EECatalog Tech Videos
Switch between DisplayPort and HDMI port using a single video switch while maintaining signal integrity over a cable length of 30 meters
New Research: Backend Connectivity Opportunities are Accelerating Mobile Application Development Platform Adoption November 2014
Backend Connectivity Opportunities are Accelerating Mobile Application Development Platform Adoption The transformation of mobile solutions has been one of the more dramatic in the
RF Micro Devices, Inc. (Nasdaq: RFMD) and TriQuint Semiconductor, Inc. (Nasdaq: TQNT) today announced the two companies have received all necessary shareholder and regulatory approvals
From luxury to base models, IC content on all new cars is increasing. Later this month, IC Insights’ new 2015 IC Market Drivers Report will be released. The report contains analyses
San Francisco, CA December 13-17, 2014
Santa Clara, CA January 27-30, 2015
San Francisco, CA February 22-26, 2015
San Jose, CA March 2-5, 2015
Grenoble, France March 9-13, 2015
NEC, Birmingham April 21-22, 2015
Santa Clara, CA May 6-7, 2015
EECatalog Tech Videos
Embedded editor Chris A. Ciufo chats with Ian Drew, CMO, ARM. In part 2, the guys discuss: ARM's mbed/mbed OS and Cortex-M7; the easy path to the IoT is made easy by ARM's new mbed
Embedded editor Chris Ciufo chats with Ian Drew, CMO, ARM. ARM's move into 64-bit servers with HP's recent “Moonshot” announcement; how the IoT grows from the enterprise and handsets; and ARM partners' complete infrastructure for servers.
Join USB-IF’s Jeff Ravencraft and Synopsys’ Eric Huang in a discussion about new USB 3.1 features, including 10 Gbps data rates and USB Type-C Connectors, at IDF 2014.
See the industry's first platform-to-platform 10G USB 3.1 technology demonstration. In this video, Eric Huang runs two HAPS-70 FPGA-based prototyping platforms with 10G USB 3.1 device and host IP. The platforms are connected with a standard USB 3.0 cable running at 10G USB 3.1 speeds of up to 915 MBps.
See how Synopsys HAPS-70 FPGA-based prototyping platforms helped to accelerate Synopsys' development of 10G USB 3.1 IP. HAPS offers a flexible, off-the-shelf platform that enabled the R&D team to quickly develop and test RTL models, perform hardware validation, and ensure hardware/software interoperability.
Live from IDF2014: Editor Chris A. Ciufo visits _two_ Kontron stands and learns that rugged "shoebox" computers bounce (and don't break), and that COTS-based NFV/SDN is coming to a
Live from IDF2014: Interview with SunMan Engineering, an IoT pioneer. In this 4 minute video, editor Chris A. Ciufo interviews Kaveh Pirzadeh, Director of Engineering and learns that SunMan designed a connected car IVI system several years ago. SunMan describes their IoT systems that include hardware, software, gateways, and cloud-based management software. Case examples discussed: IVI, digital farming, and human replacement...just maybe. For more information: http://www.sunmantechnology.com/.
Featured White Papers
Q: Should I put some sort of circuit between my sensor and an analog-to-digital converter?
A: Yes. You probably need some signal conditioning. The explanation below goes on for a bit, but stay with it and you'll understand what you need and why you need it.
USB-IF Worldwide Developers Days introduced developers to the new USB 3.1 specification. This white paper digs deep into 10G USB 3.1 to clarify the evolutionary and revolutionary changes in the specification.
Q: How often should my equipment make measurements? A: This question often arises when people draft plans to automatically measure a physical quantity such as temperature, pressure, acidity, liquid level, and so on. You can approach this problem in several ways, from an educated guess to a mathematical analysis of your system. The examples that follow use temperature measurements because people measure temperature more than any other physical characteristic.
Chip-package co-design is important for several reasons. Designing a large high power die, e.g. a System-on-Chip (SoC) without considering how to get the heat out is likely to lead
This white paper, written by Vlad Konopelko, Product Marketing Manager, North America, for Pentair’s Schroff brand, introduces seven essential mechanical structure and protection standards and design considerations for specifying a reliable 19” electronics cabinet solution for non-IT applications
Each advancement in medical imaging enables significant improvements in the quality and efficiency of diagnostics and therapy. The challenge: Each advancement requires significant computing performance gains to allow medical image data to be measured and analyzed. And once this massive amount of digital data has been created, it needs to be visualized too – including even stereoscopic 3D in real-time.
Comprehensive display and computer-on-module system solutions In the highly competitive retail industry, innovative technologies can help improve the coordination of the supply