Bustronic Announces VPX Test Backplane



FREMONT, California, Feb 2, 2010  – Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes, now offers a 2-slot test backplane for VPX board developers and integrators.

The Elma Bustronic 2-slot test backplane is designed to the latest VITA 46 specifications.  The backplane allows the user to power up and test their J1 fabric connections as they would be interconnected in the target application.  Signals can be passed from one slot to the next via high speed interconnecting cables, via signals introduced through the J1 fabric connector, or accessed on the J1 fabric connector using the test backplane’s SMA and SATA cable headers.  The test backplane accepts 6U cards with the 3U size supported by use of a shelf divider.  For convenience in attaching probes, the slot pitch is an extra wide 1.6”.

The VPX Test Backplane solves a signal access issue with VPX systems that utilize Rear Transition Module (RTM) boards.  VPX cards are usually developed together with an RTM module that does not access the J1 fabric signals.  In conventional designs, an engineer cannot probe these J1 fabric signals while using the Device Under Test’s (DUT) RTM module to access other IO signals.  The Bustronic solution allows the primary J1 fabric signals to be accessed/connected without interfering with the use of an existing RTM module designed for J2-J6 IO connector signals.  Further, custom backplanes are often required to interconnect the primary fabric signals between multiple VPX blades for a specific application.  The VPX Test Backplane allows the user to interconnect two or more such blades before investing the time or expense of a custom VPX backplane.

Additional 2-slot Test Backplanes can be used in a larger chassis to interconnect the J1 primary fabric in any serial topology desired.  The A channel input using SMA cables accepts up to 10 Gbps and the B, C, and D channel inputs using the SATA II connectors accept up to 3.125 Gbps.   There are 8 power studs for VS1, VS2_A, VS2_B, VS3, and 4 GND as well as fastons for 3.3V, +/- 12V, and VBAT.   There are also two 5-pin IPMB headers for SMB-0 and SMB-1.

Lead-time of 4-6 weeks ARO.

About Elma Bustronic:

Founded in 1989, Elma Bustronic specializes in the design and manufacture of high-performance backplanes.  Elma Bustronic has a complete line of industry-standard backplanes, including CompactPCI, VME, VME64x, H.110 CT, VXI, VXS, and ATCA.  Elma Bustronic’s custom design service combines creative engineering, highly sophisticated computer simulation and modern design techniques to offer customized backplanes that meet the most specialized system requirements.  A member of the ELMA Electronic group, Elma Bustronic is located in Fremont, California.  Elma Bustronic is a member of PICMG™, VITA, and the StarFabric Trade Association and can be found on the World Wide Web at www.Bustronic.com.

Company Contacts: Justin Moll, Elma Bustronic Corporation

510.490.7388 510.490.1853 fax e-mail: justin.moll@elmabustronic.com

Chuck Byer, Z-Plane, Inc.

415.309.2647 650.324.4175 fax e-mail: ccbyer@z-planeinc.com

Bustronic and Z-plane Upgrade AdvancedTCA Backplane System to 65 Gbps

FREMONT, California, Feb 2, 2010 – Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes, and Z-Plane Inc, a high-speed electronic packaging and interconnection technology company, will be exhibiting an upgraded version of the high-speed ATCA backplane with Z-Plane Links at the DesignCon show in Santa Clara on Feb 2, 3.

Using signal integrity analysis, the Z-Plane and Bustronic teams have optimized the performance of the ATCA backplane with Z-Plane links. Using the orthogonal approach with small PCB links across the rear of the backplane to carry high-speed signals, the backplane system can offer significantly faster speeds with cleaner signals. This second iteration of the backplane system offers a strong eye opening in SI studies at speeds up to 40-65 Gbps.

“Claims of 40 Gbps are not unheard of in the embedded system marketplace.” said Justin Moll, Director of Marketing for Bustronic. “However, we need to consider the effects across the backplane.  The ATCA backplane with Z-Plane’s Links allows significantly faster signals with performance results that would be highly challenging to achieve in conventional backplanes.”

“Z-Plane is intent on creating packaging designs which are capable of 100 Gbps backplane speeds.” said Chuck Byer, President and CEO of Z-Plane, Inc. “We are very pleased to be working with Elma Bustronic based on their vision, commitment to excellence and dedication to the industry.”

Bustronic and Z-Plane will be exhibiting this technology and other system accessory and backplane innovations at DesignCon in booth #117. For more information, contact Bustronic at sales@bustronic.com or Z-Plane Inc at www.z-planeinc.com

About the ATCA Backplane with Z-Plane Links

The Bustronic ATCA backplane with Links offers up to triple the performance of traditional versions of the architecture at a reduced cost. This is achieved using the Z-Plane Links, which carry the high-speed, long-trace signals via a small PCB board that plugs directly into the rear of the backplane. The basic clock signals and shorter trace lines are left within the backplane. This orthogonal Link approach allows the backplane to have only 6-8 layers, compared to a traditional ATCA backplane may have 18-24 layers or higher. Characterization studies confirm that the signal integrity of the backplane with the Z-Plane Links can produce solid results at higher data rates than conventional backplanes.

The ATCA community is moving to 40 Gigabit/second speeds per channel across the backplane. The version with the Z-Plane Links may help ATCA backplanes achieve these very high performance levels, while keeping costs low.

The Z-Plane Links feature an adapter with guide pins used to firmly secure the rear plane PCB in place and provide strain relief. This adapter has a short, impedance-matched connection between the rear “Z dimension” PCB (or Link) and the backplane connector. They also have staggered arrays, so they can be stacked adjacent to one another, and they come in press-fit pin or compliant pin termination depending on the backplane thickness.

About Elma Bustronic:

Founded in 1989, Elma Bustronic specializes in the design and manufacture of high-performance backplanes. Elma Bustronic has a complete line of industry-standard backplanes, including CompactPCI, VME, VME64x, H.110 CT, VXI, VXS, and ATCA. Elma Bustronic’s custom design service combines creative engineering, highly sophisticated computer simulation and modern design techniques to offer customized backplanes that meet the most specialized system requirements. A member of the ELMA Electronic group, Elma Bustronic is located in Fremont, California. Elma Bustronic is a member of PICMG™, VITA, and the StarFabric Trade Association and can be found on the World Wide Web at www.Bustronic.com.

Contact Information

Elma Electronic Inc.

44350 S. Grimmer Blvd.
Fremont, CA, 94538
United States

tele: 510-565-3400
fax: 510-656-3783
sales@elma.com
www.elma.com

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