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TSV and Interposer: modeling, design and characterization

3D ICs promise “more than Moore” integration by packing a lot of functionality into small form factors. Interposers along with TSVs play an important role in 3D integration from an electrical, thermal and mechanical point of view.

The goal of this webinar is to demonstrate a complete design methodology for TSVs used in interposers by means of three 3D full wave electromagnetic simulations.

A comparative analysis of various configurations of signal delivery networks in 3D interposers for high speed signal transmission is presented. Based on the results, design guidelines are outlined with the objective of minimizing the crosstalk among TSVs, reducing the insertion loss and generally improving the electrical performance of interconnections in silicon and glass interposers.

  • Location: Worldwide
  • Date:4 Oct 2012
  • Time:17:00
  • Duration: 60 Minutes
  • Register here

Please note:
“Register here” leads you the webinar registration page at webex.com

Contact Information

CST AG

Bad Nauheimerstr.19
Darmstadt, 64289
Germany

info@cst.com
www.cst.com/

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