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AWR Sponsors and Exhibits at EDICON 2013; Presents a Wide Array of Technical Papers and Workshops

What:
AWR is a gold sponsor at the Electronic Design Innovations Conference ( EDICON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, as well as AXIEM® 3D planar electromagnetic (EM) software and Analyst™ 3D finite element method (FEM) EM software.

In addition to software demonstrations within booth #255, AWR will present a number of papers, workshops and panels that include:

  • Antenna Design IA: Design of a Novel Multi-Slot Antenna
  • MMIC Design Workshop: Design Methodology for GaAs MMIC 1 Watt X-band PA
  • RF Power Amplifier IIB: Device Characterization Methods for Advanced RF/Microwave Design
  • EDA Design Flow Workshop and Panel: Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
  • Power Devices:  Optimizing the Design and Verification of 4G RF Power Amplifiers
  • Power Devices:  Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion
  • EDA Design Panel
  • RF Front-End and DPD Technology Panel

For more information about AWR’s activities at EDICON 2013 and the detailed schedule of AWR conference papers and workshops, please visit http://www.awrcorp.com/news/events/event/edi-con-2013.

Where: 
Booth #255, Beijing International Convention Center, Beijing, China

When:  
March 12-14, 2013AWR is a gold sponsor at the Electronic Design Innovations Conference ( EDICON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, as well as AXIEM® 3D planar electromagnetic (EM) software and Analyst™ 3D finite element method (FEM) EM software.

In addition to software demonstrations within booth #255, AWR will present a number of papers, workshops and panels that include:

  • Antenna Design IA: Design of a Novel Multi-Slot Antenna
  • MMIC Design Workshop: Design Methodology for GaAs MMIC 1 Watt X-band PA
  • RF Power Amplifier IIB: Device Characterization Methods for Advanced RF/Microwave Design
  • EDA Design Flow Workshop and Panel: Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
  • Power Devices:  Optimizing the Design and Verification of 4G RF Power Amplifiers
  • Power Devices:  Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion
  • EDA Design Panel
  • RF Front-End and DPD Technology Panel

For more information about AWR’s activities at EDICON 2013 and the detailed schedule of AWR conference papers and workshops, please visit http://www.awrcorp.com/news/events/event/edi-con-2013.

Where: 
Booth #255, Beijing International Convention Center, Beijing, China

When:  
March 12-14, 2013

Contact Information

AWR Corporation

1960 E. Grand Avenue
Suite 430
El Segundo, CA , 90245
USA

tele: +1 (310) 726-3000
fax: +1 (310) 726-3005
info@awrcorp.com
http://web.awrcorp.com/

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