Vesper and Unisem Announce Assembly Partnership to Deliver Piezoelectric MEMS Microphones at Scale
BOSTON, March 06, 2018 (GLOBE NEWSWIRE) — Vesper, developer of the world’s most advanced acoustic sensors, and Unisem, a global provider of semiconductor assembly and test services, today announced a partnership for Unisem to manufacture and produce high volumes of Vesper microphones at scale.
Unisem’s world-class, high volume manufacturing capabilities will enable Vesper to meet growing demand for its piezoelectric MEMS microphones. The partnership will allow Vesper to seamlessly produce and deliver millions of units. Unisem currently assembles all products from Vesper’s product line, including the new VM1010 for low power applications.
“In today’s ever-changing high tech landscape, the demand for voice-enabled products is through the roof. Vesper and Unisem have created a powerhouse assembly partnership that can now scale to serve any customer,” said Matt Crowley, CEO of Vesper. “Unisem has factories in Malaysia, China and Indonesia that enable Vesper to meet the demand of our global clientele,” continued Crowley.
“MEMS continue to be a fast-growing segment for Unisem, and we are excited to partner with our customer Vesper as they move to high volume MEMS microphone manufacturing,” said H.L. Lee, Group COO of Unisem.
The partnership is effective immediately and Unisem will continue manufacturing new products developed by Vesper throughout 2018 and beyond.
Vesper is a privately held advanced sensor company based in Boston, Mass. With origins at the University of Michigan, Vesper’s award-winning microphones are driving a new era of pervasive voice interfaces and acoustic event-detection products via a proprietary piezoelectric MEMS technology. For more information, visit www.vespermems.com, Twitter, YouTube, and Vesper Blog.
Unisem is a global provider of semiconductor assembly and test (OSAT) services for many of the world’s most successful electronics companies. We offer an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of lead frame and substrate IC packaging; wafer level CSP; and RF, analog, digital, and mixed signal test. Our turnkey services include design, assembly, test, failure analysis, and electrical, mechanical, and thermal characterization and modeling. The company has factory locations in Ipoh, Malaysia; Chengdu, People’s Republic of China and Batam, Indonesia. Unisem is headquartered in Kuala Lumpur, Malaysia. For additional information on Unisem, please visit: www.unisemgroup.com.