IC Insights Raises Worldwide 2010 IC Market Growth Forecast to +27%

2010 DRAM market to increase 74%

IC Insights’ soon to be released March Update to The McClean Report will describe its newly revised 2010 IC market forecast. The Update will show that the worldwide IC market is now expected to jump 27% in 2010 to $253 billion and another 15% in 2011 to $290 billion. At $253 billion, the 2010 IC market would exceed by 8% the previous high of $234 billion reached in 2007.

One of the product categories driving strong double-digit IC market growth in 2010 is the DRAM segment. In fact, fueled by strong increases in average selling prices, IC Insights believes that the DRAM market will surge at least 74% this year. As a quick crosscheck to this astounding growth-rate forecast, if the January 2010 DRAM market stayed flat for the next 11 months, the 2010/2009 DRAM market would register 61% growth! The strong DRAM market is expected to help support the 100%+ capital spending increases now budgeted by many of the DRAM manufacturers this year.

The upgrade to IC Insights’ earlier worldwide IC market forecast, which initially called for 15% growth in 2010, is almost entirely due to a revision in the IC market change expected for 1Q10/4Q09. While a moderate seasonal decline in 1Q10/4Q09 IC sales was previously anticipated, it now appears that the 1Q10/4Q09 IC market will display a 3% increase!

Because the 1Q09 IC market was so depressed, being the extreme bottom of the 2008-2009 downturn, the 1Q10/1Q09 IC market increase is likely to be greater than 50%. However, as 2010 progresses, IC Insights expects the quarterly year-over-year comparisons to fall back to more realistic levels (Figure 1). As shown, the 4Q10 IC market is forecast to be only 14% greater than the IC market in 4Q09.

It should be noted that IC Insights’ forecasts for the 2Q, 3Q, and 4Q sequential quarterly IC market increases in 2010 include a relatively flat 2Q, a 9% increase in 3Q, and a moderate 3% increase in 4Q. These sequential growth rate forecasts remain essentially unchanged from our previous expectations. Thus, with only a moderate seasonal increase forecast for the IC market in the second half of this year, IC Insights’ 27% growth forecast for 2010 still can be considered conservative!


Figure 1

Report Details

The 2010 McClean Report provides many more details about the 2010-2014 IC market trends. Packed with 400 tables and graphs, the 2010 edition of The McClean Report is available in three-ring binder, CD-ROM, and on-line formats. Included with the subscription are free monthly updates by e-mail from March through November. A single copy of the report in CD-ROM or binder format is priced at $2,890. A bundled CD-binder set is priced at $3,385. An Internet access password is available as a $695 option. The report is also available under a multi-user corporate license for $5,990.

For more information, please visit www.icinsights.com/prodsrvs/mcclean/.

More Information Contact

For more information, contact: Bill McClean, president of IC Insights, phone: +1-480-348-1133, e-mail: bill@icinsights.com.

About IC Insights

IC Insights, Inc., based in Scottsdale, Arizona, is dedicated to providing high-quality, cost-effective market research for the semiconductor industry. Founded in 1997, IC Insights offers coverage of global economic trends, semiconductor market forecasts, capital spending and fab capacity trends, product market details, and technology trends, as well as complete IC company profiles and evaluations of end-use applications driving demand for ICs. For more information, contact +1-480-348-1133 or info@icinsights.com, or visit www.icinsights.com.

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IC Insights Raises Worldwide 2010 IC Market Growth Forecast to +27%

2010 DRAM market to increase 74%

IC Insights’ soon to be released March Update to The McClean Report will describe its newly revised 2010 IC market forecast. The Update will show that the worldwide IC market is now expected to jump 27% in 2010 to $253 billion and another 15% in 2011 to $290 billion. At $253 billion, the 2010 IC market would exceed by 8% the previous high of $234 billion reached in 2007.

One of the product categories driving strong double-digit IC market growth in 2010 is the DRAM segment. In fact, fueled by strong increases in average selling prices, IC Insights believes that the DRAM market will surge at least 74% this year. As a quick crosscheck to this astounding growth-rate forecast, if the January 2010 DRAM market stayed flat for the next 11 months, the 2010/2009 DRAM market would register 61% growth! The strong DRAM market is expected to help support the 100%+ capital spending increases now budgeted by many of the DRAM manufacturers this year.

The upgrade to IC Insights’ earlier worldwide IC market forecast, which initially called for 15% growth in 2010, is almost entirely due to a revision in the IC market change expected for 1Q10/4Q09. While a moderate seasonal decline in 1Q10/4Q09 IC sales was previously anticipated, it now appears that the 1Q10/4Q09 IC market will display a 3% increase!

Because the 1Q09 IC market was so depressed, being the extreme bottom of the 2008-2009 downturn, the 1Q10/1Q09 IC market increase is likely to be greater than 50%. However, as 2010 progresses, IC Insights expects the quarterly year-over-year comparisons to fall back to more realistic levels (Figure 1). As shown, the 4Q10 IC market is forecast to be only 14% greater than the IC market in 4Q09.

It should be noted that IC Insights’ forecasts for the 2Q, 3Q, and 4Q sequential quarterly IC market increases in 2010 include a relatively flat 2Q, a 9% increase in 3Q, and a moderate 3% increase in 4Q. These sequential growth rate forecasts remain essentially unchanged from our previous expectations. Thus, with only a moderate seasonal increase forecast for the IC market in the second half of this year, IC Insights’ 27% growth forecast for 2010 still can be considered conservative!


Figure 1

Report Details

The 2010 McClean Report provides many more details about the 2010-2014 IC market trends. Packed with 400 tables and graphs, the 2010 edition of The McClean Report is available in three-ring binder, CD-ROM, and on-line formats. Included with the subscription are free monthly updates by e-mail from March through November. A single copy of the report in CD-ROM or binder format is priced at $2,890. A bundled CD-binder set is priced at $3,385. An Internet access password is available as a $695 option. The report is also available under a multi-user corporate license for $5,990.

For more information, please visit www.icinsights.com/prodsrvs/mcclean/.

More Information Contact

For more information, contact: Bill McClean, president of IC Insights, phone: +1-480-348-1133, e-mail: bill@icinsights.com.

About IC Insights

IC Insights, Inc., based in Scottsdale, Arizona, is dedicated to providing high-quality, cost-effective market research for the semiconductor industry. Founded in 1997, IC Insights offers coverage of global economic trends, semiconductor market forecasts, capital spending and fab capacity trends, product market details, and technology trends, as well as complete IC company profiles and evaluations of end-use applications driving demand for ICs. For more information, contact +1-480-348-1133 or info@icinsights.com, or visit www.icinsights.com.

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IEEE International HLD Validation and Test Workshop 2010

Anaheim Convention Center (co-located with DAC 2010)

June 10-12, 2010

http://www.hldvt.com/10/

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DAC

Anaheim, CA
June 13-18, 2010
http://www.dac.com/47th/index.aspx

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ESC Chicago

Chicago, IL
06/08/2010-06/09/2010
http://esc-chicago.techinsightsevents.com/

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ESC Chicago

Chicago, IL
06/08/2010-06/09/2010
http://esc-chicago.techinsightsevents.com/

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International CTIA Wireless 2010

Las Vegas, NV 

March 23-25

http://www.ctiawireless.com/

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ESC Silicon Valley

April 26th-29th

San Jose, CA

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DAC

Anaheim, CA
June 13-18, 2010
http://www.dac.com/47th/index.aspx

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RTECC Ottawa

Ottawa, ON
June 10, 2010 http://www.rtecc.com/conferences/view/31

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RTECC Montreal

Montreal, QC
June 8, 2010 http://www.rtecc.com/conferences/view/30

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RTECC Minneapolis

Minneapolis, MN
March 11, 2010
http://www.rtecc.com/conferences/view/21

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RTECC Montreal

Montreal, QC
June 8, 2010
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RTECC Montreal

Montreal, QC
June 8, 2010
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IEEE International HLD Validation and Test Workshop 2010

Anaheim Convention Center (co-located with DAC 2010)

June 10-12, 2010

http://www.hldvt.com/10/

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IEEE International HLD Validation and Test Workshop 2010

Anaheim Convention Center (co-located with DAC 2010)

June 10-12, 2010

http://www.hldvt.com/10/

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IEEE International HLD Validation and Test Workshop 2010

Anaheim Convention Center (co-located with DAC 2010)

June 10-12, 2010

http://www.hldvt.com/10/

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IEEE International HLD Validation and Test Workshop 2010

Anaheim Convention Center (co-located with DAC 2010)

June 10-12, 2010

http://www.hldvt.com/10/

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RTECC Copenhagen

Copenhagen, Denmark
December 9, 2010
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RTECC Copenhagen

Copenhagen, Denmark
December 9, 2010
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RTECC Copenhagen

Copenhagen, Denmark
December 9, 2010
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RTECC Gothenburg

Gothenberg, Sweden
December 7, 2010
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RTECC Gothenburg

Gothenberg, Sweden
December 7, 2010
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RTECC Phoenix

Phoenix, AZ
December 2, 2010
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RTECC Phoenix

Phoenix, AZ
December 2, 2010
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RTECC Los Angeles JPL

Los Angeles, CA
November 18, 2010
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RTECC Los Angeles JPL

Los Angeles, CA
November 18, 2010
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RTECC San Diego

San Diego, CA M
November 16, 2010
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November 16, 2010
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Electronica 2010

Munich, Germany
11/09/2010-11/12/2010
http://www.electronica.de/en

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Electronica 2010

Munich, Germany
11/09/2010-11/12/2010
http://www.electronica.de/en

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Electronica 2010

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AdvancedTCA Summit

Santa Clara, CA
11/9/2010 -11/11/2010
http://www.advancedtcasummit.com/

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AdvancedTCA Summit

Santa Clara, CA
11/9/2010 -11/11/2010
http://www.advancedtcasummit.com/

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MILCOM 2010

San Jose, CA
10/31/2010 – 11/3/2010
http://www.milcom.org/index.asp

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MILCOM 2010

San Jose, CA
10/31/2010 – 11/3/2010
http://www.milcom.org/index.asp

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ARM TechCon3

Santa Clara, CA 
10/26/2010 – 10/28/2010
http://techcon3.com/2009/

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ARM TechCon3

Santa Clara, CA 
10/26/2010 – 10/28/2010
http://techcon3.com/2009/

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RTECC WPAFB

Wright-Patterson AFB, Ohio
October 22, 2010
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RTECC WPAFB

Wright-Patterson AFB, Ohio
October 22, 2010
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ESC London

London, England
October 20-21
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ESC London

London, England
October 20-21
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RTECC Washington DC

Washington DC
October 19, 2010
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RTECC Washington DC

Washington DC
October 19, 2010
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SAE Convergence 2010

Detroit, MI
10/19/2010-10/20/2010
http://www.sae.org/events/convergence/

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SAE Convergence 2010

Detroit, MI
10/19/2010-10/20/2010
http://www.sae.org/events/convergence/

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ESC Boston

Boston, MA
09/20/2010-09/23/2010
http://esc-boston.techinsightsevents.com/

 

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ESC Boston

Boston, MA
09/20/2010-09/23/2010
http://esc-boston.techinsightsevents.com/

 

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RTECC Austin

Austin, TX
September 14, 2010
http://www.rtecc.com/

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RTECC Austin

Austin, TX
September 14, 2010
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International IC – China Conference & Expo

Dongguan, China 
September 16-17, 2010
http://www.english.iic-china.com/

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International IC – China Conference & Expo

Dongguan, China 
September 16-17, 2010
http://www.english.iic-china.com/

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RTECC Cheng-du

Cheng-du, China
September 16, 2010
http://www.rtecc.com/

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RTECC Cheng-du

Cheng-du, China
September 16, 2010
http://www.rtecc.com/

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RTECC Austin

Austin, TX
September 14, 2010
http://www.rtecc.com/

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RTECC Xi’an

Xi’an, China
September 13, 2010
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RTECC Xi’an

Xi’an, China
September 13, 2010
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International IC – China Conference & Expo

Wuhan, China 
September 13-14, 2010
http://www.english.iic-china.com/

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Wuhan, China 
September 13-14, 2010
http://www.english.iic-china.com/

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RTECC Shenzhen

Shenzhen, China
September 10, 2010
http://www.rtecc.com/

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RTECC Shenzhen

Shenzhen, China
September 10, 2010
http://www.rtecc.com/

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RTECC Shanghai

Shanghai, China
September 7, 2010
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RTECC Shanghai

Shanghai, China
September 7, 2010
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RTECC Beijing

Beijing, China
September 3, 2010
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RTECC Beijing

Beijing, China
September 3, 2010
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RTECC Vancouver

Vancouver, BC

August 26, 2010
http://www.rtecc.com/

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RTECC Vancouver

Vancouver, BC

August 26, 2010
http://www.rtecc.com/

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RTECC Seattle

Seattle, WA
August 24, 2010
http://www.rtecc.com/

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RTECC Seattle

Seattle, WA
August 24, 2010
http://www.rtecc.com/

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Flash Memory Summit & Expo

Santa Clara, CA  
August 17-19
http://www.flashmemorysummit.com/

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Flash Memory Summit & Expo

Santa Clara, CA  
August 17-19
http://www.flashmemorysummit.com/

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RTECC Portland

Portland, OR
July 27, 2010
http://www.rtecc.com/conferences/view/32

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RTECC Portland

Portland, OR
July 27, 2010
http://www.rtecc.com/conferences/view/32

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RTECC Portland

Portland, OR
July 27, 2010
http://www.rtecc.com/conferences/view/32

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ESC India

Bangalore, India 
July 21-23
http://www.esc-india.com/

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ESC India

Bangalore, India 
July 21-23
http://www.esc-india.com/

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Semicon West

San Francisco, CA 
07/13/2010 – 07/15/2010
http://www.semiconwest.org/index.htm

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Semicon West

San Francisco, CA 
07/13/2010 – 07/15/2010
http://www.semiconwest.org/index.htm

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RTECC Ontario

Toronto, ON
June 25, 2010 http://www.rtecc.com/conferences/view/31

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RTECC Ontario

Toronto, ON
June 25, 2010
http://www.rtecc.com/conferences/view/31

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RTECC Ontario

Toronto, ON
June 25, 2010
http://www.rtecc.com/conferences/view/31

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RTECC Pittsburgh

Pittsburgh, PA
June 22, 2010
http://www.rtecc.com/conferences/view/28

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RTECC Pittsburgh

Pittsburgh, PA
June 22, 2010 http://www.rtecc.com/conferences/view/28

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RTECC Pittsburgh

Pittsburgh, PA
June 22, 2010
http://www.rtecc.com/conferences/view/28

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DAC

Anaheim, CA
June 13-18, 2010
http://www.dac.com/47th/index.aspx

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DAC

Anaheim, CA
June 13-18, 2010

http://www.dac.com/47th/index.aspx

 

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DAC

Anaheim, CA
June 13-18, 2010

http://www.dac.com/47th/index.aspx

 

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RTECC Ottawa

Ottawa, ON
June 10, 2010 http://www.rtecc.com/conferences/view/31

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RTECC Ottawa

Ottawa, ON
June 10, 2010
http://www.rtecc.com/conferences/view/31

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RTECC Ottawa

Ottawa, ON
June 10, 2010
http://www.rtecc.com/conferences/view/31

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RTECC Montreal

Montreal, QC
June 8, 2010 http://www.rtecc.com/conferences/view/30

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RTECC Montreal

Montreal, QC
June 8, 2010
http://www.rtecc.com/conferences/view/30

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RTECC Montreal

Montreal, QC
June 8, 2010
http://www.rtecc.com/conferences/view/30

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Telematics Detroit 2010

Detroit, MI
06/08/2010 – 06/20/2010
http://www.telematicsupdate.com/detroit/index.shtml

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Telematics Detroit 2010

Detroit, MI
06/08/2010 – 06/20/2010
http://www.telematicsupdate.com/detroit/index.shtml

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Sensors Conference & Expo

Chicago, IL
06/08/2010-06/09/2010
http://www.sensorsexpo.com/

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Sensors Conference & Expo

Chicago, IL
06/08/2010-06/09/2010
http://www.sensorsexpo.com/

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ESC Chicago

Chicago, IL
06/08/2010-06/09/2010
http://esc-chicago.techinsightsevents.com/

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ESC Chicago

Chicago, IL
06/08/2010-06/09/2010
http://esc-chicago.techinsightsevents.com/

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ESC Chicago

Chicago, IL
06/08/2010-06/09/2010
http://esc-chicago.techinsightsevents.com/

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RTECC Philadelphia

Philadephia, PA
May 27, 2010
http://www.rtecc.com/conferences/view/27

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RTECC Philadelphia

Philadephia, PA
May 27, 2010
http://www.rtecc.com/conferences/view/27

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RTECC Philadelphia

Philadephia, PA
May 27, 2010
http://www.rtecc.com/conferences/view/27

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RTECC Boston

Boston, MA
May 25, 2010
http://www.rtecc.com/conferences/view/26

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RTECC Boston

Boston, MA
May 25, 2010
http://www.rtecc.com/conferences/view/26

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ESEC

Tokyo, Japan
May 12-14, 2010
http://www.esec.jp/en/

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ESEC

Tokyo, Japan
May 12-14, 2010
http://www.esec.jp/en/

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ESEC

Tokyo, Japan
May 12-14, 2010
http://www.esec.jp/en/

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System-Level Design: Mind the Gap

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ESC Silicon Valley

April 26th-29th

San Jose, CA

http://esc-sv09.techinsightsevents.com/

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ESC Silicon Valley

San Jose, CA

http://esc-sv09.techinsightsevents.com/

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ESC Silicon Valley

San Jose, CA

http://esc-sv09.techinsightsevents.com/

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RTECC Fort Watson Beac

Fort Watson Beach, FL 

April 15, 2010

http://www.rtecc.com/conferences/view/25

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RTECC Fort Watson Beac

Fort Watson Beach, FL 

April 15, 2010

http://www.rtecc.com/conferences/view/25

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RTECC Melbourne

Fort Watson Beach, FL 

April 15, 2010

http://www.rtecc.com/conferences/view/22

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RTECC Melbourne

Fort Watson Beach, FL 

April 15, 2010

http://www.rtecc.com/conferences/view/22

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RTECC Melbourne

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IDF 2010 Beijing

Beijing, China 

April 13-14, 2010 

http://www.intel.com/IDF/

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IDF 2010 Beijing

Beijing, China 

April 13-14, 2010 

http://www.intel.com/IDF/

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International CTIA Wireless 2010

Las Vegas, NV 

March 23-25

http://www.ctiawireless.com/

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International CTIA Wireless 2010

Las Vegas, NV 

March 23-25

http://www.ctiawireless.com/

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International CTIA Wireless 2010

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International IC – China Conference & Expo

Shanghai, China 

March 15-16, 2010

http://www.english.iic-china.com/

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International IC – China Conference & Expo

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International IC – China Conference & Expo

Chengdu, China 

March 11-12

http://www.english.iic-china.com/

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International IC – China Conference & Expo

Chengdu, China 

March 11-12

http://www.english.iic-china.com/

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RTECC Minneapolis

Minneapolis, MN
March 11, 2010
http://www.rtecc.com/conferences/view/21

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RTECC Minneapolis

Minneapolis, MN 

March 11, 2010

http://www.rtecc.com/conferences/view/21

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RTECC Minneapolis

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RTECC Chicago

Chicago, IL 

March 9, 2010

http://www.rtecc.com/conferences/view/23

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RTECC Chicago

Chicago, IL 

March 9, 2010

http://www.rtecc.com/conferences/view/23

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RTECC Chicago

Chicago, IL 

March 9, 2010

http://www.rtecc.com/conferences/view/23

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RTECC Chicago

Chicago, IL 

March 9, 2010

http://www.rtecc.com/conferences/view/23

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DATE 2010

Dresden, Germany 

March 8 -12, 2010

http://www.date-conference.com/

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DATE 2010

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International IC –China Conference & Expo

Shenzhen, China 

March 4-5 

http://www.english.iic-china.com/

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International IC –China Conference & Expo

Shenzhen, China 

March 4-5 

http://www.english.iic-china.com/

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Embedded World 2010

Embedded World 2010

Nuremberg, Germany

March 2-4, 2010

http://www.embedded-world.de/en/default.ashx

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Embedded World 2010

Nuremberg, Germany

March 2-4, 2010

http://www.embedded-world.de/en/default.ashx

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Embedded World 2010

Embedded World 2010

Nuremberg, Germany

March 2-4, 2010

http://www.embedded-world.de/en/default.ashx

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Embedded World 2010

Embedded World 2010

Nuremberg, Germany

March 2-4, 2010

http://www.embedded-world.de/en/default.ashx

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Network Power Launches Three New Embedded Computing Platforms Powered by Next-Generation Intel® Core™ Processors

Tempe, Ariz. [January 7, 2010] – Emerson Network Power, a business of Emerson (NYSE:EMR) and the global leader in enabling Business-Critical Continuity™, today announced three new embedded computing platforms powered by the latest Intel® Core™ i7 and Intel® Core™ i5 processors, which were launched today by Intel®.

These new embedded computing platforms are available in a range of form factors, including COM Express®, MicroATX and 6U VME and Emerson Network Power will continue to add more form factors. Emerson Network Power is rapidly growing its portfolio of long-life, reliable, Intel processor-based products for a wide variety of industries including retail, industrial automation, medical and military/aerospace applications. The Intel® Core™ i7 and Intel® Core™ i5 processors use next-generation 32 nanometer manufacturing process technology, providing system integrators with significant increases in performance and energy efficiency.

“The launch of Emerson Network Power’s first VMEbus platform to feature an Intel processor represents our ongoing portfolio diversification to support a broad range of industries,” said Paul Virgo, director of marketing, Embedded Computing, Emerson Network Power. “Coupled with new embedded motherboards that are closely aligned with availability of the latest silicon and over 30 years experience in the industry, Emerson continues to be the clear choice for reliable, long life embedded computing products.”

“By introducing several new platforms based on the new Intel® Core™ i7 and i5 processors, Emerson Network Power expands their portfolio of Intel processor-based motherboards, modules and platforms,” said Ryan Parker, director of marketing, Embedded Computing Division, Intel. “These new platforms provide system integrators with the performance and features needed to power a wide variety of next-generation embedded solutions.”

COMX-CORE Series COM Express modules

Based on the Type 6 COM Express R2.0 form factor (95 by 125 mm), the COMX-CORE-7X0 and COMX-CORE-5X0 feature Intel® Core™ i7 processor 2.0 GHz and 1.06 GHz variants or the Intel® Core™ i5 processor at 2.4 GHz and the mobile Intel® QM57 Express chipset. Two SO-DIMM (non-ECC) sockets can accommodate up to 8GB DDR3 memory and an optional eUSB flash module extends on-module storage. Connectivity includes one PCI Express x16 and seven PCI Express x1 expansion sockets, one Gigabit Ethernet, four SATA and eight USB 2.0 ports. Emerson Network Power’s new COM Express modules support dual simultaneous displays without the need for an additional graphics card.

MATXM-CORE-411-B MicroATX motherboard

This next-generation Emerson Network Power MicroATX motherboard (244 by 244 mm) features Intel® Core™ i7 processor variants up to 2.66 GHz, the mobile Intel® QM57 Express chipset and two SO-DIMM sockets for up to 8GB DDR3 memory. Connectivity includes one PCI Express x16, three PCI Express x1 expansion sockets and a PCI Express Mini Card socket for WiFi/WiMAX wireless connections. PoweredUSB ports are suitable for powering devices such as bar code scanners and POS printers without additional power supplies. The motherboard supports dual simultaneous displays with HDMI, VGA and dual channel LVDS connections for high resolution output. An optional midplane enables easy, cost-effective maintenance.

iVME7210 6U VMEbus board

Featuring Intel® Core™ i7 processor variants up to 2.0 GHz and the mobile Intel® QM57 Express chipset, Emerson Network Power’s new iVME7210 is designed for a range of industrial, medical and military/aerospace applications including robotics, image processing, radar/sonar, C4ISR and signal intelligence. On-board memory includes up to 8GB DDR3 memory and 256KB non-volatile Ferroelectric Random Access Memory (FeRAM). FeRAM does not require batteries or periodic refreshes and offers many more read/write cycles and faster performance than flash memory, which benefits critical non-volatile data storage, data logs and dynamic program updates. Connectivity includes four Gigabit Ethernet ports, up to five USB 2.0 ports, five serial ports, two SATA ports and dual XMC sites or one XMC site plus SATA HDD.

The board’s Digital Visual Interface (DVI) provides support for high quality digital graphics and the integrated Trusted Platform Module enhances data security and encryption capabilities. The iVME7210 supports a range of operating system and software options including Wind River VxWorks, Linux and LynuxWorks LynxOS. Extended temperature and rugged versions will be available via Emerson Network Power alliance partners.

About Emerson Network Power

Emerson Network Power, a business of Emerson (NYSE:EMR), is the global leader in enabling Business-Critical Continuity™ from grid to chip for telecommunication networks, data centers, health care and industrial facilities. Emerson Network Power provides innovative solutions and expertise in areas including AC and DC power and precision cooling systems, embedded computing and power, integrated racks and enclosures, power switching and controls, monitoring, and connectivity. All solutions are supported globally by local Emerson Network Power service technicians. For more information on Emerson Network Power’s embedded computing products and services including ATCA®, COM Express®, CompactPCI®, embedded motherboards, MicroTCA®, VMEbus and OpenSAF® for original equipment manufacturers and systems integrators in the telecommunications, industrial, aerospace/defense and medical markets, visit www.EmersonNetworkPower.com/EmbeddedComputing. Learn more about Emerson Network Power products and services at www.EmersonNetworkPower.com.

About Emerson

Emerson (NYSE:EMR), based in St. Louis, Missouri (USA), is a global leader in bringing technology and engineering together to provide innovative solutions to customers through its network power, process management, industrial automation, climate technologies, and appliance and tools businesses. Emerson’s sales in fiscal 2009 were $20.9 billion. The company is ranked 94th on the Fortune 500 list of America’s largest companies. For more information, visit www.Emerson.com.

Contact Information

Emerson Network Power
Emerson Network Power

2900 S. Diablo Way, Suite 190
Tempe, AZ, 85282
USA

toll-free: 800-759-1107
fax: 602-438-5720
EmbeddedComputingSales@emerson.com
emersonnetworkpower.com/embeddedcomputing/

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Network Power Launches Three New Embedded Computing Platforms Powered by Next-Generation Intel® Core™ Processors

Tempe, Ariz. [January 7, 2010] – Emerson Network Power, a business of Emerson (NYSE:EMR) and the global leader in enabling Business-Critical Continuity™, today announced three new embedded computing platforms powered by the latest Intel® Core™ i7 and Intel® Core™ i5 processors, which were launched today by Intel®.

These new embedded computing platforms are available in a range of form factors, including COM Express®, MicroATX and 6U VME and Emerson Network Power will continue to add more form factors. Emerson Network Power is rapidly growing its portfolio of long-life, reliable, Intel processor-based products for a wide variety of industries including retail, industrial automation, medical and military/aerospace applications. The Intel® Core™ i7 and Intel® Core™ i5 processors use next-generation 32 nanometer manufacturing process technology, providing system integrators with significant increases in performance and energy efficiency.

“The launch of Emerson Network Power’s first VMEbus platform to feature an Intel processor represents our ongoing portfolio diversification to support a broad range of industries,” said Paul Virgo, director of marketing, Embedded Computing, Emerson Network Power. “Coupled with new embedded motherboards that are closely aligned with availability of the latest silicon and over 30 years experience in the industry, Emerson continues to be the clear choice for reliable, long life embedded computing products.”

“By introducing several new platforms based on the new Intel® Core™ i7 and i5 processors, Emerson Network Power expands their portfolio of Intel processor-based motherboards, modules and platforms,” said Ryan Parker, director of marketing, Embedded Computing Division, Intel. “These new platforms provide system integrators with the performance and features needed to power a wide variety of next-generation embedded solutions.”

COMX-CORE Series COM Express modules

Based on the Type 6 COM Express R2.0 form factor (95 by 125 mm), the COMX-CORE-7X0 and COMX-CORE-5X0 feature Intel® Core™ i7 processor 2.0 GHz and 1.06 GHz variants or the Intel® Core™ i5 processor at 2.4 GHz and the mobile Intel® QM57 Express chipset. Two SO-DIMM (non-ECC) sockets can accommodate up to 8GB DDR3 memory and an optional eUSB flash module extends on-module storage. Connectivity includes one PCI Express x16 and seven PCI Express x1 expansion sockets, one Gigabit Ethernet, four SATA and eight USB 2.0 ports. Emerson Network Power’s new COM Express modules support dual simultaneous displays without the need for an additional graphics card.

MATXM-CORE-411-B MicroATX motherboard

This next-generation Emerson Network Power MicroATX motherboard (244 by 244 mm) features Intel® Core™ i7 processor variants up to 2.66 GHz, the mobile Intel® QM57 Express chipset and two SO-DIMM sockets for up to 8GB DDR3 memory. Connectivity includes one PCI Express x16, three PCI Express x1 expansion sockets and a PCI Express Mini Card socket for WiFi/WiMAX wireless connections. PoweredUSB ports are suitable for powering devices such as bar code scanners and POS printers without additional power supplies. The motherboard supports dual simultaneous displays with HDMI, VGA and dual channel LVDS connections for high resolution output. An optional midplane enables easy, cost-effective maintenance.

iVME7210 6U VMEbus board

Featuring Intel® Core™ i7 processor variants up to 2.0 GHz and the mobile Intel® QM57 Express chipset, Emerson Network Power’s new iVME7210 is designed for a range of industrial, medical and military/aerospace applications including robotics, image processing, radar/sonar, C4ISR and signal intelligence. On-board memory includes up to 8GB DDR3 memory and 256KB non-volatile Ferroelectric Random Access Memory (FeRAM). FeRAM does not require batteries or periodic refreshes and offers many more read/write cycles and faster performance than flash memory, which benefits critical non-volatile data storage, data logs and dynamic program updates. Connectivity includes four Gigabit Ethernet ports, up to five USB 2.0 ports, five serial ports, two SATA ports and dual XMC sites or one XMC site plus SATA HDD.

The board’s Digital Visual Interface (DVI) provides support for high quality digital graphics and the integrated Trusted Platform Module enhances data security and encryption capabilities. The iVME7210 supports a range of operating system and software options including Wind River VxWorks, Linux and LynuxWorks LynxOS. Extended temperature and rugged versions will be available via Emerson Network Power alliance partners.

About Emerson Network Power

Emerson Network Power, a business of Emerson (NYSE:EMR), is the global leader in enabling Business-Critical Continuity™ from grid to chip for telecommunication networks, data centers, health care and industrial facilities. Emerson Network Power provides innovative solutions and expertise in areas including AC and DC power and precision cooling systems, embedded computing and power, integrated racks and enclosures, power switching and controls, monitoring, and connectivity. All solutions are supported globally by local Emerson Network Power service technicians. For more information on Emerson Network Power’s embedded computing products and services including ATCA®, COM Express®, CompactPCI®, embedded motherboards, MicroTCA®, VMEbus and OpenSAF® for original equipment manufacturers and systems integrators in the telecommunications, industrial, aerospace/defense and medical markets, visit www.EmersonNetworkPower.com/EmbeddedComputing. Learn more about Emerson Network Power products and services at www.EmersonNetworkPower.com.

About Emerson

Emerson (NYSE:EMR), based in St. Louis, Missouri (USA), is a global leader in bringing technology and engineering together to provide innovative solutions to customers through its network power, process management, industrial automation, climate technologies, and appliance and tools businesses. Emerson’s sales in fiscal 2009 were $20.9 billion. The company is ranked 94th on the Fortune 500 list of America’s largest companies. For more information, visit www.Emerson.com.

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Interphase Introduces the iSPAN® 36702 Wireless Base Station AdvancedMC®

Interphase, Wintegra, Xilinx & Aricent collaborate on innovative, low-cost LTE base station

PLANO, Texas – January 25, 2010 – Interphase Corporation (NASDAQ: INPH), a leading global provider of solutions for converged communications networks, is pleased to announce the iSPAN 36702 Wireless Base Station Module. It supports all of the functions of a Wireless Base Station except the radio and is designed for use in 4G networks, including the LTE eNodeB and next generation WiMAX base stations. The iSPAN 36702 integrates LTE technology from Wintegra, Xilinx, and Aricent® for eNodeB solutions and is easily tailored to our customer’s needs for a variety of wireless broadband applications. Interphase offers professional integration services to help our customers modify any of these solutions to meet their stringent requirements, regardless of the application.

 “The iSPAN 36702 represents a major step forward in reducing the size and cost of wireless base stations while reducing the time to market for base station developers by providing an off-the-shelf hardware solution,” said Marc DeVinney, vice president of Engineering at Interphase. “With the addition of a radio module, a complete wireless base station can be integrated into a very compact solution. For serving a larger user count, the iSPAN 36702 can be combined with a processor AdvancedMC (AMC) such as the Interphase iSPAN 36CA or iSPAN 36MC2 to easily scale."

The iSPAN 36702 is ideal for use in small wireless base stations serving up to 100 users in a single sector such as Picocells and Enterprise Femtocells. It supports:

  • Wireless Control (MAC, RLC, PDCP, RRC) and LTE Protocols (S1-AP, X2-AP)
  • Backhaul and Air interface security processing
  • Wireless Baseband (LTE PHY)
  • Radio Interface

“The iSPAN 36702 solves a growing need of OEMs to provide scalable, modular base station designs that also meet very aggressive cost, power, and time-to-market requirements,” said Colin Alexander, Director of Wireless Marketing at Wintegra. “This single card design from Interphase provides full “IP to IQ” capability in a manner that can scale from small picocells to micro or macro LTE base stations, and does so in a very compact and flexible form factor.”

The iSPAN 36702 features three Optical Interfaces on the front panel for CPRI/OBSAI Baseband interfaces or Gigabit Ethernet interfaces and up to 11 Serdes links on the AMC connector for a combination of Gigabit Ethernet, Serial RapidIO and PCI-Express™ links. It is powered by the Wintegra™ WinPath3™ Network Processor, Xilinx® Virtex®-6 FPGA, and Aricent’s industry-proven 4G software framework solution. The Network Processor provides traffic policing and shaping, protocol conversion, and switching capability. The WinPath3 also implements the MAC layer and provides two MIPS core processors that are used to host Aricent’s eNodeB framework, which provides Layer 3/RRM application functionality. The Virtex-6 provides the baseband PHY which is tightly integrated with the WinPath3 MAC Layer.

“Aricent is very excited to be part of the LTE ecosystem with partners such as Interphase, Wintegra and Xilinx” said C.P. Murali, senior vice president at Aricent.  “Building on Aricent’s success in the Base Station evolution from GSM to HSPA, Aricent continues to play a significant role in architecting next generation of LTE Base Stations, with a number of design wins in this space.”

In addition to this Wireless Base Station module, Interphase provides experienced design services to expertly handle custom wireless projects. Learn more now about how Interphase can help you with your high-speed wireless application.

To make an appointment to see the iSPAN 36702 at the 2010 GSMA Mobile World Congress in Barcelona, February 15-18, or for iSPAN 36702 pricing and availability, please contact us.

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, and packet processing for key applications for the communications, Mil/Aero, and enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with sales offices across the globe. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, and Sun Microsystems. Visit www.iphase.com.

###

Interphase, the Interphase logo, and iSPAN are trademarks or registered trademarks of Interphase Corporation. All other trademarks are the property of their respective owners.

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Interphase and Aricent Collaborate with Mindspeed to Create Easily Scalable 4G Basestation Platforms Using a Single Chip

NEWPORT BEACH, Calif., Feb 04, 2010 (BUSINESS WIRE) — Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that it is collaborating with Interphase (NASDAQ:INPH), a leader in embedded networking and communications solutions, and Aricent(R) a global innovation, technology and services company focused exclusively on communications, on the Interphase iSPAN 36701 Wireless Base Station Advanced Mezzanine Card (AdvancedMC(TM)). Mindspeed (R)’s Transcede(TM) 4000 baseband processor system-on-chip (SoC) will power the iSPAN 36701, which targets 4G wireless basestation applications. Aricent delivers LTE software running
on the Transcede processor as part of the complete iSPAN 36701 LTE reference solution.

"We are very pleased that Interphase has selected the Transcede 4000 baseband processor for their AdvancedMC eNodeB solution," said Alan Taylor, marketing director for baseband processing solutions at Mindspeed. "The iSPAN 36701, coupled with Aricent’s LTE software stack running on the Transcede 4000 SoC, enables manufacturers of LTE picocells and enterprise femtocells to develop a complete LTE eNodeB application in an industry-standard form factor, rapidly accelerating time to market while significantly reducing system cost."

Mindspeed’s Transcede processors deliver a new class of high-performance silicon designed to meet the huge increase in basestation computational complexity caused by the migration from a voice-centric 2G/3G mobile network to a data-centric 3G+/4G mobile network. This new class of silicon replaces today’s traditional approach, which combines a complex set of general-purpose digital signal processors (DSPs) plus field
programmable gate arrays (FPGAs) and networking processing units (NPUs).

"Aricent is very excited to broaden our participation in the LTE ecosystem with partners such as Mindspeed and Interphase," said C.P. Murali, senior vice president at Aricent. "LTE is a key focus area for Aricent and we continue to be recognized in the industry for our advanced LTE frameworks and services offerings for both access and core networks."

Aricent’s LTE eNodeB reference framework is based on a flexible architecture and is pre-optimized and benchmarked for performance. The reference framework includes Layer 2 (MAC, RLC, PDCP) and Layer 3 (S2AP / X1AP) modules and all transport stacks including evolved GPRS tunneling protocol-user (eGTP-U) and stream control transmission protocol (SCTP). Aricent’s LTE reference framework is integrated with an LTE reference physical layer (PHY) implemented by Mindspeed.

"In selecting the Transcede 4000 baseband processor for the Interphase iSPAN 36701 Wireless Base Station AdvancedMC, we have reduced the size and cost by at least half compared to currently available basestation solutions," said Marc DeVinney, vice president of engineering at Interphase. "The solution integrates
everything that is needed in a wireless basestation, except for the radio, into a very compact form factor. In addition, the LTE reference software from Aricent and Mindspeed will accelerate the time to market for basestation developers by providing an off-the-shelf, integrated solution."

The iSPAN 36701 is targeted for use in a 4G network element such as an LTE eNodeB or next-generation WiMAX base station. For solution providers seeking a form factor other than AdvancedMC, the underlying technology of the iSPAN 36701 can be easily converted to other small footprint form factors. "We are committed to supporting this LTE reference design, and plan to further enhance and modify it to meet the specific needs of solution providers," DeVinney added.

Mindspeed’s Transcede family can be used to develop 4G equipment for LTE frequency division duplex (LTEFDD), LTE time-division duplex (TD-LTE, in China), time-division synchronous code division multiple access (TD-SCDMA, in China), and WiMax 802.16d,16e and 16m, as well as 3G wideband code-division multiple access (W-CDMA) NodeB systems. The Transcede family’s scalable hardware architecture enables the same software to be used for picocells, microcells and macrocells, as well as future low-cost enterprise femtocell designs once industry standards and product requirements solidify.

About Mindspeed Technologies

Mindspeed Technologies, Inc. designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes today’s separate but interrelated and converging enterprise, broadband access, metropolitan and wide area networks. Our products are classified into three focused product families: multiservice access, high-performance analog and
wide area networking communications. Our products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment, including voice and media gateways, high–speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers, digital loop carrier
equipment, IP private branch exchanges (PBXs), optical modules, broadcast video systems and wireless basestation equipment.

To learn more, visit us at www.mindspeed.com.

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, and packet processing for key applications for the communications, Mil/Aero, and enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with sales offices across the globe. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, andSun Microsystems. Visit www.iphase.com.

About Aricent

Aricent is a global innovation, technology and services company focused exclusively on communications. Aricent combines the leading innovation capabilities of frog design with unparalleled domain expertise in communications as a strategic supplier to the world’s foremost infrastructure, application and service providers. The company’s investors include Kohlberg Kravis Roberts & Co., Sequoia Capital, The Family
Office and The Canadian Pension Plan Investment Board. For more information, visit
http://www.aricent.com

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding the company’s expectations, goals or intentions, including, but not limited to, product features and their benefits. These forward-looking statements are based on management’s current expectations, estimates, forecasts and projections about the company and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward looking statements. These risks and uncertainties include, but are not limited to: cash requirements and terms and availability of financing; future operating losses; worldwide political and economic uncertainties, and specific conditions in the markets we address; fluctuations in the price of our common stock and our operating results; loss of or diminished demand from one or more key customers or distributors; our ability to attract and retain qualified personnel; constraints in the supply of wafers and other product components
from our third-party manufacturers; pricing pressures and other competitive factors; successful development and introduction of new products; doing business internationally and our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; industry consolidation; order and shipment uncertainty; our ability to obtain design wins and develop revenues from them; lengthy sales cycles; the expense of and our ability to defend our intellectual property against infringement claims by others; product defects and bugs; business acquisitions and investments; and our ability to utilize our net operating loss carryforwards and certain other tax attributes. Risks and uncertainties that could cause the company’s actual results to differ from those set forth in any forward-looking statement are discussed in
more detail under "Risk Factors" and "Management’s Discussion and Analysis of Financial Condition and Results of Operations" in the company’s Annual Report on Form 10-K for the year ended October 2, 2009, as well as similar disclosures in the company’s subsequent SEC filings. Forward-looking statements contained in this press release are made only as of the date hereof, and the company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

SOURCE: Mindspeed Technologies, Inc.

Editorial Contact:
Magnet PR Group
Lisa Briggs, 949-305-5131
lisab@magnetprgroup.com
or
Investor Relations Contact:
Mindspeed Technologies, Inc.
Andrea D. Williams, 949-579-3111

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Interphase and Aricent Collaborate with Mindspeed to Create Easily Scalable 4G Basestation Platforms Using a Single Chip

NEWPORT BEACH, Calif., Feb 04, 2010 (BUSINESS WIRE) — Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that it is collaborating with Interphase (NASDAQ:INPH), a leader in embedded networking and communications solutions, and Aricent(R) a global innovation, technology and services company focused exclusively on communications, on the Interphase iSPAN 36701 Wireless Base Station Advanced Mezzanine Card (AdvancedMC(TM)). Mindspeed (R)’s Transcede(TM) 4000 baseband processor system-on-chip (SoC) will power the iSPAN 36701, which targets 4G wireless basestation applications. Aricent delivers LTE software running
on the Transcede processor as part of the complete iSPAN 36701 LTE reference solution.

"We are very pleased that Interphase has selected the Transcede 4000 baseband processor for their AdvancedMC eNodeB solution," said Alan Taylor, marketing director for baseband processing solutions at Mindspeed. "The iSPAN 36701, coupled with Aricent’s LTE software stack running on the Transcede 4000 SoC, enables manufacturers of LTE picocells and enterprise femtocells to develop a complete LTE eNodeB application in an industry-standard form factor, rapidly accelerating time to market while significantly reducing system cost."

Mindspeed’s Transcede processors deliver a new class of high-performance silicon designed to meet the huge increase in basestation computational complexity caused by the migration from a voice-centric 2G/3G mobile network to a data-centric 3G+/4G mobile network. This new class of silicon replaces today’s traditional approach, which combines a complex set of general-purpose digital signal processors (DSPs) plus field
programmable gate arrays (FPGAs) and networking processing units (NPUs).

"Aricent is very excited to broaden our participation in the LTE ecosystem with partners such as Mindspeed and Interphase," said C.P. Murali, senior vice president at Aricent. "LTE is a key focus area for Aricent and we continue to be recognized in the industry for our advanced LTE frameworks and services offerings for both access and core networks."

Aricent’s LTE eNodeB reference framework is based on a flexible architecture and is pre-optimized and benchmarked for performance. The reference framework includes Layer 2 (MAC, RLC, PDCP) and Layer 3 (S2AP / X1AP) modules and all transport stacks including evolved GPRS tunneling protocol-user (eGTP-U) and stream control transmission protocol (SCTP). Aricent’s LTE reference framework is integrated with an LTE reference physical layer (PHY) implemented by Mindspeed.

"In selecting the Transcede 4000 baseband processor for the Interphase iSPAN 36701 Wireless Base Station AdvancedMC, we have reduced the size and cost by at least half compared to currently available basestation solutions," said Marc DeVinney, vice president of engineering at Interphase. "The solution integrates
everything that is needed in a wireless basestation, except for the radio, into a very compact form factor. In addition, the LTE reference software from Aricent and Mindspeed will accelerate the time to market for basestation developers by providing an off-the-shelf, integrated solution."

The iSPAN 36701 is targeted for use in a 4G network element such as an LTE eNodeB or next-generation WiMAX base station. For solution providers seeking a form factor other than AdvancedMC, the underlying technology of the iSPAN 36701 can be easily converted to other small footprint form factors. "We are committed to supporting this LTE reference design, and plan to further enhance and modify it to meet the specific needs of solution providers," DeVinney added.

Mindspeed’s Transcede family can be used to develop 4G equipment for LTE frequency division duplex (LTEFDD), LTE time-division duplex (TD-LTE, in China), time-division synchronous code division multiple access (TD-SCDMA, in China), and WiMax 802.16d,16e and 16m, as well as 3G wideband code-division multiple access (W-CDMA) NodeB systems. The Transcede family’s scalable hardware architecture enables the same software to be used for picocells, microcells and macrocells, as well as future low-cost enterprise femtocell designs once industry standards and product requirements solidify.

About Mindspeed Technologies

Mindspeed Technologies, Inc. designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes today’s separate but interrelated and converging enterprise, broadband access, metropolitan and wide area networks. Our products are classified into three focused product families: multiservice access, high-performance analog and
wide area networking communications. Our products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment, including voice and media gateways, high–speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers, digital loop carrier
equipment, IP private branch exchanges (PBXs), optical modules, broadcast video systems and wireless basestation equipment.

To learn more, visit us at www.mindspeed.com.

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, and packet processing for key applications for the communications, Mil/Aero, and enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with sales offices across the globe. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, andSun Microsystems. Visit www.iphase.com.

About Aricent

Aricent is a global innovation, technology and services company focused exclusively on communications. Aricent combines the leading innovation capabilities of frog design with unparalleled domain expertise in communications as a strategic supplier to the world’s foremost infrastructure, application and service providers. The company’s investors include Kohlberg Kravis Roberts & Co., Sequoia Capital, The Family
Office and The Canadian Pension Plan Investment Board. For more information, visit
http://www.aricent.com

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding the company’s expectations, goals or intentions, including, but not limited to, product features and their benefits. These forward-looking statements are based on management’s current expectations, estimates, forecasts and projections about the company and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward looking statements. These risks and uncertainties include, but are not limited to: cash requirements and terms and availability of financing; future operating losses; worldwide political and economic uncertainties, and specific conditions in the markets we address; fluctuations in the price of our common stock and our operating results; loss of or diminished demand from one or more key customers or distributors; our ability to attract and retain qualified personnel; constraints in the supply of wafers and other product components
from our third-party manufacturers; pricing pressures and other competitive factors; successful development and introduction of new products; doing business internationally and our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; industry consolidation; order and shipment uncertainty; our ability to obtain design wins and develop revenues from them; lengthy sales cycles; the expense of and our ability to defend our intellectual property against infringement claims by others; product defects and bugs; business acquisitions and investments; and our ability to utilize our net operating loss carryforwards and certain other tax attributes. Risks and uncertainties that could cause the company’s actual results to differ from those set forth in any forward-looking statement are discussed in
more detail under "Risk Factors" and "Management’s Discussion and Analysis of Financial Condition and Results of Operations" in the company’s Annual Report on Form 10-K for the year ended October 2, 2009, as well as similar disclosures in the company’s subsequent SEC filings. Forward-looking statements contained in this press release are made only as of the date hereof, and the company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

SOURCE: Mindspeed Technologies, Inc.

Editorial Contact:
Magnet PR Group
Lisa Briggs, 949-305-5131
lisab@magnetprgroup.com
or
Investor Relations Contact:
Mindspeed Technologies, Inc.
Andrea D. Williams, 949-579-3111

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Interphase and Aricent Collaborate with Mindspeed to Create Easily Scalable 4G Basestation Platforms Using a Single Chip

NEWPORT BEACH, Calif., Feb 04, 2010 (BUSINESS WIRE) — Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that it is collaborating with Interphase (NASDAQ:INPH), a leader in embedded networking and communications solutions, and Aricent(R) a global innovation, technology and services company focused exclusively on communications, on the Interphase iSPAN 36701 Wireless Base Station Advanced Mezzanine Card (AdvancedMC(TM)). Mindspeed (R)’s Transcede(TM) 4000 baseband processor system-on-chip (SoC) will power the iSPAN 36701, which targets 4G wireless basestation applications. Aricent delivers LTE software running
on the Transcede processor as part of the complete iSPAN 36701 LTE reference solution.

"We are very pleased that Interphase has selected the Transcede 4000 baseband processor for their AdvancedMC eNodeB solution," said Alan Taylor, marketing director for baseband processing solutions at Mindspeed. "The iSPAN 36701, coupled with Aricent’s LTE software stack running on the Transcede 4000 SoC, enables manufacturers of LTE picocells and enterprise femtocells to develop a complete LTE eNodeB application in an industry-standard form factor, rapidly accelerating time to market while significantly reducing system cost."

Mindspeed’s Transcede processors deliver a new class of high-performance silicon designed to meet the huge increase in basestation computational complexity caused by the migration from a voice-centric 2G/3G mobile network to a data-centric 3G+/4G mobile network. This new class of silicon replaces today’s traditional approach, which combines a complex set of general-purpose digital signal processors (DSPs) plus field
programmable gate arrays (FPGAs) and networking processing units (NPUs).

"Aricent is very excited to broaden our participation in the LTE ecosystem with partners such as Mindspeed and Interphase," said C.P. Murali, senior vice president at Aricent. "LTE is a key focus area for Aricent and we continue to be recognized in the industry for our advanced LTE frameworks and services offerings for both access and core networks."

Aricent’s LTE eNodeB reference framework is based on a flexible architecture and is pre-optimized and benchmarked for performance. The reference framework includes Layer 2 (MAC, RLC, PDCP) and Layer 3 (S2AP / X1AP) modules and all transport stacks including evolved GPRS tunneling protocol-user (eGTP-U) and stream control transmission protocol (SCTP). Aricent’s LTE reference framework is integrated with an LTE reference physical layer (PHY) implemented by Mindspeed.

"In selecting the Transcede 4000 baseband processor for the Interphase iSPAN 36701 Wireless Base Station AdvancedMC, we have reduced the size and cost by at least half compared to currently available basestation solutions," said Marc DeVinney, vice president of engineering at Interphase. "The solution integrates
everything that is needed in a wireless basestation, except for the radio, into a very compact form factor. In addition, the LTE reference software from Aricent and Mindspeed will accelerate the time to market for basestation developers by providing an off-the-shelf, integrated solution."

The iSPAN 36701 is targeted for use in a 4G network element such as an LTE eNodeB or next-generation WiMAX base station. For solution providers seeking a form factor other than AdvancedMC, the underlying technology of the iSPAN 36701 can be easily converted to other small footprint form factors. "We are committed to supporting this LTE reference design, and plan to further enhance and modify it to meet the specific needs of solution providers," DeVinney added.

Mindspeed’s Transcede family can be used to develop 4G equipment for LTE frequency division duplex (LTEFDD), LTE time-division duplex (TD-LTE, in China), time-division synchronous code division multiple access (TD-SCDMA, in China), and WiMax 802.16d,16e and 16m, as well as 3G wideband code-division multiple access (W-CDMA) NodeB systems. The Transcede family’s scalable hardware architecture enables the same software to be used for picocells, microcells and macrocells, as well as future low-cost enterprise femtocell designs once industry standards and product requirements solidify.

About Mindspeed Technologies

Mindspeed Technologies, Inc. designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes today’s separate but interrelated and converging enterprise, broadband access, metropolitan and wide area networks. Our products are classified into three focused product families: multiservice access, high-performance analog and
wide area networking communications. Our products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment, including voice and media gateways, high–speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers, digital loop carrier
equipment, IP private branch exchanges (PBXs), optical modules, broadcast video systems and wireless basestation equipment.

To learn more, visit us at www.mindspeed.com.

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, and packet processing for key applications for the communications, Mil/Aero, and enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with sales offices across the globe. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, andSun Microsystems. Visit www.iphase.com.

About Aricent

Aricent is a global innovation, technology and services company focused exclusively on communications. Aricent combines the leading innovation capabilities of frog design with unparalleled domain expertise in communications as a strategic supplier to the world’s foremost infrastructure, application and service providers. The company’s investors include Kohlberg Kravis Roberts & Co., Sequoia Capital, The Family
Office and The Canadian Pension Plan Investment Board. For more information, visit
http://www.aricent.com

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding the company’s expectations, goals or intentions, including, but not limited to, product features and their benefits. These forward-looking statements are based on management’s current expectations, estimates, forecasts and projections about the company and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward looking statements. These risks and uncertainties include, but are not limited to: cash requirements and terms and availability of financing; future operating losses; worldwide political and economic uncertainties, and specific conditions in the markets we address; fluctuations in the price of our common stock and our operating results; loss of or diminished demand from one or more key customers or distributors; our ability to attract and retain qualified personnel; constraints in the supply of wafers and other product components
from our third-party manufacturers; pricing pressures and other competitive factors; successful development and introduction of new products; doing business internationally and our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; industry consolidation; order and shipment uncertainty; our ability to obtain design wins and develop revenues from them; lengthy sales cycles; the expense of and our ability to defend our intellectual property against infringement claims by others; product defects and bugs; business acquisitions and investments; and our ability to utilize our net operating loss carryforwards and certain other tax attributes. Risks and uncertainties that could cause the company’s actual results to differ from those set forth in any forward-looking statement are discussed in
more detail under "Risk Factors" and "Management’s Discussion and Analysis of Financial Condition and Results of Operations" in the company’s Annual Report on Form 10-K for the year ended October 2, 2009, as well as similar disclosures in the company’s subsequent SEC filings. Forward-looking statements contained in this press release are made only as of the date hereof, and the company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

SOURCE: Mindspeed Technologies, Inc.

Editorial Contact:
Magnet PR Group
Lisa Briggs, 949-305-5131
lisab@magnetprgroup.com
or
Investor Relations Contact:
Mindspeed Technologies, Inc.
Andrea D. Williams, 949-579-3111

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Interphase and Aricent Collaborate with Mindspeed to Create Easily Scalable 4G Basestation Platforms Using a Single Chip

NEWPORT BEACH, Calif., Feb 04, 2010 (BUSINESS WIRE) — Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that it is collaborating with Interphase (NASDAQ:INPH), a leader in embedded networking and communications solutions, and Aricent(R) a global innovation, technology and services company focused exclusively on communications, on the Interphase iSPAN 36701 Wireless Base Station Advanced Mezzanine Card (AdvancedMC(TM)). Mindspeed (R)’s Transcede(TM) 4000 baseband processor system-on-chip (SoC) will power the iSPAN 36701, which targets 4G wireless basestation applications. Aricent delivers LTE software running
on the Transcede processor as part of the complete iSPAN 36701 LTE reference solution.

"We are very pleased that Interphase has selected the Transcede 4000 baseband processor for their AdvancedMC eNodeB solution," said Alan Taylor, marketing director for baseband processing solutions at Mindspeed. "The iSPAN 36701, coupled with Aricent’s LTE software stack running on the Transcede 4000 SoC, enables manufacturers of LTE picocells and enterprise femtocells to develop a complete LTE eNodeB application in an industry-standard form factor, rapidly accelerating time to market while significantly reducing system cost."

Mindspeed’s Transcede processors deliver a new class of high-performance silicon designed to meet the huge increase in basestation computational complexity caused by the migration from a voice-centric 2G/3G mobile network to a data-centric 3G+/4G mobile network. This new class of silicon replaces today’s traditional approach, which combines a complex set of general-purpose digital signal processors (DSPs) plus field
programmable gate arrays (FPGAs) and networking processing units (NPUs).

"Aricent is very excited to broaden our participation in the LTE ecosystem with partners such as Mindspeed and Interphase," said C.P. Murali, senior vice president at Aricent. "LTE is a key focus area for Aricent and we continue to be recognized in the industry for our advanced LTE frameworks and services offerings for both access and core networks."

Aricent’s LTE eNodeB reference framework is based on a flexible architecture and is pre-optimized and benchmarked for performance. The reference framework includes Layer 2 (MAC, RLC, PDCP) and Layer 3 (S2AP / X1AP) modules and all transport stacks including evolved GPRS tunneling protocol-user (eGTP-U) and stream control transmission protocol (SCTP). Aricent’s LTE reference framework is integrated with an LTE reference physical layer (PHY) implemented by Mindspeed.

"In selecting the Transcede 4000 baseband processor for the Interphase iSPAN 36701 Wireless Base Station AdvancedMC, we have reduced the size and cost by at least half compared to currently available basestation solutions," said Marc DeVinney, vice president of engineering at Interphase. "The solution integrates
everything that is needed in a wireless basestation, except for the radio, into a very compact form factor. In addition, the LTE reference software from Aricent and Mindspeed will accelerate the time to market for basestation developers by providing an off-the-shelf, integrated solution."

The iSPAN 36701 is targeted for use in a 4G network element such as an LTE eNodeB or next-generation WiMAX base station. For solution providers seeking a form factor other than AdvancedMC, the underlying technology of the iSPAN 36701 can be easily converted to other small footprint form factors. "We are committed to supporting this LTE reference design, and plan to further enhance and modify it to meet the specific needs of solution providers," DeVinney added.

Mindspeed’s Transcede family can be used to develop 4G equipment for LTE frequency division duplex (LTEFDD), LTE time-division duplex (TD-LTE, in China), time-division synchronous code division multiple access (TD-SCDMA, in China), and WiMax 802.16d,16e and 16m, as well as 3G wideband code-division multiple access (W-CDMA) NodeB systems. The Transcede family’s scalable hardware architecture enables the same software to be used for picocells, microcells and macrocells, as well as future low-cost enterprise femtocell designs once industry standards and product requirements solidify.

About Mindspeed Technologies

Mindspeed Technologies, Inc. designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes today’s separate but interrelated and converging enterprise, broadband access, metropolitan and wide area networks. Our products are classified into three focused product families: multiservice access, high-performance analog and
wide area networking communications. Our products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment, including voice and media gateways, high–speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers, digital loop carrier
equipment, IP private branch exchanges (PBXs), optical modules, broadcast video systems and wireless basestation equipment.

To learn more, visit us at www.mindspeed.com.

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, and packet processing for key applications for the communications, Mil/Aero, and enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with sales offices across the globe. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, andSun Microsystems. Visit www.iphase.com.

About Aricent

Aricent is a global innovation, technology and services company focused exclusively on communications. Aricent combines the leading innovation capabilities of frog design with unparalleled domain expertise in communications as a strategic supplier to the world’s foremost infrastructure, application and service providers. The company’s investors include Kohlberg Kravis Roberts & Co., Sequoia Capital, The Family
Office and The Canadian Pension Plan Investment Board. For more information, visit
http://www.aricent.com

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding the company’s expectations, goals or intentions, including, but not limited to, product features and their benefits. These forward-looking statements are based on management’s current expectations, estimates, forecasts and projections about the company and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward looking statements. These risks and uncertainties include, but are not limited to: cash requirements and terms and availability of financing; future operating losses; worldwide political and economic uncertainties, and specific conditions in the markets we address; fluctuations in the price of our common stock and our operating results; loss of or diminished demand from one or more key customers or distributors; our ability to attract and retain qualified personnel; constraints in the supply of wafers and other product components
from our third-party manufacturers; pricing pressures and other competitive factors; successful development and introduction of new products; doing business internationally and our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; industry consolidation; order and shipment uncertainty; our ability to obtain design wins and develop revenues from them; lengthy sales cycles; the expense of and our ability to defend our intellectual property against infringement claims by others; product defects and bugs; business acquisitions and investments; and our ability to utilize our net operating loss carryforwards and certain other tax attributes. Risks and uncertainties that could cause the company’s actual results to differ from those set forth in any forward-looking statement are discussed in
more detail under "Risk Factors" and "Management’s Discussion and Analysis of Financial Condition and Results of Operations" in the company’s Annual Report on Form 10-K for the year ended October 2, 2009, as well as similar disclosures in the company’s subsequent SEC filings. Forward-looking statements contained in this press release are made only as of the date hereof, and the company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

SOURCE: Mindspeed Technologies, Inc.

Editorial Contact:
Magnet PR Group
Lisa Briggs, 949-305-5131
lisab@magnetprgroup.com
or
Investor Relations Contact:
Mindspeed Technologies, Inc.
Andrea D. Williams, 949-579-3111

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Interphase and Aricent Collaborate with Mindspeed to Create Easily Scalable 4G Basestation Platforms Using a Single Chip

NEWPORT BEACH, Calif., Feb 04, 2010 (BUSINESS WIRE) — Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that it is collaborating with Interphase (NASDAQ:INPH), a leader in embedded networking and communications solutions, and Aricent(R) a global innovation, technology and services company focused exclusively on communications, on the Interphase iSPAN 36701 Wireless Base Station Advanced Mezzanine Card (AdvancedMC(TM)). Mindspeed (R)’s Transcede(TM) 4000 baseband processor system-on-chip (SoC) will power the iSPAN 36701, which targets 4G wireless basestation applications. Aricent delivers LTE software running
on the Transcede processor as part of the complete iSPAN 36701 LTE reference solution.

"We are very pleased that Interphase has selected the Transcede 4000 baseband processor for their AdvancedMC eNodeB solution," said Alan Taylor, marketing director for baseband processing solutions at Mindspeed. "The iSPAN 36701, coupled with Aricent’s LTE software stack running on the Transcede 4000 SoC, enables manufacturers of LTE picocells and enterprise femtocells to develop a complete LTE eNodeB application in an industry-standard form factor, rapidly accelerating time to market while significantly reducing system cost."

Mindspeed’s Transcede processors deliver a new class of high-performance silicon designed to meet the huge increase in basestation computational complexity caused by the migration from a voice-centric 2G/3G mobile network to a data-centric 3G+/4G mobile network. This new class of silicon replaces today’s traditional approach, which combines a complex set of general-purpose digital signal processors (DSPs) plus field
programmable gate arrays (FPGAs) and networking processing units (NPUs).

"Aricent is very excited to broaden our participation in the LTE ecosystem with partners such as Mindspeed and Interphase," said C.P. Murali, senior vice president at Aricent. "LTE is a key focus area for Aricent and we continue to be recognized in the industry for our advanced LTE frameworks and services offerings for both access and core networks."

Aricent’s LTE eNodeB reference framework is based on a flexible architecture and is pre-optimized and benchmarked for performance. The reference framework includes Layer 2 (MAC, RLC, PDCP) and Layer 3 (S2AP / X1AP) modules and all transport stacks including evolved GPRS tunneling protocol-user (eGTP-U) and stream control transmission protocol (SCTP). Aricent’s LTE reference framework is integrated with an LTE reference physical layer (PHY) implemented by Mindspeed.

"In selecting the Transcede 4000 baseband processor for the Interphase iSPAN 36701 Wireless Base Station AdvancedMC, we have reduced the size and cost by at least half compared to currently available basestation solutions," said Marc DeVinney, vice president of engineering at Interphase. "The solution integrates
everything that is needed in a wireless basestation, except for the radio, into a very compact form factor. In addition, the LTE reference software from Aricent and Mindspeed will accelerate the time to market for basestation developers by providing an off-the-shelf, integrated solution."

The iSPAN 36701 is targeted for use in a 4G network element such as an LTE eNodeB or next-generation WiMAX base station. For solution providers seeking a form factor other than AdvancedMC, the underlying technology of the iSPAN 36701 can be easily converted to other small footprint form factors. "We are committed to supporting this LTE reference design, and plan to further enhance and modify it to meet the specific needs of solution providers," DeVinney added.

Mindspeed’s Transcede family can be used to develop 4G equipment for LTE frequency division duplex (LTEFDD), LTE time-division duplex (TD-LTE, in China), time-division synchronous code division multiple access (TD-SCDMA, in China), and WiMax 802.16d,16e and 16m, as well as 3G wideband code-division multiple access (W-CDMA) NodeB systems. The Transcede family’s scalable hardware architecture enables the same software to be used for picocells, microcells and macrocells, as well as future low-cost enterprise femtocell designs once industry standards and product requirements solidify.

About Mindspeed Technologies

Mindspeed Technologies, Inc. designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes today’s separate but interrelated and converging enterprise, broadband access, metropolitan and wide area networks. Our products are classified into three focused product families: multiservice access, high-performance analog and
wide area networking communications. Our products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment, including voice and media gateways, high–speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers, digital loop carrier
equipment, IP private branch exchanges (PBXs), optical modules, broadcast video systems and wireless basestation equipment.

To learn more, visit us at www.mindspeed.com.

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, and packet processing for key applications for the communications, Mil/Aero, and enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with sales offices across the globe. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, andSun Microsystems. Visit www.iphase.com.

About Aricent

Aricent is a global innovation, technology and services company focused exclusively on communications. Aricent combines the leading innovation capabilities of frog design with unparalleled domain expertise in communications as a strategic supplier to the world’s foremost infrastructure, application and service providers. The company’s investors include Kohlberg Kravis Roberts & Co., Sequoia Capital, The Family
Office and The Canadian Pension Plan Investment Board. For more information, visit
http://www.aricent.com

Safe Harbor Statement

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding the company’s expectations, goals or intentions, including, but not limited to, product features and their benefits. These forward-looking statements are based on management’s current expectations, estimates, forecasts and projections about the company and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward looking statements. These risks and uncertainties include, but are not limited to: cash requirements and terms and availability of financing; future operating losses; worldwide political and economic uncertainties, and specific conditions in the markets we address; fluctuations in the price of our common stock and our operating results; loss of or diminished demand from one or more key customers or distributors; our ability to attract and retain qualified personnel; constraints in the supply of wafers and other product components
from our third-party manufacturers; pricing pressures and other competitive factors; successful development and introduction of new products; doing business internationally and our ability to successfully and cost effectively establish and manage operations in foreign jurisdictions; industry consolidation; order and shipment uncertainty; our ability to obtain design wins and develop revenues from them; lengthy sales cycles; the expense of and our ability to defend our intellectual property against infringement claims by others; product defects and bugs; business acquisitions and investments; and our ability to utilize our net operating loss carryforwards and certain other tax attributes. Risks and uncertainties that could cause the company’s actual results to differ from those set forth in any forward-looking statement are discussed in
more detail under "Risk Factors" and "Management’s Discussion and Analysis of Financial Condition and Results of Operations" in the company’s Annual Report on Form 10-K for the year ended October 2, 2009, as well as similar disclosures in the company’s subsequent SEC filings. Forward-looking statements contained in this press release are made only as of the date hereof, and the company undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

SOURCE: Mindspeed Technologies, Inc.

Editorial Contact:
Magnet PR Group
Lisa Briggs, 949-305-5131
lisab@magnetprgroup.com
or
Investor Relations Contact:
Mindspeed Technologies, Inc.
Andrea D. Williams, 949-579-3111

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Interphase Introduces the iSPAN® 36702 Wireless Base Station AdvancedMC®

Interphase, Wintegra, Xilinx & Aricent collaborate on innovative, low-cost LTE base station

PLANO, Texas – January 25, 2010 – Interphase Corporation (NASDAQ: INPH), a leading global provider of solutions for converged communications networks, is pleased to announce the iSPAN 36702 Wireless Base Station Module. It supports all of the functions of a Wireless Base Station except the radio and is designed for use in 4G networks, including the LTE eNodeB and next generation WiMAX base stations. The iSPAN 36702 integrates LTE technology from Wintegra, Xilinx, and Aricent® for eNodeB solutions and is easily tailored to our customer’s needs for a variety of wireless broadband applications. Interphase offers professional integration services to help our customers modify any of these solutions to meet their stringent requirements, regardless of the application.

 “The iSPAN 36702 represents a major step forward in reducing the size and cost of wireless base stations while reducing the time to market for base station developers by providing an off-the-shelf hardware solution,” said Marc DeVinney, vice president of Engineering at Interphase. “With the addition of a radio module, a complete wireless base station can be integrated into a very compact solution. For serving a larger user count, the iSPAN 36702 can be combined with a processor AdvancedMC (AMC) such as the Interphase iSPAN 36CA or iSPAN 36MC2 to easily scale."

The iSPAN 36702 is ideal for use in small wireless base stations serving up to 100 users in a single sector such as Picocells and Enterprise Femtocells. It supports:

  • Wireless Control (MAC, RLC, PDCP, RRC) and LTE Protocols (S1-AP, X2-AP)
  • Backhaul and Air interface security processing
  • Wireless Baseband (LTE PHY)
  • Radio Interface

“The iSPAN 36702 solves a growing need of OEMs to provide scalable, modular base station designs that also meet very aggressive cost, power, and time-to-market requirements,” said Colin Alexander, Director of Wireless Marketing at Wintegra. “This single card design from Interphase provides full “IP to IQ” capability in a manner that can scale from small picocells to micro or macro LTE base stations, and does so in a very compact and flexible form factor.”

The iSPAN 36702 features three Optical Interfaces on the front panel for CPRI/OBSAI Baseband interfaces or Gigabit Ethernet interfaces and up to 11 Serdes links on the AMC connector for a combination of Gigabit Ethernet, Serial RapidIO and PCI-Express™ links. It is powered by the Wintegra™ WinPath3™ Network Processor, Xilinx® Virtex®-6 FPGA, and Aricent’s industry-proven 4G software framework solution. The Network Processor provides traffic policing and shaping, protocol conversion, and switching capability. The WinPath3 also implements the MAC layer and provides two MIPS core processors that are used to host Aricent’s eNodeB framework, which provides Layer 3/RRM application functionality. The Virtex-6 provides the baseband PHY which is tightly integrated with the WinPath3 MAC Layer.

“Aricent is very excited to be part of the LTE ecosystem with partners such as Interphase, Wintegra and Xilinx” said C.P. Murali, senior vice president at Aricent.  “Building on Aricent’s success in the Base Station evolution from GSM to HSPA, Aricent continues to play a significant role in architecting next generation of LTE Base Stations, with a number of design wins in this space.”

In addition to this Wireless Base Station module, Interphase provides experienced design services to expertly handle custom wireless projects. Learn more now about how Interphase can help you with your high-speed wireless application.

To make an appointment to see the iSPAN 36702 at the 2010 GSMA Mobile World Congress in Barcelona, February 15-18, or for iSPAN 36702 pricing and availability, please contact us.

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, and packet processing for key applications for the communications, Mil/Aero, and enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with sales offices across the globe. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, and Sun Microsystems. Visit www.iphase.com.

###

Interphase, the Interphase logo, and iSPAN are trademarks or registered trademarks of Interphase Corporation. All other trademarks are the property of their respective owners.

Contact Information

Interphase Corporation
Interphase Corporation

2901 N. Dallas Parkway
Suite 200
Plano, TX, 75093
USA

tele: 214.654.5000
fax: 214.654.5500
fastnet@iphase.com
www.iphase.com

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Interphase Introduces the iSPAN® 36702 Wireless Base Station AdvancedMC®

Interphase, Wintegra, Xilinx & Aricent collaborate on innovative, low-cost LTE base station

PLANO, Texas – January 25, 2010 – Interphase Corporation (NASDAQ: INPH), a leading global provider of solutions for converged communications networks, is pleased to announce the iSPAN 36702 Wireless Base Station Module. It supports all of the functions of a Wireless Base Station except the radio and is designed for use in 4G networks, including the LTE eNodeB and next generation WiMAX base stations. The iSPAN 36702 integrates LTE technology from Wintegra, Xilinx, and Aricent® for eNodeB solutions and is easily tailored to our customer’s needs for a variety of wireless broadband applications. Interphase offers professional integration services to help our customers modify any of these solutions to meet their stringent requirements, regardless of the application.

 “The iSPAN 36702 represents a major step forward in reducing the size and cost of wireless base stations while reducing the time to market for base station developers by providing an off-the-shelf hardware solution,” said Marc DeVinney, vice president of Engineering at Interphase. “With the addition of a radio module, a complete wireless base station can be integrated into a very compact solution. For serving a larger user count, the iSPAN 36702 can be combined with a processor AdvancedMC (AMC) such as the Interphase iSPAN 36CA or iSPAN 36MC2 to easily scale."

The iSPAN 36702 is ideal for use in small wireless base stations serving up to 100 users in a single sector such as Picocells and Enterprise Femtocells. It supports:

  • Wireless Control (MAC, RLC, PDCP, RRC) and LTE Protocols (S1-AP, X2-AP)
  • Backhaul and Air interface security processing
  • Wireless Baseband (LTE PHY)
  • Radio Interface

“The iSPAN 36702 solves a growing need of OEMs to provide scalable, modular base station designs that also meet very aggressive cost, power, and time-to-market requirements,” said Colin Alexander, Director of Wireless Marketing at Wintegra. “This single card design from Interphase provides full “IP to IQ” capability in a manner that can scale from small picocells to micro or macro LTE base stations, and does so in a very compact and flexible form factor.”

The iSPAN 36702 features three Optical Interfaces on the front panel for CPRI/OBSAI Baseband interfaces or Gigabit Ethernet interfaces and up to 11 Serdes links on the AMC connector for a combination of Gigabit Ethernet, Serial RapidIO and PCI-Express™ links. It is powered by the Wintegra™ WinPath3™ Network Processor, Xilinx® Virtex®-6 FPGA, and Aricent’s industry-proven 4G software framework solution. The Network Processor provides traffic policing and shaping, protocol conversion, and switching capability. The WinPath3 also implements the MAC layer and provides two MIPS core processors that are used to host Aricent’s eNodeB framework, which provides Layer 3/RRM application functionality. The Virtex-6 provides the baseband PHY which is tightly integrated with the WinPath3 MAC Layer.

“Aricent is very excited to be part of the LTE ecosystem with partners such as Interphase, Wintegra and Xilinx” said C.P. Murali, senior vice president at Aricent.  “Building on Aricent’s success in the Base Station evolution from GSM to HSPA, Aricent continues to play a significant role in architecting next generation of LTE Base Stations, with a number of design wins in this space.”

In addition to this Wireless Base Station module, Interphase provides experienced design services to expertly handle custom wireless projects. Learn more now about how Interphase can help you with your high-speed wireless application.

To make an appointment to see the iSPAN 36702 at the 2010 GSMA Mobile World Congress in Barcelona, February 15-18, or for iSPAN 36702 pricing and availability, please contact us.

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, and packet processing for key applications for the communications, Mil/Aero, and enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with sales offices across the globe. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, and Sun Microsystems. Visit www.iphase.com.

###

Interphase, the Interphase logo, and iSPAN are trademarks or registered trademarks of Interphase Corporation. All other trademarks are the property of their respective owners.

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Interphase Introduces the iSPAN® 36702 Wireless Base Station AdvancedMC®

Interphase, Wintegra, Xilinx & Aricent collaborate on innovative, low-cost LTE base station

PLANO, Texas – January 25, 2010 – Interphase Corporation (NASDAQ: INPH), a leading global provider of solutions for converged communications networks, is pleased to announce the iSPAN 36702 Wireless Base Station Module. It supports all of the functions of a Wireless Base Station except the radio and is designed for use in 4G networks, including the LTE eNodeB and next generation WiMAX base stations. The iSPAN 36702 integrates LTE technology from Wintegra, Xilinx, and Aricent® for eNodeB solutions and is easily tailored to our customer’s needs for a variety of wireless broadband applications. Interphase offers professional integration services to help our customers modify any of these solutions to meet their stringent requirements, regardless of the application.

 “The iSPAN 36702 represents a major step forward in reducing the size and cost of wireless base stations while reducing the time to market for base station developers by providing an off-the-shelf hardware solution,” said Marc DeVinney, vice president of Engineering at Interphase. “With the addition of a radio module, a complete wireless base station can be integrated into a very compact solution. For serving a larger user count, the iSPAN 36702 can be combined with a processor AdvancedMC (AMC) such as the Interphase iSPAN 36CA or iSPAN 36MC2 to easily scale."

The iSPAN 36702 is ideal for use in small wireless base stations serving up to 100 users in a single sector such as Picocells and Enterprise Femtocells. It supports:

  • Wireless Control (MAC, RLC, PDCP, RRC) and LTE Protocols (S1-AP, X2-AP)
  • Backhaul and Air interface security processing
  • Wireless Baseband (LTE PHY)
  • Radio Interface

“The iSPAN 36702 solves a growing need of OEMs to provide scalable, modular base station designs that also meet very aggressive cost, power, and time-to-market requirements,” said Colin Alexander, Director of Wireless Marketing at Wintegra. “This single card design from Interphase provides full “IP to IQ” capability in a manner that can scale from small picocells to micro or macro LTE base stations, and does so in a very compact and flexible form factor.”

The iSPAN 36702 features three Optical Interfaces on the front panel for CPRI/OBSAI Baseband interfaces or Gigabit Ethernet interfaces and up to 11 Serdes links on the AMC connector for a combination of Gigabit Ethernet, Serial RapidIO and PCI-Express™ links. It is powered by the Wintegra™ WinPath3™ Network Processor, Xilinx® Virtex®-6 FPGA, and Aricent’s industry-proven 4G software framework solution. The Network Processor provides traffic policing and shaping, protocol conversion, and switching capability. The WinPath3 also implements the MAC layer and provides two MIPS core processors that are used to host Aricent’s eNodeB framework, which provides Layer 3/RRM application functionality. The Virtex-6 provides the baseband PHY which is tightly integrated with the WinPath3 MAC Layer.

“Aricent is very excited to be part of the LTE ecosystem with partners such as Interphase, Wintegra and Xilinx” said C.P. Murali, senior vice president at Aricent.  “Building on Aricent’s success in the Base Station evolution from GSM to HSPA, Aricent continues to play a significant role in architecting next generation of LTE Base Stations, with a number of design wins in this space.”

In addition to this Wireless Base Station module, Interphase provides experienced design services to expertly handle custom wireless projects. Learn more now about how Interphase can help you with your high-speed wireless application.

To make an appointment to see the iSPAN 36702 at the 2010 GSMA Mobile World Congress in Barcelona, February 15-18, or for iSPAN 36702 pricing and availability, please contact us.

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, and packet processing for key applications for the communications, Mil/Aero, and enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with sales offices across the globe. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, and Sun Microsystems. Visit www.iphase.com.

###

Interphase, the Interphase logo, and iSPAN are trademarks or registered trademarks of Interphase Corporation. All other trademarks are the property of their respective owners.

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Interphase Announces New High-Density Gateway on a Card

Introducing the iSPAN® 3651 AdvancedMC™ (AMC) Dual Channelized
OC-3/STM-1 ATM-IP Interworking Gateway Card and Application

PLANO, Texas – February 11, 2010 — Interphase (NASDAQ: INPH), a leader in embedded networking and communications solutions, introduces the iSPAN 3651 AdvancedMC™ (AMC) Channelized OC-3/STM-1 ATM-IP Interworking Card. The iSPAN 3651 is the newest gateway-on-a-card solution in the Interphase Interworking portfolio which already includes the iSPAN 3650. The 3651 is an ideal solution for large 3G wireless Radio Network Controller (RNC) applications, serving multiple NodeBs in dense cities or in broad geographic regions such as China. With its two channelized OC-3/STM-1 interfaces, the iSPAN 3651 provides a cost-effective solution for Edge Routers, Access Gateways, and Mobile Gateways which support aggregated T1/E1 links and bridge legacy ATM traffic with IP.

“This new gateway on a card solution challenges the conventional usage of external appliances (such as switches and routers) for wireless and wireline network elements,” said Linsey Miller, Interphase vertical business owner for Interworking products. “The iSPAN 3651’s ready-to-use interworking application, embedded in a small, carrier-grade form-factor design, makes it the most compact and cost-effective solution on the market.”

Based on the powerful Wintegra™ WinPath2™ network processor, the iSPAN 3651 is a high-performance product that can support, for example:

  • 126 E1 or 168 T1 independent channels
  • More than 1 million AAL2 CPS packets per second
  • 16,000 Active AAL2 CIDs (256 CIDs per VC)
  • 32,000 UDP routes

The iSPAN 3651 serves modular architectures such as ATCA and MicroTCA-based systems at a fraction of the cost of traditional switch/gateway solutions, also delivering higher value with a smaller footprint and lower operating costs. “The 3651 enables our customers to save significant expense in the deployment of their 3G Wireless networks,” said Dick DuBois, Emerson Network Power vice president of marketing for the Embedded Computing business.  “Emerson is working with Interphase to consolidate many of the functions of external boxes like switches and gateways into single ATCA blades and AMCs so that our ATCA solutions deliver tremendous value to our TEM customers.”

In each T1/E1 channel, the iSPAN 3651 supports the ATM or PPP protocol. Channels can be bundled with ATM IMA or PPP Multilink. For ATM, both AAL2 and AAL5 adaptations are supported, and the ATM-IP Interworking application enables the transport over IP of voice, data, and control traffic to/from other processing units via the Gigabit Ethernet (GE) backplane. For PPP, IP traffic is simply routed between Packet-over-Sonet (POS) and GE. The iSPAN 3651 software suite, fully embedded on the card, includes the protocol layers, the management and configuration plane, the line equipment protection (APS), and the fast-path interworking application which can be easily integrated into customer networks.

The iSPAN 3651 will be on display at the Mobile World Congress held February 15 – 18, 2010 in Barcelona, Spain. 

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, packet processing, LTE, and security for key applications for the Communications, Mil/Aero, and Enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with its European office in Chaville, France. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, and Sun Microsystems. Visit www.iphase.com.

###

Interphase, the Interphase logo, and iSPAN are trademarks or registered trademarks of Interphase Corporation. All other trademarks are the property of their respective owners.

Contact Information

Interphase Corporation
Interphase Corporation

2901 N. Dallas Parkway
Suite 200
Plano, TX, 75093
USA

tele: 214.654.5000
fax: 214.654.5500
fastnet@iphase.com
www.iphase.com

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Interphase Announces New High-Density Gateway on a Card

Introducing the iSPAN® 3651 AdvancedMC™ (AMC) Dual Channelized
OC-3/STM-1 ATM-IP Interworking Gateway Card and Application

PLANO, Texas – February 11, 2010 — Interphase (NASDAQ: INPH), a leader in embedded networking and communications solutions, introduces the iSPAN 3651 AdvancedMC™ (AMC) Channelized OC-3/STM-1 ATM-IP Interworking Card. The iSPAN 3651 is the newest gateway-on-a-card solution in the Interphase Interworking portfolio which already includes the iSPAN 3650. The 3651 is an ideal solution for large 3G wireless Radio Network Controller (RNC) applications, serving multiple NodeBs in dense cities or in broad geographic regions such as China. With its two channelized OC-3/STM-1 interfaces, the iSPAN 3651 provides a cost-effective solution for Edge Routers, Access Gateways, and Mobile Gateways which support aggregated T1/E1 links and bridge legacy ATM traffic with IP.

“This new gateway on a card solution challenges the conventional usage of external appliances (such as switches and routers) for wireless and wireline network elements,” said Linsey Miller, Interphase vertical business owner for Interworking products. “The iSPAN 3651’s ready-to-use interworking application, embedded in a small, carrier-grade form-factor design, makes it the most compact and cost-effective solution on the market.”

Based on the powerful Wintegra™ WinPath2™ network processor, the iSPAN 3651 is a high-performance product that can support, for example:

  • 126 E1 or 168 T1 independent channels
  • More than 1 million AAL2 CPS packets per second
  • 16,000 Active AAL2 CIDs (256 CIDs per VC)
  • 32,000 UDP routes

The iSPAN 3651 serves modular architectures such as ATCA and MicroTCA-based systems at a fraction of the cost of traditional switch/gateway solutions, also delivering higher value with a smaller footprint and lower operating costs. “The 3651 enables our customers to save significant expense in the deployment of their 3G Wireless networks,” said Dick DuBois, Emerson Network Power vice president of marketing for the Embedded Computing business.  “Emerson is working with Interphase to consolidate many of the functions of external boxes like switches and gateways into single ATCA blades and AMCs so that our ATCA solutions deliver tremendous value to our TEM customers.”

In each T1/E1 channel, the iSPAN 3651 supports the ATM or PPP protocol. Channels can be bundled with ATM IMA or PPP Multilink. For ATM, both AAL2 and AAL5 adaptations are supported, and the ATM-IP Interworking application enables the transport over IP of voice, data, and control traffic to/from other processing units via the Gigabit Ethernet (GE) backplane. For PPP, IP traffic is simply routed between Packet-over-Sonet (POS) and GE. The iSPAN 3651 software suite, fully embedded on the card, includes the protocol layers, the management and configuration plane, the line equipment protection (APS), and the fast-path interworking application which can be easily integrated into customer networks.

The iSPAN 3651 will be on display at the Mobile World Congress held February 15 – 18, 2010 in Barcelona, Spain. 

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, packet processing, LTE, and security for key applications for the Communications, Mil/Aero, and Enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with its European office in Chaville, France. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, and Sun Microsystems. Visit www.iphase.com.

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Interphase, the Interphase logo, and iSPAN are trademarks or registered trademarks of Interphase Corporation. All other trademarks are the property of their respective owners.

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Interphase Announces New High-Density Gateway on a Card

PLANO, Texas – February 11, 2010 — Interphase (NASDAQ: INPH), a leader in embedded networking and communications solutions, introduces the iSPAN 3651 AdvancedMC™ (AMC) Channelized OC-3/STM-1 ATM-IP Interworking Card. The iSPAN 3651 is the newest gateway-on-a-card solution in the Interphase Interworking portfolio which already includes the iSPAN 3650. The 3651 is an ideal solution for large 3G wireless Radio Network Controller (RNC) applications, serving multiple NodeBs in dense cities or in broad geographic regions such as China. With its two channelized OC-3/STM-1 interfaces, the iSPAN 3651 provides a cost-effective solution for Edge Routers, Access Gateways, and Mobile Gateways which support aggregated T1/E1 links and bridge legacy ATM traffic with IP.

“This new gateway on a card solution challenges the conventional usage of external appliances (such as switches and routers) for wireless and wireline network elements,” said Linsey Miller, Interphase vertical business owner for Interworking products. “The iSPAN 3651’s ready-to-use interworking application, embedded in a small, carrier-grade form-factor design, makes it the most compact and cost-effective solution on the market.”

Based on the powerful Wintegra™ WinPath2™ network processor, the iSPAN 3651 is a high-performance product that can support, for example:

  • 126 E1 or 168 T1 independent channels
  • More than 1 million AAL2 CPS packets per second
  • 16,000 Active AAL2 CIDs (256 CIDs per VC)
  • 32,000 UDP routes

The iSPAN 3651 serves modular architectures such as ATCA and MicroTCA-based systems at a fraction of the cost of traditional switch/gateway solutions, also delivering higher value with a smaller footprint and lower operating costs. “The 3651 enables our customers to save significant expense in the deployment of their 3G Wireless networks,” said Dick DuBois, Emerson Network Power vice president of marketing for the Embedded Computing business.  “Emerson is working with Interphase to consolidate many of the functions of external boxes like switches and gateways into single ATCA blades and AMCs so that our ATCA solutions deliver tremendous value to our TEM customers.”

In each T1/E1 channel, the iSPAN 3651 supports the ATM or PPP protocol. Channels can be bundled with ATM IMA or PPP Multilink. For ATM, both AAL2 and AAL5 adaptations are supported, and the ATM-IP Interworking application enables the transport over IP of voice, data, and control traffic to/from other processing units via the Gigabit Ethernet (GE) backplane. For PPP, IP traffic is simply routed between Packet-over-Sonet (POS) and GE. The iSPAN 3651 software suite, fully embedded on the card, includes the protocol layers, the management and configuration plane, the line equipment protection (APS), and the fast-path interworking application which can be easily integrated into customer networks.

The iSPAN 3651 will be on display at the Mobile World Congress held February 15 – 18, 2010 in Barcelona, Spain. 

About Interphase Corporation

Interphase Corporation (NASDAQ: INPH) delivers solutions for network connectivity, interworking, packet processing, LTE, and security for key applications for the Communications, Mil/Aero, and Enterprise markets. Founded in 1974, Interphase provides expert customization services and contract manufacturing in addition to its COTS portfolio, and plays a leadership role in next generation AdvancedTCA® (ATCA), AdvancedMC™ (AMC), PCI-x, and PCI-e standards and solutions. Interphase is headquartered in Plano, Texas, with its European office in Chaville, France. Clients include Alcatel-Lucent, Emerson Network Power, Fujitsu Ltd., Hewlett Packard, Samsung, and Sun Microsystems. Visit www.iphase.com.

###

Interphase, the Interphase logo, and iSPAN are trademarks or registered trademarks of Interphase Corporation. All other trademarks are the property of their respective owners.

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Global Chip Sales Decline in 2009, But Surpass Forecast

Global Chip Sales Decline in 2009, But Surpass Forecast

SAN JOSE, CA – February 1, 2010 – The Semiconductor Industry Association (SIA) today reported that worldwide semiconductor sales in 2009 were $226.3 billion, a decline of 9 percent from 2008 when sales were $248.6 billion. Total sales for 2009 surpassed the SIA forecast of $219.7 billion. December sales were $22.4 billion, an increase of 29 percent from December 2008, when sales were $17.4 billion. December sales declined by 1.2 percent from November when sales were $22.7 billion. All monthly sales numbers represent a three-month moving average.

“2009 turned out to be a better year for the global semiconductor industry than expected,” said SIA President George Scalise. “A strong focus on inventories throughout the supply chain mitigated the impact of the worldwide economic downturn and positioned the industry for growth as the global economy recovers.

“Sales in the final quarter of 2009 were supported by healthy demand in a variety of end markets including PCs, cell phones, and consumer electronics. In 2010, unit sales of personal computers and cell phones – which account for approximately 60 percent of total semiconductor consumption – will grow in the low-to-mid teens, providing a solid platform for chip sales. Consumer electronics are expected to grow in the mid-single digits,” Scalise continued. “We are also seeing the effects of recovery in the enterprise sector and we believe this trend will continue,” Scalise noted. SIA expects a return to normal seasonal patterns, which suggests a modest slowdown in the first quarter.

China and India, two key emerging markets, are also driving demand. In addition to purchasing consumer items such as handsets and computers, both regions are continuing to invest in wired and wireless infrastructure. These investments in infrastructure create demand for a broad range of semiconductor products.

“Advances in technology are continually enabling development of new products, such as netbook and tablet computers,” said Scalise. “Attractive price points for these products are creating new market segments that hadn’t previously existed, and they are adding to overall semiconductor demand.

“With improving consumer confidence and signs of economic recovery around the world, the semiconductor industry is well positioned for growth in 2010,” Scalise concluded.

About the SIA Global Sales Report
The SIA Global Sales Report (GSR) is a three-month moving average of sales activity. The GSR is tabulated by the World Semiconductor Trade Statistics (WSTS) organization, an independent, non-profit organization established by the global semiconductor industry to compile industry statistics. The moving average is a mathematical smoothing technique that mitigates variations due to differences in companies’ financial calendars.

About the SIA
The SIA is the leading voice for the semiconductor industry and has represented U.S. semiconductor companies since 1977. Collectively, the chip industry employs a domestic workforce of approximately 200,000 people. The semiconductor industry is America’s second-largest exporting industry. More information about the SIA can be found at www.sia-online.org.

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Global Chip Sales Decline in 2009, But Surpass Forecast

Global Chip Sales Decline in 2009, But Surpass Forecast

SAN JOSE, CA – February 1, 2010 – The Semiconductor Industry Association (SIA) today reported that worldwide semiconductor sales in 2009 were $226.3 billion, a decline of 9 percent from 2008 when sales were $248.6 billion. Total sales for 2009 surpassed the SIA forecast of $219.7 billion. December sales were $22.4 billion, an increase of 29 percent from December 2008, when sales were $17.4 billion. December sales declined by 1.2 percent from November when sales were $22.7 billion. All monthly sales numbers represent a three-month moving average.

“2009 turned out to be a better year for the global semiconductor industry than expected,” said SIA President George Scalise. “A strong focus on inventories throughout the supply chain mitigated the impact of the worldwide economic downturn and positioned the industry for growth as the global economy recovers.

“Sales in the final quarter of 2009 were supported by healthy demand in a variety of end markets including PCs, cell phones, and consumer electronics. In 2010, unit sales of personal computers and cell phones – which account for approximately 60 percent of total semiconductor consumption – will grow in the low-to-mid teens, providing a solid platform for chip sales. Consumer electronics are expected to grow in the mid-single digits,” Scalise continued. “We are also seeing the effects of recovery in the enterprise sector and we believe this trend will continue,” Scalise noted. SIA expects a return to normal seasonal patterns, which suggests a modest slowdown in the first quarter.

China and India, two key emerging markets, are also driving demand. In addition to purchasing consumer items such as handsets and computers, both regions are continuing to invest in wired and wireless infrastructure. These investments in infrastructure create demand for a broad range of semiconductor products.

“Advances in technology are continually enabling development of new products, such as netbook and tablet computers,” said Scalise. “Attractive price points for these products are creating new market segments that hadn’t previously existed, and they are adding to overall semiconductor demand.

“With improving consumer confidence and signs of economic recovery around the world, the semiconductor industry is well positioned for growth in 2010,” Scalise concluded.

About the SIA Global Sales Report
The SIA Global Sales Report (GSR) is a three-month moving average of sales activity. The GSR is tabulated by the World Semiconductor Trade Statistics (WSTS) organization, an independent, non-profit organization established by the global semiconductor industry to compile industry statistics. The moving average is a mathematical smoothing technique that mitigates variations due to differences in companies’ financial calendars.

About the SIA
The SIA is the leading voice for the semiconductor industry and has represented U.S. semiconductor companies since 1977. Collectively, the chip industry employs a domestic workforce of approximately 200,000 people. The semiconductor industry is America’s second-largest exporting industry. More information about the SIA can be found at www.sia-online.org.

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Global Chip Sales Decline in 2009, But Surpass Forecast

Global Chip Sales Decline in 2009, But Surpass Forecast

SAN JOSE, CA – February 1, 2010 – The Semiconductor Industry Association (SIA) today reported that worldwide semiconductor sales in 2009 were $226.3 billion, a decline of 9 percent from 2008 when sales were $248.6 billion. Total sales for 2009 surpassed the SIA forecast of $219.7 billion. December sales were $22.4 billion, an increase of 29 percent from December 2008, when sales were $17.4 billion. December sales declined by 1.2 percent from November when sales were $22.7 billion. All monthly sales numbers represent a three-month moving average.

“2009 turned out to be a better year for the global semiconductor industry than expected,” said SIA President George Scalise. “A strong focus on inventories throughout the supply chain mitigated the impact of the worldwide economic downturn and positioned the industry for growth as the global economy recovers.

“Sales in t