print

AWR Sponsors and Exhibits at EDICON 2013; Presents a Wide Array of Technical Papers and Workshops

What:
AWR is a gold sponsor at the Electronic Design Innovations Conference ( EDICON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, as well as AXIEM® 3D planar electromagnetic (EM) software and Analyst™ 3D finite element method (FEM) EM software.

In addition to software demonstrations within booth #255, AWR will present a number of papers, workshops and panels that include:

  • Antenna Design IA: Design of a Novel Multi-Slot Antenna
  • MMIC Design Workshop: Design Methodology for GaAs MMIC 1 Watt X-band PA
  • RF Power Amplifier IIB: Device Characterization Methods for Advanced RF/Microwave Design
  • EDA Design Flow Workshop and Panel: Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
  • Power Devices:  Optimizing the Design and Verification of 4G RF Power Amplifiers
  • Power Devices:  Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion
  • EDA Design Panel
  • RF Front-End and DPD Technology Panel

For more information about AWR’s activities at EDICON 2013 and the detailed schedule of AWR conference papers and workshops, please visit http://www.awrcorp.com/news/events/event/edi-con-2013.

Where: 
Booth #255, Beijing International Convention Center, Beijing, China

When:  
March 12-14, 2013AWR is a gold sponsor at the Electronic Design Innovations Conference ( EDICON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, as well as AXIEM® 3D planar electromagnetic (EM) software and Analyst™ 3D finite element method (FEM) EM software.

In addition to software demonstrations within booth #255, AWR will present a number of papers, workshops and panels that include:

  • Antenna Design IA: Design of a Novel Multi-Slot Antenna
  • MMIC Design Workshop: Design Methodology for GaAs MMIC 1 Watt X-band PA
  • RF Power Amplifier IIB: Device Characterization Methods for Advanced RF/Microwave Design
  • EDA Design Flow Workshop and Panel: Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation
  • Power Devices:  Optimizing the Design and Verification of 4G RF Power Amplifiers
  • Power Devices:  Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion
  • EDA Design Panel
  • RF Front-End and DPD Technology Panel

For more information about AWR’s activities at EDICON 2013 and the detailed schedule of AWR conference papers and workshops, please visit http://www.awrcorp.com/news/events/event/edi-con-2013.

Where: 
Booth #255, Beijing International Convention Center, Beijing, China

When:  
March 12-14, 2013

Contact Information

AWR Corporation

1960 E. Grand Avenue
Suite 430
El Segundo, CA , 90245
USA

tele: +1 (310) 726-3000
fax: +1 (310) 726-3005
info@awrcorp.com
http://web.awrcorp.com/

Share and Enjoy:
  • Digg
  • Sphinn
  • del.icio.us
  • Facebook
  • Mixx
  • Google
  • TwitThis
Extension Media websites place cookies on your device to give you the best user experience. By using our websites, you agree to placement of these cookies and to our Privacy Policy. Please click here to accept.