May - 2013
- Achieving DO-178C Compliance
DO-178C is the how-to manual for complying with Title 14 Code of Federal Regulations (14 CFR), which outlines the software development requirements for FAA approval. This paper focuses on specific processes, such as verification and validation activities, traceability, testing methods, and test environments described in DO-178C.
April - 2013
- Introduction to VPX Technology
What is VPX? VPX (VITA 46) is the next generation of ruggedized compact embedded systems. VPX expands the possible bandwidth, compared to traditional VME systems, by replacing the parallel bus with high speed serial busses. In this white paper, we discuss the serial interconnects, profiles, protocols, and more.
January - 2013
- Rugged GPGPUs for UAV Synthetic Aperture RADAR (SAR)
Small light-weight UAV SAR have always been a compromise between size, weight, and power, with capability and real-time actionable intelligence. Traditional digital signal processing technologies processing capability struggles to meet small light weight UAV SAR mission requirements in a timely fashion. Rugged COTS GPGPU boards with their impressive processing capability will disrupt the traditional methods of creating and designing SARs for light-weight UAVs.
November - 2012
- Kontron announces next-generation digital signage kit to help streamline development and deployment of intelligent signage systems
Streamline intelligent digital signage development with the DSEK-12 evaluation kit from Kontron. The next-generation DSEK-12 is a powerful resource for retail, transportation and medical companies that are looking to implement digital signage as an influential new vehicle to interact with customers and gain valuable consumer information in real time. Download the DSEK-12 whitepaper to learn how designers can easily use this advanced, cost-effective, pre-validated and future-proof solution that features the latest display and graphics technologies.
October - 2012
- Optimizing LTE deployments for increased penetration into niche markets
The Aricent EPC-Lite software with the Adax Application Ready Platform provides a low-footprint LTE mobility platform with support for 200,000 simultaneous attached subscribers and data throughput of up to 260,000 packets per second per blade/server. Read more in this white paper provided by Adax and Aricent.
- Connecting Peripherals to an Android Platform
This white paper will describe some of the options for connecting peripheral accessories to Android OS based tablets/phones. The main focus will be the use of the Android Open Accessory Initiative.
September - 2012
- Kintex 7 FPGA family: High Performance DDR3 memory throughput achieved by optimization of the memory controller
Taking full advantage of the performances of the 7 Series FPGAs can be done by using the high speed memory controller from Barco Silex, which has been reworked to achieve the highest frequency and efficiency.
- The 3rd Generation Intel® Core™ Processor: A must have for all high-performance embedded computing appliances
Satisfying market demands for ever-increasing power savings and performance gains, Kontron offers a broad selection of 3rd Generation IntelÂ® Coreâ¢ processor-based embedded computing platforms. These platforms allow OEMs to streamline development of compute- and graphic-intensive applications leveraging the latest technologies in standardized, scalable form factors. Download Kontronâs whitepaper today to find out about Intelâs architecture advancements. Learn how to integrate Kontronâs seven new application-ready platforms that are highly-effective design building blocks that speed time-to-market.
- Visual Processing in Rugged Environments
Complex visual processing is becoming an important part of rugged industrial applications. Automated Optical Inspection (AOI) of manufacturing lines, Infrared Thermography (IRT) in oil refineries, and traffic safety enforcement are some examples of the ways image and video processing improve quality, efficiency, and safety. However, visual computing in rugged environments has its challenges. Most applications are resource-intensive and include extensive 2D and 3D graphics processing. Tough environmental conditions require fanless designs that limit power and present thermal dissipation challenges. Customers are also pushing for smaller sizes and lower costs.
August - 2012
- Automated Target Tracking
This paper explores the ramifications of real-time autonomous vehicle performance in cluttered environments. It analyzes the gap between the predictable and the unpredictable, introduces real object tracing, explores the benefits and pitfalls of real-time moving object tracking and introduces possible solutions for uninterrupted operation of autonomous vehicles.
July - 2012
- Improved Graphics Performance Changes the Cost Equation in Digital Signage
The quality and flexibility of digital signage is a function of the graphics processing capability of the media players that drive the displays. To deliver a high level of graphics performance, media players tend to incorporate discrete graphics processing units, although some players use the graphics engine on the CPU platform. Discover how 3rd Generation IntelÂ® Coreâ¢ processors provide retailers improved graphics performance and anonymous video analytics to deliver audience messaging at lower cost and watt.
June - 2012
- Enea Element®: Simplify Distributed Systems with Frameworks from Enea Element
Distributed systems range from simple multi-threaded applications to multi-slot chassis-based systems to networked clusters of servers. Topologies get more complex when these systems move into cloud-based environments, and more diverse when they involve machine-to-machine (or M2M) solutions. Providers of distributed system software solutions face a number of challenges in building, debugging and maintaining a set of connected applications. Managing these systems requires powerful modeling and a variety of management interfaces to meet a diverse set of needs. The services provided by a distributed system often require a high level of availability. The middleware frameworks that make up Enea Element address many of these challenges.
- How to Choose the Right Sensor for Your Measurement System
You can choose from many different sensors on the market today to measure all types of natural phenomena. This National Instruments white paper categorizes and compares the most common sensors for measuring seven of these phenomena to help you choose the best option for your application.
- Redefining RF and Microwave Instrumentation Through Open Software and Modular Hardware
National Instruments uses multicore processors, user-programmable FPGAs, the high-throughput PCI Express system bus in PXI, and LabVIEW graphical system design software to address the business and technology challenges of high-frequency test and measurement. Read the white paper.
- Adding Video Analytics to Analog Surveillance
Video surveillance today is in the midst of a paradigm shift. Gone are the days of security staff watching fuzzy images on closed circuit TV (CCTV). Instead, high-resolution Internet protocol (IP) cameras are improving video quality and enabling new applications like video content analytics. And with hybrid NVR, usersâ will be able to preserve their investment in analog cameras by being able to receive, process and record signals from both analog and newer IP cameras.
May - 2012
- Write Assist in Low-Voltage SRAMs
Write assist techniques are now commonly used to lower the minimum operating voltage (Vmin) of an SRAM. One of the key reasons to push the SRAM Vmin lower is to enable efficient Dynamic Voltage and Frequency Scaling (DVFS) to save power. In this paper, we discuss the basics of SRAM faliure mechanisms, fundamentals of write assist techniques, ARMÂ® ArtisanÂ® Low Voltage Memory Compilers with the write assist feature and results from GLOBALFOUNDRIES 28nm-SLP memories.
- VPX for High-Performance Avionic Computers
Traditional high-performance computing platforms are limited by the connection bandwidth and latency between the multiple computing elements needed to achieve the performance targets. For the embedded market, the difficulty is compounded by the demanding environmental requirements. The VPX standard resolves this limitation with a large number of high-throughput point-to-point connections between the processing elements in a rugged mechanical structure.
- OpenVPX System Bandwidth: A comparison of 10Gb Ethernet Performance, Serial Rapid IO, and InfiniBand
This paper compares the bandwidth available to two common types of dataflow for systems based on the VITA 65 CEN16 central switched topology, using three different fabrics â Serial RapidIO (SRIO), 10 Gigabit Ethernet (10GbE), and Double Data Rate InfiniBand (DDR IB).
- Xilinx 7 Series FPGAs: The Logical Advantage
Configurable logic tiles are the fundamental building blocks of all programmable digital electronic systems. Ever since Xilinx invented the FPGA in the 1980s, configurable logic, in the form of look-up tables and registers, has been an essential component of digital electronics systems across all markets and applications. This white paper describes the features of the configurable logic block in the 28 nm Xilinx 7 series FPGAs, highlighting advantages over previous Xilinx FPGAs and the benefits that these changes bring to the digital design engineer.
- Lowering Power at 28 nm with Xilinx 7 Series FPGAs
This white paper describes several aspects of power related to the XilinxÂ® 28 nm 7 series FPGAs, including the TSMC 28 nm high-k metal gate (HKMG), high performance, low power (28 nm HPL or 28 HPL) process choice. The power benefits afforded by the 28 HPL process and its usefulness across Xilinx's full product offerings is described as well as the architectural innovations and features for power reduction across the dimensions of static power, dynamic power, and I/O power.
- Maximize System Performance Using Xilinx Based AXI4 Interconnects
Key strategic design decisions made early in the development cycle often have far-reaching impact on the overall results achieved with the final design. Xilinx offers many product solutions with single and multiple on-chip processing elements, such as multiple MicroBlazeâ¢ processors or ARMÂ® Cortexâ¢-A9 processors, DMA engines, communications, video, and DSP IP. Evaluation Kits and Targeted Design Platforms are available to serve both as sample system designs and as advanced FPGA development platforms for the underlying FPGA selection.
- Xilinx Next Generation 28nm FPGA Technology Overview
Xilinx has chosen 28 nm high-metal gate (HKMG) high performance, low-power process technology and combined it with a new unified ASMBLâ¢ architecture to create a new generation of FPGAs that offer lower power and higher performance. This white paper describes the challenges the semiconductor industry faces in addressing market requirements and describes how these can be solved with the right 28 nm process technology. The breakthrough combination of a high performance, low-power process with architectural innovations makes new 28 nm FPGAs well suited for power sensitive applications, bandwidth-intensive, and ultra-high end applications.
April - 2012
- Carrier Grade Edition 6
A CGL compliant, high performance, high availability carrier grade Linux designed for next generation multi-core network architectures.…
February - 2012
- LTE-Advanced Signal Generation and Measurement Using SystemVue
LTE-Advanced is specified as part of Release 10 of the 3GPP specifications and is now approved for 4G IMT-Advanced. This application note introduces key LTE-Advanced techniques, as well as how to use the Agilent SystemVue W1918 LTE-Advanced library to generate various downlink (DL) orthogonal frequencydivision multiple access (OFDMA) and uplink (UL) clustered DFT-spread-OFDM (DFT-S-OFDM) signal sources with MIMO, and to measure closed-loop throughput.
This application note also introduces LTE-Advanced enhancements to the MIMO channel models, which are available as simulation model set called the W1715 SystemVue MIMO channel builder. This optional model set facilitates simulation-based MIMO over-the-air (OTA) testing using real, observed antenna patterns and standard MIMO fading models, and overcomes a key challenge for 8-layer MIMO system analysis and verification.
- DSP Applications to Reap Benefits from Inclusion of AVX in Processors
DSP processing heavy lifting traditionally has been done by DSP chips and FPGAs, but these solutions and others created their own power consumption and development programming burdens. DSP Applications to Reap Benefits from Inclusion of AVX in Processors looks at how the inclusion of AVX technology in each core of the Intel 2nd Generation Core i7 processor eliminates the SWaP issues of previous DSP solutions while allowing developers to work within a familiar programming environment.
January - 2012
- High-Speed, Real-Time Recording Systems Handbook
This handbook provides an understanding of some key concepts required to build a high-speed, real-time recording system .In todayâs world of high-speed A/D converters operating in the gigahertz range, real-time signal recording has become a challenging task that requires specialized hardware and intelligent application software. The system developer has to consider the limitations presented by the recorderâs operating and file systems, the limitations of disk drive technology, the hardware interfaces, and the RAID controller technology.
October - 2011
- Low-Power Processors: When Performance Matters
This white paper takes a fresh look at the performance of low-power x86 CPUs, now that VIA has introduced dual-core and quad-core CPUs.
- Bridge the Gap between AdvancedTCA and MicroTCA
Enhanced MicroTCA.4 specification bridges the gap between AdvancedTCA and MicroTCA. Learn how to integrate up to 40GbE high performance networking into the aggregation layer and boost your applicationsâ performance while minimizing hardware costs.
- Improving Proximity and Touch Interfaces: Capacitive Sensors with Auto-Calibration
Human interfaces that use capacitive sensors for proximity or touch control are changing the way we interact with electronics.
- Digital Video Drives the Design of Next-Generation Personal Computing Devices
Five Trends that Affect IC Designers, ODMs, and OEMsâand What They Can Do About Them.