December - 2014
- RF-SOI Wafers for Wireless Applications
The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels
- Implementing Flexible USB Type-C Control Using FPGA Technology
- Understanding Automotive Reliability and ISO 26262 for Safety Critical Systems
Automotive electronics play a critical role in today's automotive safety systems. While standards like ISO 26262 provide a framework for robust and reliable design and verification
November - 2014
- Analog Signal Conditioning for Accurate Measurements
Q: Should I put some sort of circuit between my sensor and an analog-to-digital converter?
A: Yes. You probably need some signal conditioning. The explanation below goes on for a bit, but stay with it and you'll understand what you need and why you need it.
- USB 3.1: Evolution and Revolution
USB-IF Worldwide Developers Days introduced developers to the new USB 3.1 specification. This white paper digs deep into 10G USB 3.1 to clarify the evolutionary and revolutionary changes in the specification.
September - 2014
- Determining an Effective Analog Sampling Rate
Q: How often should my equipment make measurements? A: This question often arises when people draft plans to automatically measure a physical quantity such as temperature, pressure, acidity, liquid level, and so on. You can approach this problem in several ways, from an educated guess to a mathematical analysis of your system. The examples that follow use temperature measurements because people measure temperature more than any other physical characteristic.
- 7 Key Considerations For Effective Chip-Package Thermal Co-Design
Chip-package co-design is important for several reasons. Designing a large high power die, e.g. a System-on-Chip (SoC) without considering how to get the heat out is likely to lead
- 7 Essential Cabinet Design Considerations for Protecting 19" Electronics
This white paper, written by Vlad Konopelko, Product Marketing Manager, North America, for Pentair’s Schroff brand, introduces seven essential mechanical structure and protection standards and design considerations for specifying a reliable 19” electronics cabinet solution for non-IT applications
August - 2014
- Frameworks optimize analysis and visualization of medical imaging
Each advancement in medical imaging enables significant improvements in the quality and efficiency of diagnostics and therapy. The challenge: Each advancement requires significant computing performance gains to allow medical image data to be measured and analyzed. And once this massive amount of digital data has been created, it needs to be visualized too – including even stereoscopic 3D in real-time.
- Next generation retail and digital signage solutions
Comprehensive display and computer-on-module system solutions In the highly competitive retail industry, innovative technologies can help improve the coordination of the supply
- How-To Guide: Building a Rugged COM Express System
direct download HowtoCOMExpress_8400794 [company]
July - 2014
- Ultra Low-Power 9D Sensor Fusion Implementation: A Case Study
Today, the ability to track the orientation or position of a device is a common feature in many portable and wearable products. Computing the orientation is a non-trivial task that
June - 2014
- 10 Tips for Streamlining PCB Thermal Design… A High-Level ‘How To’ Guide
Many aspects of a PCB’s performance are determined during detailed design. Thermal issues with the PCB design are largely ‘locked in’ during the component (i.e. chip package)
- 10 Tips for Predicting Component Temperatures… A High-Level ‘How To’ Guide
Recently, physics-based reliability prediction has related electronic assembly failure rates to the rate and magnitude of temperature change over an operational cycle, both of which are influenced by steady-state operating temperature. Whether the intention is to increase reliability, or improve performance, accurate prediction of component temperatures helps meet design goals.
- 12 Key Considerations in Enclosure Thermal Design… A High-Level ‘How To’ Guide
A natural focus when designing electronics products are, well the electronics. The electronics itself however, needs to work within some kind of enclosure, and must be designed with the enclosure in mind. Cooling is a system issue, which is why we advocate a top-down approach, starting at the enclosure level.
- 11 Top Tips for Energy-Efficient Data Center Design and Operation… A High-Level ‘How To’ Guide
Data center power load (and therefore heat dissipation) footprints continue to rise in response to growing demand for information storage and transfer. Cooling constitutes a major cost in the operation of a data center which has led to increased focus on minimizing energy use in data centers.
May - 2014
- Overcoming Advanced Signaling Integrity Issues in High-Speed Systems
As signaling rates continue to increase, maintaining signal integrity has become a much greater challenge for developers. Migrating a system to a next-generation interface operating at 5, 8, 10, or 12 Gbps brings with it increased sensitivity to attenuation and jitter that can severely curtail reach and reliability.
- Reduce Metastability by Using a User Grey Cell™ Methodology for IP and FPGA Clock Domain Crossing Analysis
This paper introduces a novel technique for Intellectual Property (IP) and FPGA clock domain crossing (CDC) analysis using Blue Pearl’s User Grey Cell™ methodology rather than the traditional Black Box methodology.
- The truth about knowing your False Paths
ASIC and & FPGAs have many false paths that implementation tools attempt to optimize to make timing goals. Adding false path constraints frees up the synthesis tool to work only on necessary paths. Blue Pearl automates false path generation that can be run after design changes
- Power Solutions for Wearable Technology and Internet of Everything Devices
The number of Wearable Technology and Internet of Everything devices is projected to be in the billions over the next 10 years. Primary batteries that must be discarded are not the right powering solution. New solid state batteries that are charged using Energy Harvesting or Wireless Charging will be used.
March - 2014
- Disruptive New Serial-Interface; Intelligent Memory Architecture Jumps 100/400GbE Performance Wall
Packet processor design teams face increasingly difficult challenges as they seek to provide their network equipment manufacturers with state-of-the-art devices. The interrelated system-level trade-offs include performance, pin count, and area, and are all ultimately limited by power consumption considerations. To successfully compete, network chip vendors must consider end-to-end solutions for system architects and developers. In turn, as OEMs introduce multi-terabit systems, they must aggregate multiple 100 Gbps ports on each line card or risk falling behind the performance curve.
- Windows CE Development for RISC Computers Made Easy
Windows CE (a.k.a. Windows Embedded Compact), originally released in 1996, can be an attractive alternative to the full Windows operating system offering system designers the ability to control power, size, and cost in a new product. For example, the runtime license cost of the CE operating system alone can save as much as $150 over the license cost for standard Windows. Additionally, the componentized nature of CE is recognized as more stable and reliable than the Windows for desktop machines.
February - 2014
- Increasing Precision in Diagnostic Equipment
Precision is at the heart of every diagnostic device. The precision of a system is the degree to which the system will consistently provide the same result given the same operating conditions. Precision is crucial – whether a system is a complex magnetic resonance imaging (MRI) sensor, an embedded tire pressure sensor, or a low-cost blood glucose meter – because it serves as the foundation for both accuracy and reliability. For example, if a meter’s readings between two equivalent samples vary significantly, it will be difficult for the system to determine an appropriate response.
- Consolidating Systems for Reduced Cost & Complexity in the Factory
Using virtualization to host multiple discrete workloads on a single computing device is an important trend in manufacturing today, leading to reduced cost and complexity in the factory environment. This white paper describes the benefits of system consolidation along with the technical requirements for implementation. Read now to learn more.
- New! Free Download: Updated Pentek SDR Handbook
Before we look at SDR and its various implementations in embedded systems, we’ll review a theorem fundamental to sampled data systems such as those encountered in Software-Defined Radios.
November - 2013
- Free MythBuster – Extended Temperature Embedded Computers
The “extended temperature” designation theoretically assures that an embedded computer will perform reliably in extreme temperature environments. But how do you know for sure? Are there commercial grade components being used on the board? Is the board 100% tested? Download this MythBuster paper to learn how to find a truly reliable solution for your embedded computing needs.
- Providing Optimal Storage Solutions for Embedded Computing
High-speed signal processing systems that utilize stored streaming data are among the applications driving the demand for an unprecedented amount of storage capacity. Data-intensive ISR, situational awareness, sonar and airborne monitoring as well as non-defense applications place significant demands on storage systems. These same embedded applications also frequently require high bandwidth access as well as data encryption, fast erasure and write protection.
September - 2013
- Avoiding an Energy Storage Crisis: The 8 Key Advantages of Solid State Batteries
Unique Solid State Rechargeable Batteries are being used by Medical, Industrial Control, Consumer Electronics, Appliance and Smart Energy companies to power their new innovative electronic product designs. These batteries have capabilities that are superior to legacy energy storage devices such as coin cell batteries and supercapacitors. This white paper identifies the product requirements and technical specifications that are addressed by Cymbet EnerChip smart rechargeable solid state batteries.
- RF Design is Easy – Just Let Someone Else Do It
If you’re not designing Wi-Fi (802.11) into your systems already, you’ll be doing so very soon. Wi-Fi is rapidly establishing itself as the standard wireless connection for industrial devices. But there no need to start from scratch. This article will describe some of the ways in which vendors can serve as your 802.11 firmware and hardware development partners, and how they can save you time, money and trouble while doing so.
- Make Smart Phones Smarter
As tablets and smart phones become more ubiquitous in the corporate and M2M business world, connecting to older technologies – especially serial ports -- has become a bit more complicated. This article will describe the ways in which embedded AP modules can solve the problem by creating small, self-sustaining Wi-Fi network around your equipment. This doesn’t change the way the your existing devices are used, it just makes them easily accessible to tablets and phones.