Tundra Semiconductor Announces Interoperability of Tundra’s Scalable Serial RapidIO(R) Switch with Texas Instruments New High Performance DSP



Serial RapidIO Switch and DSP Combination, Now Enables High Performance Broadband Systems

DALLAS, TX and OTTAWA, ON, March 7 /PRNewswire-FirstCall/ — Tundra Semiconductor
Corporation (TSX:TUN), the leader in System Interconnect, today announced the
interoperability of Tundra’s Tsi578(TM) Serial RapidIO(R) Switch with Texas Instruments
recently announced TMS320TCI6487 and TMS320TCI6488 wireless infrastructure optimized
DSPs.

Using the Tundra Tsi578 Serial RapidIO development platform, Tundra and Texas
Instruments recently completed interoperability testing. The successful tests prove that
Tundra’s third generation Serial RapidIO switch, with multi-cast capability, and Texas
Instrument’s 3-core, 3GHz DSPs can be deployed to develop DSP clusters, aggregated with
Serial RapidIO switching. This combination is ideally suited for high data intensive
applications such as WiMAX, 3G, LTE, TD-SCDMA and WiBRO. These types of applications
require multiple DSPs on a single channel card and the Tsi578 switch is uniquely suited to
interconnect the high bandwidth-capable DSPs. Delivering this combined solution will
enable base station manufacturers to achieve optimal performance of their platform while
spanning a wide range of air interfaces.

“Some of our wireless infrastructure customers have begun designing this high
performance combination of industry-leading products, thereby enabling their
next-generation RapidIO-based systems to meet the OFDM processing and Turbo Decode
requirements,” said Daniel Hoste, President and Chief Executive Officer at Tundra. “The
Tundra/TI solution offers the power and configurability that designers of embedded
solutions need to build reliable, high performance RapidIO-based systems for a wide range
of scalable and high bandwidth applications”.

“The TCI6487 and TCI6488 DSPs deliver maximum performance with a significantly reduced
bill of materials,” said Travis Scheckel, TI’s RapidIO Development Manager and Chair of
the RapidIO Technical Working Group. “Interoperability testing such as this effort gives
base station manufacturers a measure of confidence that their solution will meet the
carriers’ needs in a timely fashion, while delivering higher performance, greater
scalability and low power.”

Texas Instruments announced availability of the TCI6487 in December 2006, the newest
3GHz-performing wireless infrastructure baseband product that boosts applications for
GSM-based base stations while addressing new markets and requirements for WiMAX and
TD-SCDMA. TI also announced the availability of TCI6488 in February 2007 for the WCDMA
market, integrating a Receiver Accelerator Co-Processor. Both products support three cores
running at 1GHz each. The TCI6487 and TCI6488 processors enable base station manufacturers
to extend their existing designs while entering into new markets, requiring small form
factor applications with an exceptional scaleable, flexible solution.

In February 2006, Tundra launched the Tsi578 Serial RapidIO Switch with multicast
capability, responding to designers’ requirement for low interconnect processing overhead,
lowest power consumption, minimum latency as well as board layout with high signal
integrity. The Tsi578 supports the 1.3 RapidIO specification, and its broad feature set
includes; field proven port flexibility which supports mixed port widths at up to 10 Gbps
data speeds, hardware multicast, supervised traffic flow for increased performance and
fabric management, and enhanced SerDes for the lowest power switch solution available in
the market today.

About Tundra RapidIO(R) Switches

Tundra switches provide chip-to-chip interconnect between RapidIO end-points and can
replace existing proprietary backplane fabrics for board-to-board interconnect. As a
founding member of the RapidIO Trade Association and long-time Steering Committee member,
Tundra continues to provide leadership in the development of the RapidIO standard and was
the first semiconductor vendor to bring Parallel and Serial RapidIO switches to market.
RapidIO is the leading serial interconnect standard for embedded systems and is supported
by industry leaders such as, Alcatel- Lucent Technologies, AMCC, EMC Corporation,
Ericsson, and Freescale Semiconductor . The Tundra family of RapidIO switches includes the
Tsi578(TM), Tsi576(TM), Tsi574(TM), Tsi568A(TM), and Tsi564A(TM).

About Texas Instruments DSP Baseband Solution

TI’s TCI6487 offers three-times the performance of previous infrastructure solutions,
providing greater channel enhancement and more flexibility while reducing design
complexity for OEMs. Manufactured in 65nm process node, this new DSP is the highest
performing processor in TI’s TMS320C64x(TM) DSP family. As a result, carriers will be able
to deploy advanced networks quickly while future proofing their investments. The ability
to upgrade performance with software enhancements also enables service providers to
support emerging standards such as LTE, 3GPP and 3GPP+, while easily adding new features
and services to their networks. This, in turn, will provide subscribers access to the
latest and greatest services and capabilities that the wireless world can deliver.

About Tundra

Tundra Semiconductor Corporation (TSX:TUN) supplies the world’s leading communications, computing and storage companies with smart System Interconnect products and design services backed by world-class customer service and technical support. Tundra’s track record of product leadership includes over a decade of bridges and switches enabling key industry standards: RapidIO(R), PCI, PCI-X, PCI Express(R), PowerPC(R), VME, HyperTransport(TM), Interlaken, and SPI4.2. Tundra’s products deliver high functional quality and simplified board design and layout, with specific focus on system level signal integrity. Tundra’s design services division, Silicon Logic Engineering, Inc., offers industry-leading ASIC and FPGA design services, semiconductor intellectual property and product development consulting. Tundra’s smart technology connects critical components in high performance embedded systems around the world. For more information, please visit www.tundra.com.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and Analog technologies to meet our customers’ real world signal processing requirements. In addition to Semiconductor, the company includes the Education Technology business. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries. Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com.

Contact Information

Tundra Semiconductor

603 March Road
Ottawa, Ontario, K2K 2M5
Canada

tele: 613.592.0714
toll-free: 800.267.7231
fax: 613.592.1320
sales@tundra.com
www.tundra.com

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