Amkor Completes Product Qualification of SWIFT Packaging for Advanced Mobile, Networking and SiP Applications
Amkor Technology, Inc. completed product qualification for its Silicon Wafer Integrated Fan-Out Technology (SWIFT). SWIFT is designed to handle the demanding requirements of today’s advanced mobile, networking and system-in-package (SiP) applications.
With its fine-feature photolithography and thin film dielectrics, SWIFT bridges the gap between through silicon via (TSV) and traditional wafer level fan-out (WLFO) packages. Compared to laminate-based substrate technologies, SWIFT offers improvements in form factor, signal integrity, power distribution and thermal performance. SWIFT incorporates an “RDL first” process that allows SWIFT wafers to be built and yielded ahead of the assembly process – accelerating production cycles and optimizing overall assembly yield.
“The semiconductor industry requires much higher levels of integration in a significantly reduced form factor,” said Ron Huemoeller, Amkor’s corporate vice president, Research & Development. “Our package and board-level reliability results demonstrate that SWIFT is ready for sampling by customers.”
SWIFT is targeted for production in the second half of 2017 at K5, Amkor’s state-of-the-art manufacturing, research and development center in Incheon, South Korea.