VMEbus Variant: VME, VITA 41/VXS, VITA 46/VPX, and VITA 48/VPX-REDI and others

Compatible Operating Systems: All

Compatible Architecture: All

Taking advantage of Parker’s wide technology base of proven fluid-handling products and experience in manufacturing processes and Systems integration, the Advanced Cooling Systems Team provides highly-engineered solutions for the thermal management of high power density embedded electronics from board level cooling Modules to complete integrated electronics cooling Systems.

Ruggedized Enclosures and liquid flow-thru board Modules compatible with VITA 48.3, IEEE 1101.2 standards provide cooling of heat loads as high as 4000 W for a 1-ATR chassis (approximately 8″ H x 10″ W x 20″ L) and board level direct heat fluxes as high as 25 W/cm2 (thermal resistivity less than 0.3 (ºC •cm2/W) for high heat components without the use of heat spreaders).

Parker combines the power of innovative OEM design implementation with its premier customer field support through its global 24/7 Customer Service Organization to deliver the total life-cycle engineered solution.

FEATURES & BENEFITS

• Systems can utilize dielectric (e.g. PAO/fluorocarbon) or non-dielectric (e.g. EGW/PGW) fluids as required
• Modular approach easily facilitates spiral upgrades, economic tech refresh, and simple field maintenance extending useful life of the mechanical System
• Optional self-contained System solution, offering Integral Heat Exchanger, a Plug-and-Play Pump Module (capable of either autonomous operation or management by the outside system), and/or Heaters for unmatched flexibility and thermal control
• Parker Design allows Transverse-mounted Modules in standard ATR/ARINC Enclosures for superior package density
• Liquid Flow Thru Module gives board designers freedom of where hot components are placed

TECHNICAL SPECS

• Conduction Cooled (CC) Modules with liquid sidewalls Up to 200 Watts per 6U x 160 mm Board
• Liquid Flow-Thru (LFT) Modules Up to 1000 Watts per 6U x 160 mm Board
• Spray Cooled Modules (direct component impingement) 3500 Watts (more with 2-phase evaporation spray) per 6U x 160 mm Board
• Designed for dynamic environment of MIL-STD-810F (20g shock and 12grms vib.); humidity, salt fog, fungus resistance, thermal cycling, and sand/dust rqmts per VITA 47; & EMI per MIL-STD-461E
• Operational from -40º – 85ºC, storage to 125ºC and -1500 to 70,000 feet altitude conditions

AVAILABILITY

12-16 weeks

APPLICATION AREAS

• Ruggedized Electronics Cooling of Components & Systems for Military/Ground/Air/Sea Vehicles
• High Reliability Commercial and Industrial Applications

Contact Information

Parker Hannifin Corp.

9200 Tyler Boulevard
Mentor, OH, 44060
USA

tele: 440.954.8105
toll-free: 800.C.PARKER Toll Free
http://www.parker.com