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LTE-Advanced Signal Generation and Measurement Using SystemVue
High-Speed, Real-Time Recording Systems Handbook
Teseq Holding AG to Acquire IFI, Increasing Its Presence in the RF Amplifier Market
Acquisition will expand Teseq’s product range from 9 kHz to 40 GHz and up to 10 kW Zug, Switzerland May 2012 – Teseq Holding AG, a leading developer and provider of instrumentation
RFaxis Reveals Breakthrough in Its CMOS RF Front-End Technology for Wi-Fi Enabled Mobile Handsets
CST and Delcross Announce Distribution Agreement for North America
30MHz to 1.4GHz Wideband I/Q Demodulator with IIP2 Optimization & DC Offset Cancellation Improves Zero-IF Receiver Performance
RFaxis Will Launch the World’s First and Only Patented, Pure CMOS, Fully Integrated, 5GHz Single-Chip/Single-Die RF Front-End Integrated Circuit at Computex Taipei 2012
Freescale Introduces Baseband-to-Antenna Reference Design for Multi-Standard Small Cell Base Stations
Helic’s VeloceRF in Nanoradio’s arsenal
Maxim's Highly Integrated Femtocell Transceivers Simplify Compact Radio Designs
ANADIGICS Powers NEC MEDIAS
Updates in IPC-6018B Help Engineers Design High-reliability Boards
Featured Articles
Wireless IP Grows in Surprising Ways
While growing, analog and wireless IP usage may face challenges in manufacturing preferences at lower nodes and emerging LTE technology trends. Does it even need to be stated that
Fast and New Method for Cycle Slip Analysis in PLL: Part 1
This article presents a fast and new approach to analyzing cycle slip in a phase-locked loop (PLL) with a saw tooth phase detector. PLL cycle slip analysis is a nonlinear and mathematical hand calculation is perceived to be complex. In most cases, powerful CAD software, such as Agilent Technologies’ Advanced Design System (ADS), is relied on to do the simulation, as it outputs accurate and reliable data. However, this article will elaborate on how cycle slip occurs and what actually happens during cycle slip. Linear analysis, such as Laplace and inverse Laplace transform, are used to analyze the time domain response between cycle slipping. One caveat is that strict conditions must be applied for the analysis to be accurate. Although this is the case, this analysis will give new perspective and thus will help one achieve a more intuitive, solid understanding as to why and what happens during cycle slip. Analysis results from this simple approach with different input conditions will be compared with accurate output from ADS.
Make the Most of MCU Sleep Modes
Predict how well an MCU will perform over its lifetime on a single battery charge, and make intelligent architecture choices. The advent of inexpensive, energy-efficient embedded processors
How Low Can You Go?
Ultra-low-power microcontroller technologies may revolutionize new designs. VDC Research embedded hardware team analysts left Embedded World 2012 with the impression that this is the
Capacitive Proximity Sensing
Remote interaction with user interface offers new opportunities for product differentiation. Capacitive touch technology is still all the rave in the user-interface space, as it rightfully
MEMS and Packaging Hold Keys to Radio Connectivity
A fully mobile and connected world full of “rich” user experiences won’t exist until radios can operate at ultra-high speed and ultra-low power in both existing 6-GHz and future 60-GHz spectrums.
A View from the Floor at IMS 2011
This year’s International Microwave Symposium introduced new GaN suppliers, rugged LDMOS transistors, and tighter integration between design and test.
Official Guide to the 2011 IEEE MTT-S International Microwave Symposium (IMS)
Things to Note for Your Ultimate Microwave Week Experience!
Differentiation and Co-existence in WiMax and LTE
In his article “The Era of Wireless Broadband,” EECatalog editor Cameron Bird compares expectations and realities of WiMax and LTE deployments. While forecasts ebb and f low, a
Turn Up the Heat with an Electrical-Thermal MMIC Design Flow
Integrated tools enable high power RF designers to optimize electrical performance and thermal operating properties. High-power and heat often go hand-in-hand. If you agree with







