Registration Opens for Inaugural Boards, Chips and Packaging IMPACT Conference Hosted by Isola and Semico Research
Captain Chesley B. (Sully) Sullenberger, III to deliver a keynote during the one-day event focused on system-level integration across the entire hardware development process.
Isola Group, a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs) and Semico Research, a semiconductor marketing and consulting research company, announced today that they have teamed up to launch Boards, Chips and Packaging: Designing to Maximize Results. This new industry event will span the system-level ecosystem to address the roles of system architectures, board design, chip design, package design and final fabrication and assembly processes for hardware product development. Conducted under the auspices of Semico’s highly regarded and respected IMPACT Conference series, this one-day conference will take place October 13, 2015 at the Computer History Museum in Mountain View, California. This event is targeted towards board designers, system architects, chip designers, package designers and program managers, as well as marketing executives involved in system-level ecosystem decisions.
Among the keynote speakers of the event will be Captain Chesley B. (Sully) Sullenberger, III. Best known for serving as the Captain during what has been called the “Miracle on the Hudson,” Captain Sullenberger has become known for his expertise in safety and knowledge of high-performance systems’ improvement to saving lives, saving money and bringing value to communities.
For years, software has been viewed as the “value-add” for most electronic products, however without the solid foundation of properly functioning hardware, the reliability of the software is secondary. As such, all phases of the hardware development process need to be addressed at a higher level and with greater emphasis as part of the overall product development cycle.
Jim Feldhan, President for Semico Research stated, “From the hardware development perspective, companies are faced with the requirements of meeting ever-increasing market demands for lower power, higher performance and lower costs. While chips may meet system specifications, complex designs require even more attention at the board, packaging, manufacturing and assembly levels to deliver products that not only work right the first time but are also reliable across the entire product life cycle. In order to develop and bring these life-enhancement products to market, it’s necessary to start with a firm foundation and that is where Isola comes into play. Its history in the market as a premier materials science company along with the quality of its laminate materials makes Isola an optimal partner for this conference.”
In addition, Feldhan noted, “There is no one conference that is dedicated to the hardware side of the product development process. That is one of the key reasons that we are launching this event at this point in time.”
Tarun Amla, Executive Vice President and Chief Technology Officer at Isola Group noted, “Today’s technology affects all facets of consumer lifestyles. The electronics industry is undergoing a major metamorphosis in terms of how consumers influence next-generation product features and delivery requirements. Gone are the days of shouting at consumers telling them what they need. Now we must listen to the market and design around their needs. This event will bring the industry together to ensure the consumers’ voices are heard to deliver the most feature rich, compact and affordable devices to market by sharing best practices and engaging at all levels of the design cycle.”
Boards, Chips and Packaging: Designing to Maximize Results will cover a variety of industry topics such as How Can Board Companies, Chip Companies and Fabrication Companies Work Together to Ensure That Hardware Products Are Right the First Time; How Do We Get to 32Gb/S and Beyond; The Role of mm-Wave Automotive RADAR; Phased Array RADAR Antenna Solutions and RF/Digital Hybrid Boards.
For information on sponsorships and speaking opportunities, please contact Jim Feldhan from Semico Research at 602-997-0337, Opt#1, email@example.com or Joanne Itow from Semico Research at 602-997-0337, Opt#2,firstname.lastname@example.org.
To learn more about the Boards, Chips and Packaging: Designing to Maximize Results conference and to register for the event, please visit http://www.semico.com/events.
Isola Group, headquartered in Chandler, Arizona, is a global material sciences company focused on designing, developing, manufacturing, and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multi-layer printed circuit boards. The company’s high-performance materials are used in sophisticated electronic applications in the communications infrastructure, computing/networking, military, medical, aerospace and automotive industries. For more information, visit our website athttp://www.isola−group.com/.
Semico Research Corp. is a semiconductor marketing & consulting research company located in Phoenix, Arizona.
Semico was founded in 1994 by a group of semiconductor industry experts. We have improved the validity of semiconductor product forecasts via technology roadmaps in end-use markets.
Semico offers custom consulting, portfolio packages, individual market research studies and premier industry conferences.For more information, visit our website at http://www.semico.com/.