 billion in 2012, according to the latest version of the International Data Corporation (IDC) Semiconductor
- Industry's First 802.11ac 4x4 Reference Design Specifies ANADIGICS' WiFi FEICs
ANADIGICS Leverages its Unique InGaP-Plus Technology in a Single-Die WiFi FEIC to Reduce Time-to-Market, Achieve Greater Throughput, and Deliver Exceptional Thermal Performance ANADIGICS,
- Wind River Extends Multicore Capabilities for Industry-Leading VxWorks
Wind River®, a world leader in embedded and mobile software, today announced extended multicore capabilities for its industry-leading VxWorks® real-time operating system (RTOS).
- VIA Announces Latest VIA Pico-ITX Board to Jump Start In-Vehicle Innovation, VIA VAB-600
Ultra low power design with optional 3G connectivity and battery power support ideal for a broad range of in-vehicle and mobile applications VIA Technologies, Inc, a leading innovator
- L-3 Link Simulation & Training Cuts Engineering Change Orders by Ninety Percent Using Capital Software from Mentor Graphics
Mentor Graphics Corp. (NASDAQ: MENT) today reported that L-3 Link Simulation & Training’s (L-3 Link) operation in the United Kingdom has cut the number of electrical engineering
