September - 2014
- 7 Key Considerations For Effective Chip-Package Thermal Co-Design
Chip-package co-design is important for several reasons. Designing a large high power die, e.g. a System-on-Chip (SoC) without considering how to get the heat out is likely to lead
- 7 Essential Cabinet Design Considerations for Protecting 19" Electronics
The latest advancements in electro-‐mechanical technologies, coupled with stringent compliance and compatibility requirements, allow for the development and deployment of high-‐performance
August - 2014
- Frameworks optimize analysis and visualization of medical imaging
Developing backend systems for medical imaging Each advancement in medical imaging enables significant improvements in the quality and efficiency of diagnostics and therapy. The
- Next generation retail and digital signage solutions
Comprehensive display and computer-on-module system solutions In the highly competitive retail industry, innovative technologies can help improve the coordination of the supply
- How-To Guide: Building a Rugged COM Express System
For high-performance small form factor processing in harsh conditions, Acromag offers the flexible COM Express® platform of products. See how simplifying your system design using this modular solution minimizes costs and development time. Extended operating temperatures and advanced thermal management make this rugged system ideal for defense and industrial applications.
July - 2014
- Ultra Low-Power 9D Sensor Fusion Implementation: A Case Study
Today, the ability to track the orientation or position of a device is a common feature in many portable and wearable products. Computing the orientation is a non-trivial task that converts inputs from multiple motion sensors into accurate position information. This computation is called sensor fusion and it eliminates inaccuracies from noisy sensor inputs. This paper shows how using DesignWare® ARC® Processor EXtension (APEX) technology improves cycle count and energy consumption for a power-efficient implementation of a 9D fusion algorithm on an IP subsystem.
June - 2014
- 10 Tips for Streamlining PCB Thermal Design… A High-Level ‘How To’ Guide
Many aspects of a PCB’s performance are determined during detailed design. Thermal issues with the PCB design are largely ‘locked in’ during the component (i.e. chip package)
- 10 Tips for Predicting Component Temperatures… A High-Level ‘How To’ Guide
Recently, physics-based reliability prediction has related electronic assembly failure rates to the rate and magnitude of temperature change over an operational cycle, both of which are influenced by steady-state operating temperature. Whether the intention is to increase reliability, or improve performance, accurate prediction of component temperatures helps meet design goals.
- 12 Key Considerations in Enclosure Thermal Design… A High-Level ‘How To’ Guide
A natural focus when designing electronics products are, well the electronics. The electronics itself however, needs to work within some kind of enclosure, and must be designed with the enclosure in mind. Cooling is a system issue, which is why we advocate a top-down approach, starting at the enclosure level.
- 11 Top Tips for Energy-Efficient Data Center Design and Operation… A High-Level ‘How To’ Guide
Data center power load (and therefore heat dissipation) footprints continue to rise in response to growing demand for information storage and transfer. Cooling constitutes a major cost in the operation of a data center which has led to increased focus on minimizing energy use in data centers.
May - 2014
- Overcoming Advanced Signaling Integrity Issues in High-Speed Systems
As signaling rates continue to increase, maintaining signal integrity has become a much greater challenge for developers. Migrating a system to a next-generation interface operating at 5, 8, 10, or 12 Gbps brings with it increased sensitivity to attenuation and jitter that can severely curtail reach and reliability.
- Reduce Metastability by Using a User Grey Cell™ Methodology for IP and FPGA Clock Domain Crossing Analysis
This paper introduces a novel technique for Intellectual Property (IP) and FPGA clock domain crossing (CDC) analysis using Blue Pearl’s User Grey Cell™ methodology rather than the traditional Black Box methodology.
- The truth about knowing your False Paths
ASIC and & FPGAs have many false paths that implementation tools attempt to optimize to make timing goals. Adding false path constraints frees up the synthesis tool to work only on necessary paths. Blue Pearl automates false path generation that can be run after design changes
- COM Express ™ module for demanding data processing and imaging applications
For demanding digital signage and retail applications, MSC Technologies offers the MSC C6B-8S module family based on 4th generation Intel® Core™ processors with extremely high computing power, graphics, and video performance. The platform is based on quad-core and dual-core Intel® Core™ processors and the Intel® 8-Series platform controller hub QM87.
- Power Solutions for Wearable Technology and Internet of Everything Devices
The number of Wearable Technology and Internet of Everything devices is projected to be in the billions over the next 10 years. Primary batteries that must be discarded are not the right powering solution. New solid state batteries that are charged using Energy Harvesting or Wireless Charging will be used.
April - 2014
- Beyond the Code: How Designers and Programmers Can Work Together to Deliver Successful GUIs for Embedded Systems
Tuukka Turunen, Director of R&D, Digia, Qt, looks at the requirements for user interface design in embedded systems, provides suggestions for anyone tasked with developing advanced GUIs, and explains how building bridges between designers and programmers is one of the keys to successful implementation.
- FPGAs for Speed and Flexibility
Learn about FPGA-based system design for embedded computing I/O signal processing applications. We discuss how advanced Xilinx Virtex and Altera Stratix FPGAs make use of multiple digital clock managers and simultaneous parallel execution to rapidly compute a set of integrated processes including FFT, SERDES, FIFO management, logic sequencing, DDR control, and more.
March - 2014
- Disruptive New Serial-Interface; Intelligent Memory Architecture Jumps 100/400GbE Performance Wall
Packet processor design teams face increasingly difficult challenges as they seek to provide their network equipment manufacturers with state-of-the-art devices. The interrelated system-level trade-offs include performance, pin count, and area, and are all ultimately limited by power consumption considerations. To successfully compete, network chip vendors must consider end-to-end solutions for system architects and developers. In turn, as OEMs introduce multi-terabit systems, they must aggregate multiple 100 Gbps ports on each line card or risk falling behind the performance curve.
- Windows CE Development for RISC Computers Made Easy
Windows CE (a.k.a. Windows Embedded Compact), originally released in 1996, can be an attractive alternative to the full Windows operating system offering system designers the ability to control power, size, and cost in a new product. For example, the runtime license cost of the CE operating system alone can save as much as $150 over the license cost for standard Windows. Additionally, the componentized nature of CE is recognized as more stable and reliable than the Windows for desktop machines.
February - 2014
- Increasing Precision in Diagnostic Equipment
Precision is at the heart of every diagnostic device. The precision of a system is the degree to which the system will consistently provide the same result given the same operating conditions. Precision is crucial – whether a system is a complex magnetic resonance imaging (MRI) sensor, an embedded tire pressure sensor, or a low-cost blood glucose meter – because it serves as the foundation for both accuracy and reliability. For example, if a meter’s readings between two equivalent samples vary significantly, it will be difficult for the system to determine an appropriate response.
- Consolidating Systems for Reduced Cost & Complexity in the Factory
Using virtualization to host multiple discrete workloads on a single computing device is an important trend in manufacturing today, leading to reduced cost and complexity in the factory environment. This white paper describes the benefits of system consolidation along with the technical requirements for implementation. Read now to learn more.
- New! Free Download: Updated Pentek SDR Handbook
Before we look at SDR and its various implementations in embedded systems, we’ll review a theorem fundamental to sampled data systems such as those encountered in Software-Defined Radios.
November - 2013
- Free MythBuster – Extended Temperature Embedded Computers
The “extended temperature” designation theoretically assures that an embedded computer will perform reliably in extreme temperature environments. But how do you know for sure? Are there commercial grade components being used on the board? Is the board 100% tested? Download this MythBuster paper to learn how to find a truly reliable solution for your embedded computing needs.
- Providing Optimal Storage Solutions for Embedded Computing
High-speed signal processing systems that utilize stored streaming data are among the applications driving the demand for an unprecedented amount of storage capacity. Data-intensive ISR, situational awareness, sonar and airborne monitoring as well as non-defense applications place significant demands on storage systems. These same embedded applications also frequently require high bandwidth access as well as data encryption, fast erasure and write protection.
September - 2013
- Avoiding an Energy Storage Crisis: The 8 Key Advantages of Solid State Batteries
Unique Solid State Rechargeable Batteries are being used by Medical, Industrial Control, Consumer Electronics, Appliance and Smart Energy companies to power their new innovative electronic product designs. These batteries have capabilities that are superior to legacy energy storage devices such as coin cell batteries and supercapacitors. This white paper identifies the product requirements and technical specifications that are addressed by Cymbet EnerChip smart rechargeable solid state batteries.
- RF Design is Easy – Just Let Someone Else Do It
If you’re not designing Wi-Fi (802.11) into your systems already, you’ll be doing so very soon. Wi-Fi is rapidly establishing itself as the standard wireless connection for industrial devices. But there no need to start from scratch. This article will describe some of the ways in which vendors can serve as your 802.11 firmware and hardware development partners, and how they can save you time, money and trouble while doing so.
- Make Smart Phones Smarter
As tablets and smart phones become more ubiquitous in the corporate and M2M business world, connecting to older technologies – especially serial ports -- has become a bit more complicated. This article will describe the ways in which embedded AP modules can solve the problem by creating small, self-sustaining Wi-Fi network around your equipment. This doesn’t change the way the your existing devices are used, it just makes them easily accessible to tablets and phones.
- Six Considerations for Successful Wireless Connectivity
Steady improvements in wireless technology are allowing more and more devices to establish wireless connectivity with the same reliability that has already been achieved with cable communications. Better still, it is becoming possible to make these kinds of connections in increasingly difficult environments and with legacy equipment. This article will describe some of the techniques you can use to make those connections seamless.
August - 2013
- An FPGA Approach to Implementing Time-Critical Functions in Multi-Sensor Mobile Designs
An FPGA Approach to Implementing Time-Critical Functions in Multi-Sensor Mobile Designs.
- High Density Digital Signal Processing with ATCA
Traditional methods of digital signal processing in military and aerospace applications have used specialized FPGAs, multiprocessor VME or OpenVPX solutions. Advances in microprocessor technology and accompanying software could mean that AdvancedTCA® (ATCA®) has the potential to replace some of those expensive highly specialized elements in complex signal processing applications.