TE Connectivity Partners with Annapolis Micro Systems on FPGA Boards with High Density RF Connectors



TE Connectivity (TE), a world leader in connectivity and sensors, is pleased to announce it has partnered with Annapolis Micro Systems, a leading FPGA board and systems supplier, on the release of three of their new high-performance FPGA boards that feature TE’s NanoRF module. The half-size NanoRF is designed to fit into the VITA 67.3 form factor and supports 70 GHz bandwidth, with more than double the RF contact density of existing VITA 67 solutions.

The three new OpenVPX boards from Annapolis Micro Systems include:
·        WILDSTAR™ 3XB0 3U OpenVPX FPGA Processor
·        WILDSTAR™ 3XB1 3U OpenVPX FPGA Processor
·        WILDSTAR™ 6XB2 6U OpenVPX FPGA Processor

Eliminating the need for front panel coaxial cables, the NanoRF design leverages the alignment features of optical (VITA 66) modules. A floating insert on the backplane pre-aligns the RF contact array before the contacts start to engage. This rugged precision alignment is critical in blindmate plug-in architecture, which requires high reliability under extreme conditions.

 

“The NanoRF gives us super high density out the backplane in a really tight package,” said Noah Donaldson, Annapolis Micro Systems Chief Technology Officer. “This breakthrough connectivity allows us to utilize the full performance capability of these super-powered FPGA boards and our high-channel-count I/O cards.” The cutting-edge COTS boards integrate up to two Xilinx Virtex® UltraScale+™ FPGAs and a Xilinx Zynq® UltraScale+ MPSoC motherboard controller. Each board also has one (3U) or two (6U) WILD FMC+ (WFMC+™) next generation I/O site(s), for dense, high-bandwidth ADCs and/or DACs.

According to Mike Walmsley, TE Global Product Manager, “These leading-edge Annapolis Microsystems OpenVPX applications are a perfect illustration of the rugged RF density that can be achieved for next generation embedded systems. TE is pursuing the NanoRF modules as an industry standard VITA 67.3 solution to enable unprecedented bandwidth in a smaller package.”

TE gave Annapolis early access to the NanoRF; widespread launch will take place in August.
The backplane contacts in the NanoRF modules are float mounted, assuring that the coax interface is fully bottomed in VPX backplane applications, and maintains excellent isolation and VSWR in rugged environments. Multiple position options from 8 to 18 positions are offered in half and full-size modules, and custom module configurations are possible utilizing the same NanoRF interface.

The three FPGA processors supplement Annapolis’ WILD™ EcoSystem. The EcoSystem is an interoperable portfolio of rugged high-performance OpenVPX and PCIe COTS boards and systems that are used for challenging data acquisition, digital signal processing, and data storage applications.

The FPGA boards are designed for advanced High Performance Computing (HPC) and Electronic Warfare (EW) applications, including DRFM, beamforming, sensor processing, wireless communication, and radar signal processing.

TE, TE Connectivity and the TE connectivity logo are trademarks of the TE Connectivity Ltd. family of companies.

ABOUT TE CONNECTIVITY
TE Connectivity Ltd., is a $13 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 78,000 employees, including more than 7,000 engineers, working alongside customers in nearly 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedInFacebookWeChat and Twitter.

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