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05/24/16 By: Chris A. Ciufo, Editor, Embedded Systems Engineering An up-to-date quick reference list for engineers designing with Type-C. USB 3.1 and its new Type-C connector are likely in ...0
05/18/16 …also D-PHYs, Dual D-PHYs, sub-LVDS, and more. A new device—programmable ASSP— takes...0
05/11/16 Collaboration is a powerful change agent for good for embedded security, device interoperability,...0
05/10/16 Easing the programming of heterogeneous parallel devices. Editor’s Note: The HSA Foundation...0
05/07/16 By: Jonah McLeod If history is any guide to the future, each major next generation consumer device—PC, Smart Phone, and what comes next will each have its own computing architect...0
05/07/16 Support for the USB Power Delivery 3.0 standard has significance for next-generation consumer,...0
05/05/16 The reasons might resonate with you. “Capacitive Versus Thermal MEMS for High-Vibration...0
05/02/16 As shipments of wearable devices continue to rise, smartwatches have evolved to be one of the most popular devices in this sector. To make the most of a projected 42.8% compound annual growth rate (CAGR) developers are examining what qualities will be needed to drive adoption....0
Keysight Technologies’ New High Current Ultra Low Noise Filter Expands Power Source’s Output Range up to 500 mA 05/17/16
ProTek Devices Beefs Up Circuit Protection Offering Across Networking, Mobile and other Computing Applications 05/16/16
Lattice Announces First Programmable ASSP (pASSP) Interface Bridge for Mobile Image Sensors and Displays 05/16/16
FotoNation® and Socionext Partner to Deliver Enhanced Electronic Image Stabilization Technology for On-the-Move Video 04/26/16
By: Chris A. Ciufo, Editor, Embedded Systems Engineering An up-to-date quick reference list for engineers...
By: Jonah McLeod If history is any guide to the future, each major next generation consumer device—PC,...
By Alan Grau, Icon Labs On a daily basis, I have the opportunity to interact with a wide range of companies...
ARM insists there is plenty of room for growth in smartphones thanks to emerging applications such as VR. At Computex, the company announced the Cortex-A73 and Mali-G71 graphics to tackle these demanding applications....
Blog Post: Tapping the cloud for IoT sensing solutions / (TI E2E Community)
The Internet of Things (IoT) is linking people, devices and cloud data storage services at an unprecedented rate. By 2020, some analysts estimate 50 billion digital devices will be connected to the Internet. Customers are leveraging DLP® Products to create new, unique capabilities in remote sensing, including spectroscopy,...
Chromebooks are already outselling Macs. So Linus Torvalds is wondering if this really might be the year of the Linux desktop. With the addition of Android apps to the Chromebook, maybe it really will be....
Inside the National Instruments NI VB-8034 Virtual Bench. A 350MHz 4 channel mixed signal oscilloscope, arbitrary waveform generator, power supply, and I/O module that can connect to the PC, tablet or phone via USB, WiFi, or Ethernet. Datasheets: Xilinx Kintex 7 ADC08D1520 ADC CRF Reed Relay High Speed OpAmp...
Recommended Technology Papers
As an early option for data organization, the FAT file system attained a certain ubiquity. This paper examines characteristics of the FAT file system that leave it vulnerable to corruption, and some ways vendors (including Microsoft) are trying to make it more reliable. Can reliability be achieved without sacrificing interoperability? Is the performance cost worth the benefit?
LPDDR4 offers huge bandwidth in a physically small PCB area and volume; up to 25.6 GByte/s of bandwidth at a 3,200 Mbps data rate from a single 15mmx15mm LPDDR4 package when two dies are packaged together. LPDDR4 builds on the success of LPDDR2 and LPDDR3 by adding new features and introducing a major architectural change. This white paper discusses why designers are selecting LPDDR4, how to handle 2-die and 4-die packages with multi-channel connections, the advantages of sharing channels through system-on-chip (SoC) partitioning, and how to optimize channels for the lowest power consumption.
This white paper digs into 10G USB 3.1 to clarify the evolutionary and revolutionary changes in the specification. USB 3.1 introduces a 10 Gbps signaling rate in addition to other features.
Tough reliability standards for electronic automotive safety systems ensure that integrated circuits (ICs) comply with demanding performance and reliability requirements. These same IC reliability verifications tools can be used to validate circuit operation for "infotainment" and "connected car" applications, and ensure that customer reliability expectations are satisfied. Download your free report to learn how to: * Leverage existing IP for use in high-reliability applications * Provide automation for manual IC verification steps in your design flow * Improve existing coverage of IC reliability verification
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Intel Bay Trail CPU and LPDDR3 give V10T high performance with low power consumption. Business as well as entertainment applications are at home on the V10T, which features digitizer
Equipped with the Intel® Celeronl® Processor N2920, with options for a 2D barcode scanner, magnetic stripe reader, smart card reader, RFID, dual camera, 3G and GPS. IP65 water
Smartphone & Tablet Design Datasheet Directory
Intel Bay Trail CPU and LPDDR3 give V10T high performance with low power consumption. Business as well as entertainment applications are at home on the V10T, which features digitizer...
by Qingbang Elec(SZ) Co., Ltd
Equipped with the Intel® Celeronl® Processor N2920, with options for a 2D barcode scanner, magnetic stripe reader, smart card reader, RFID, dual camera, 3G and GPS. IP65...