Archive for December, 2016

Jury Awards Core Wireless $7.3 Million in Patent Litigation Against Apple

Friday, December 16th, 2016

A jury in the United States District Court for the Northern District of California has awarded Core Wireless Licensing, a subsidiary of Conversant Intellectual Property Management Inc., $7.3 million in damages after finding that Apple, Inc. infringed two smartphone patents owned by Core Wireless.
The patents-in-suit — U.S. Patent No. 6,633,536 and U.S. Patent No. 6,477,151 — provide innovations that improve battery life and signal quality in mobile phones.
Core Wireless alleged that Apple’s recent iPhones and cellular-enabled iPads infringed both patents. The jury determined that the patents are infringed and valid, and awarded Core Wireless $7.3 million for past damages. Core Wireless will also seek interest on the award dating from October 2011.
The case is Core Wireless Licensing S.a.r.l. v. Apple, Inc., Civil Action No. 5:15-cv-05008 (N.D.Cal.). The infringing Apple products are the iPhone 3G, 3GS, 4, 4S, 5, 5S, 5C, 6, 6 Plus, 6S, 6S Plus, and SE and the cellular-enabled iPad, iPad 3, iPad 4, iPad Mini, iPad Air, iPad Air 2, and iPad Pro.

Amkor Completes Product Qualification of SWIFT Packaging for Advanced Mobile, Networking and SiP Applications

Wednesday, December 14th, 2016

Amkor Technology, Inc. completed product qualification for its Silicon Wafer Integrated Fan-Out Technology (SWIFT). SWIFT is designed to handle the demanding requirements of today’s advanced mobile, networking and system-in-package (SiP) applications.
With its fine-feature photolithography and thin film dielectrics, SWIFT bridges the gap between through silicon via (TSV) and traditional wafer level fan-out (WLFO) packages. Compared to laminate-based substrate technologies, SWIFT offers improvements in form factor, signal integrity, power distribution and thermal performance. SWIFT incorporates an “RDL first” process that allows SWIFT wafers to be built and yielded ahead of the assembly process – accelerating production cycles and optimizing overall assembly yield.
“The semiconductor industry requires much higher levels of integration in a significantly reduced form factor,” said Ron Huemoeller, Amkor’s corporate vice president, Research & Development. “Our package and board-level reliability results demonstrate that SWIFT is ready for sampling by customers.”
SWIFT is targeted for production in the second half of 2017 at K5, Amkor’s state-of-the-art manufacturing, research and development center in Incheon, South Korea.

Release and Related White Paper Support Pathway to Public Transport Interoperability

Tuesday, December 13th, 2016

The NFC Forum released its Certification Program and, related to it, the publication of the NFC-enabled e-Ticketing in Public Transport: Clearing the Route to Interoperability white paper. Certification Release 10 (CR10) provides support for functionality introduced in the NFC Forum’s Analog Technical Specification 2.0.
CR10 ensures interoperability between an NFC device and the ISO/IEC 14443 and ISO/IEC 18092-based infrastructure and cards that are in use in many of the contactless transportation systems worldwide. The white paper complements the certification release by providing solutions to interoperability issues that affect the deployment and use of NFC-enabled smartphone eTicketing services in the contactless transportation systems. The white paper was created with input from eight key transportation organizations including Public Transport Operators (PTO) and global standards bodies. It is free.
With the technology and standards now available to enable radio frequency (RF) interoperability, PTOs, Mobile Network Operators (MNO) and handset makers can rely on certification by the NFC Forum to ensure that a tested and certified device will interoperate with public transport systems and deliver a positive user experience.
Implementing this solution will increase consumer use of NFC-enabled smartphones for simplifying and accelerating fare purchases, providing one-touch entry to ticket gates, supporting ancillary applications (such as real-time travel updates and loyalty programs), and enabling use of the same means of payment and access to multiple modes of public transport (rail, bus, subway, etc.).
Industry Collaboration to Harmonize Specifications
Achieving RF interoperability was a concerted effort spanning the global public transport ecosystem. The NFC Forum and EMVCo were the first to agree upon cooperation that targeted the harmonization of analog/RF and digital layer specifications for NFC mobile devices. The NFC Forum has since extended the scope of the effort by establishing similar relationships with transport organizations and other standardization organizations. In 2015, the NFC Forum and The Global System for Mobile (GSMA) launched an initiative in concert with global public transport representatives, including the American Public Transportation Association; East Japan Railway Company; European Committee for Standardization; International Organization for Standardization; ITSO, a UK-backed smart ticketing standards organization; Smart Ticketing Alliance; and other standards bodies.
According to the World Health Organization, over 50 percent of the world’s population lives in cities. This population density combined with over two billion NFC-enabled devices in use is an ideal environment for deploying NFC eTicketing solutions and services. Automatic fare collection systems or electronic ticketing and innovative transport ticketing solutions were created as a way of meeting this growing demand and creating a better travel experience.

Immersion Renews License Agreement with LG Electronics for TouchSense Technology and Basic Haptics Patent Portfolio

Tuesday, December 6th, 2016

Immersion Corp., a developer and licensor of touch feedback technology, has renewed a license agreement with LG Electronics, Inc., one of the world’s largest providers of mobile devices. Building on an agreement signed in 2014, the three-year extension provides a worldwide license for LG to use Immersion’s TouchSense technology and Basic Haptics patents in its smartphones, tablets and fitness bands.
Immersion’s TouchSense technology enables device manufacturers to appeal to users’ sense of touch by incorporating high-quality tactile effects and feedback in user interfaces and applications to simulate the connected experiences of the real world. With TouchSense technology, device manufacturers, app developers and UX designers can design power-efficient tactile effects that enhance the user experience for mobile apps and device UI.
For mobile OEMs in the Android ecosystem, the TouchSense product family provides all it takes to design and implement the highest quality haptics across handset UI elements and apps:
TouchSense 3000 is Immersion’s best-in-class end-to-end solution to design, enable, and optimize high-fidelity haptics in mobile handsets. The product package includes haptic software design tools and framework, reference guides, and on-site UX design services and FAE support, as well as intellectual property rights based on Immersion’s comprehensive patent portfolio.
TouchSense 3000 EES, another member of the TouchSense product family, offers similar benefits, but adds proprietary technology built to address the requirements of ERMs, which are among the most popular choices of actuator in the handset market.
For a basic haptic experience, mobile OEMs can license the Basic Haptics patent portfolio and implement their own form of simple non-pressure related haptics, such as the non-pressure related haptics available in the Android OS.

Contact Information

LG Electronics


http://www.lg.com/